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Contents

README

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IRF7490TRPBF

Infineon Technologies · MOSFETs · SO-8

IRF7490TRPBF from Infineon Technologies, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S passive Source terminal of the N-channel HEXFET power MOSFET, rated for a 100 V drain-source voltage (VDSS) with ±20 V gate-to-source (VGS).
2 S passive Source terminal of the N-channel HEXFET power MOSFET, rated for a 100 V drain-source voltage (VDSS) with ±20 V gate-to-source (VGS).
3 S passive Source terminal of the N-channel HEXFET power MOSFET, rated for a 100 V drain-source voltage (VDSS) with ±20 V gate-to-source (VGS).
4 G input Gate terminal of the MOSFET, with a gate-to-source voltage rating of ±20 V.
5 D passive Drain terminal of the MOSFET, rated for 100 V drain-source voltage; 5.4 A continuous drain current at TA = 25°C.
6 D passive Drain terminal of the MOSFET, rated for 100 V drain-source voltage; 5.4 A continuous drain current at TA = 25°C.
7 D passive Drain terminal of the MOSFET, rated for 100 V drain-source voltage; 5.4 A continuous drain current at TA = 25°C.
8 D passive Drain terminal of the MOSFET, rated for 100 V drain-source voltage; 5.4 A continuous drain current at TA = 25°C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SO-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDS 100 V 1
Gate-to-Source Voltage VGS -20 20 V 1
Continuous Drain Current ID 5.4 A TA = 25°C, VGS @ 10V 1
Continuous Drain Current ID 4.3 A TA = 70°C, VGS @ 10V 1
Pulsed Drain Current IDM 43 A 1
Maximum Power Dissipation PD 2.5 W TA = 25°C 1
Maximum Power Dissipation PD 1.6 W TA = 70°C 1
Linear Derating Factor 20 mW/°C 1
Operating Junction and Storage Temperature Range TJ -55 150 °C 1
Soldering Temperature 300 °C for 10 seconds (1.6mm from case) 1
Junction-to-Drain Lead Thermal Resistance RθJL 20 °C/W 1
Junction-to-Ambient Thermal Resistance RθJA 50 °C/W 1
Forward Transconductance gfs 8 S VDS = 50V, ID = 3.2A 2
Total Gate Charge Qg 37 56 nC ID = 3.2A 2
Single Pulse Avalanche Energy EAS 91 mJ 2
Avalanche Current IAR 3.2 A 2
Continuous Source Current (Body Diode) IS 2.3 A 2
Pulsed Source Current (Body Diode) ISM 43 A 2
Diode Forward Voltage VSD 1.3 V TJ = 25°C, IS = 3.2A, VGS = 0V 2
Reverse Recovery Time trr 67 100 ns TJ = 25°C, IF = 3.2A 2
Reverse Recovery Charge Qrr 220 330 nC di/dt = 100A/µs 2
Drain-to-Source Breakdown Voltage V(BR)DSS 100 V VGS = 0V, ID = 250µA 2
Static Drain-to-Source On-Resistance RDS(on) 33 39 mΩ VGS = 10V, ID = 3.2A 2
Gate Threshold Voltage VGS(th) 2 4 V VDS = VGS, ID = 250µA 2
Drain-to-Source Leakage Current IDSS 20 µA VDS = 100V, VGS = 0V 2
Drain-to-Source Leakage Current IDSS 250 µA VDS = 80V, VGS = 0V, TJ = 125°C 2
Gate-to-Source Forward Leakage Current IGSS 200 nA VGS = 20V 2
Gate-to-Source Reverse Leakage Current IGSS -200 nA VGS = -20V 2

CAD (KiCad official)

  • Symbol: IRF7490TRPBF
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: irf7490trpbf-etched.step / irf7490trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irf7490trpbf.step / irf7490trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (9 pp, sha256 41138846c39fd3dd, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF