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Contents

README

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IRF7820TRPBF

Infineon Technologies · MOSFETs · SOIC-8

IRF7820TRPBF from Infineon Technologies, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the N-channel HEXFET (200V VDS max, 20V VGS max); the integral body diode runs between source and drain.
2 S passive Source terminal of the N-channel HEXFET (200V VDS max, 20V VGS max); the integral body diode runs between source and drain.
3 S passive Source terminal of the N-channel HEXFET (200V VDS max, 20V VGS max); the integral body diode runs between source and drain.
4 G input Gate terminal; VGS is limited to ±20V per the absolute maximum ratings.
5 D passive Drain terminal; VDS is rated to 200V maximum.
6 D passive Drain terminal; VDS is rated to 200V maximum.
7 D passive Drain terminal; VDS is rated to 200V maximum.
8 D passive Drain terminal; VDS is rated to 200V maximum.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOIC-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDS 200 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 3.7 A TA = 25°C, VGS @ 10V 1
Continuous Drain Current ID 2.9 A TA = 70°C, VGS @ 10V 1
Pulsed Drain Current IDM 29 A 1
Power Dissipation PD 2.5 W TA = 25°C 1
Power Dissipation PD 1.6 W TA = 70°C 1
Linear Derating Factor 0.02 W/°C 1
Operating Junction Temperature Range TJ -55 150 °C 1
Storage Temperature Range TSTG -55 150 °C 1
Junction-to-Drain Lead Thermal Resistance RJL 20 °C/W 1
Junction-to-Ambient Thermal Resistance RJA 50 °C/W 1
Drain-to-Source Breakdown Voltage BVDSS 200 V VGS = 0V, ID = 250μA 2
Static Drain-to-Source On-Resistance RDS(on) 62.5 78 mΩ VGS = 10V, ID = 2.2A 2
Gate Threshold Voltage VGS(th) 3 4 5 V VDS = VGS, ID = 100μA 2
Drain-to-Source Leakage Current IDSS 20 μA VDS = 200V, VGS = 0V 2
Drain-to-Source Leakage Current IDSS 250 μA VDS = 200V, VGS = 0V, TJ = 125°C 2
Gate-to-Source Forward Leakage IGSS 100 nA VGS = 20V 2
Gate-to-Source Reverse Leakage IGSS -100 nA VGS = -20V 2
Forward Transconductance gfs 5 S VDS = 50V, ID = 2.2A 2
Total Gate Charge Qg 29 44 nC ID = 2.2A, VDS = 100V, VGS = 10V 2
Continuous Source Current (Body Diode) IS 1.5 A 2
Pulsed Source Current (Body Diode) ISM 29 A 2
Diode Forward Voltage VSD 1.3 V TJ = 25°C, IS = 2.2A, VGS = 0V 2
Reverse Recovery Time trr 33 50 ns TJ = 25°C, IF = 2.2A, VDD = 100V, di/dt = 500A/μs 2
Reverse Recovery Charge Qrr 213 320 nC TJ = 25°C, IF = 2.2A, VDD = 100V, di/dt = 500A/μs 2
Single Pulse Avalanche Energy EAS 606 mJ Starting TJ = 25°C, L = 155mH, RG = 50, IAS = 2.8A 2
Avalanche Current IAR 2.8 A Repetitive rating; pulse width limited by max. junction temperature 2

CAD (KiCad official)

  • Symbol: IRF7820TRPBF
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: irf7820trpbf-etched.step / irf7820trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irf7820trpbf.step / irf7820trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (9 pp, sha256 0050d35a5db7f36d, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF