component
IRF7401TRPBF-VB
Public Made by Adomby adom
VBsemi Elec MOSFETs, SO-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
main
IRF7401TRPBF-VB
VBsemi Elec · MOSFETs · SO-8
IRF7401TRPBF-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source terminal of the N-channel MOSFET; continuous source-drain diode current IS is 2.7 A at TC = 25 °C. |
| 2 | S | passive | Source terminal of the N-channel MOSFET; continuous source-drain diode current IS is 2.7 A at TC = 25 °C. |
| 3 | S | passive | Source terminal of the N-channel MOSFET; continuous source-drain diode current IS is 2.7 A at TC = 25 °C. |
| 4 | G | input | Gate terminal of the N-channel MOSFET; gate-source voltage is rated at ±20 V. |
| 5 | D | passive | Drain terminal of the N-channel MOSFET; drain-source voltage is rated at 30 V. |
| 6 | D | passive | Drain terminal of the N-channel MOSFET; drain-source voltage is rated at 30 V. |
| 7 | D | passive | Drain terminal of the N-channel MOSFET; drain-source voltage is rated at 30 V. |
| 8 | D | passive | Drain terminal of the N-channel MOSFET; drain-source voltage is rated at 30 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SO-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 30 | V | TA = 25 °C | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | 1 | ||
| Continuous Drain Current | ID | 6.8 | A | TJ = 150 °C, TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | 5 | A | TJ = 150 °C, TC = 70 °C | 1 | ||
| Continuous Drain Current | ID | 6.5 | A | TA = 25 °C (note b, c) | 1 | ||
| Continuous Drain Current | ID | 4.9 | A | TA = 70 °C (note b, c) | 1 | ||
| Pulsed Drain Current | IDM | 30 | A | 1 | |||
| Continuous Source-Drain Diode Current | IS | 2.7 | A | TC = 25 °C | 1 | ||
| Continuous Source-Drain Diode Current | IS | 1.7 | A | TA = 25 °C (note b, c) | 1 | ||
| Maximum Power Dissipation | PD | 4.1 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 2.6 | W | TC = 70 °C | 1 | ||
| Maximum Power Dissipation | PD | 2 | W | TA = 25 °C (note b, c) | 1 | ||
| Maximum Power Dissipation | PD | 1.25 | W | TA = 70 °C (note b, c) | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 150 | °C | 1 | ||
| Maximum Junction-to-Ambient | RthJA | 45 | 62.5 | °C/W | t ≤ 5 s (note b, d) | 1 | |
| Maximum Junction-to-Ambient, steady state | RthJA | 110 | °C/W | Steady State (value given in note d) | 1 | ||
| Maximum Junction-to-Foot | RthJF | 25 | 30 | °C/W | Steady State | 1 | |
| Drain-Source Breakdown Voltage | 30 | V | VGS = 0 V, ID = 250 µA | 2 | |||
| Gate-Source Threshold Voltage | VGS(th) | 1 | 3 | V | VDS = VGS, ID = 250 µA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ±20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | µA | VDS = 30 V, VGS = 0 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 10 | µA | VDS = 30 V, VGS = 0 V, TJ = 55 °C | 2 | ||
| On-State Drain Current | ID(on) | 20 | A | VDS ≥ 5 V, VGS = 10 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.016 | Ω | VGS = 10 V, ID = 5 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.029 | Ω | VGS = 4.5 V, ID = 4 A | 2 | ||
| Forward Transconductance | gfs | 24 | S | VDS = 10 V, ID = 5 A | 2 | ||
| Input Capacitance | Ciss | 1295 | pF | VDS = 15 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 170 | pF | VDS = 15 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Reverse Transfer Capacitance | Crss | 72 | pF | VDS = 15 V, VGS = 0 V, f = 1 MHz | 2 | ||
| Total Gate Charge | Qg | 21.8 | 33 | nC | VDS = 15 V, VGS = 10 V, ID = 5 A | 2 | |
| Total Gate Charge | Qg | 9.2 | 14 | nC | VDS = 15 V, VGS = 4.5 V, ID = 5 A | 2 | |
| Gate-Source Charge | Qgs | 3.8 | nC | 2 | |||
| Gate-Drain Charge | Qgd | 2.5 | nC | 2 | |||
| Gate Resistance | Rg | 2.4 | Ω | f = 1 MHz | 2 | ||
| Turn-On Delay Time | td(on) | 21 | 40 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 14 | 25 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 20 | 40 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 9 | 18 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω | 2 | |
| Turn-On Delay Time | td(on) | 10 | 20 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Rise Time | tr | 8 | 16 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Turn-Off Delay Time | td(off) | 21 | 35 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 8 | 16 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Continuous Source-Drain Diode Current | IS | 2.7 | A | TC = 25 °C | 2 | ||
| Pulse Diode Forward Current | ISM | 30 | A | 2 | |||
| Body Diode Voltage | VSD | 0.77 | 1.2 | V | IS = 1.7 A, VGS = 0 V | 2 | |
| Body Diode Reverse Recovery Time | trr | 21 | 40 | ns | IF = 3 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Body Diode Reverse Recovery Charge | Qrr | 15 | 30 | nC | IF = 3 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 | |
| Reverse Recovery Fall Time | ta | 13 | ns | 2 | |||
| Reverse Recovery Rise Time | tb | 8 | ns | 2 | |||
| Drain-Source Breakdown Voltage Temperature Coefficient | ΔVDS/TJ | 33 | mV/°C | ID = 250 µA | 2 | ||
| Gate-Source Threshold Voltage Temperature Coefficient | ΔVGS(th)/TJ | -6.2 | 2 |
CAD (KiCad official)
- Symbol:
IRF7401TRPBF-VB - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files:
irf7401trpbf-vb-etched.step/irf7401trpbf-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);irf7401trpbf-vb.step/irf7401trpbf-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (9 pp, sha256
fca247fe313255bb, retrieved 2026-11-05, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# IRF7401TRPBF-VB
**VBsemi Elec** · MOSFETs · SO-8
IRF7401TRPBF-VB from VBsemi Elec, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source terminal of the N-channel MOSFET; continuous source-drain diode current IS is 2.7 A at TC = 25 °C. |
| 2 | S | passive | Source terminal of the N-channel MOSFET; continuous source-drain diode current IS is 2.7 A at TC = 25 °C. |
| 3 | S | passive | Source terminal of the N-channel MOSFET; continuous source-drain diode current IS is 2.7 A at TC = 25 °C. |
| 4 | G | input | Gate terminal of the N-channel MOSFET; gate-source voltage is rated at ±20 V. |
| 5 | D | passive | Drain terminal of the N-channel MOSFET; drain-source voltage is rated at 30 V. |
| 6 | D | passive | Drain terminal of the N-channel MOSFET; drain-source voltage is rated at 30 V. |
| 7 | D | passive | Drain terminal of the N-channel MOSFET; drain-source voltage is rated at 30 V. |
| 8 | D | passive | Drain terminal of the N-channel MOSFET; drain-source voltage is rated at 30 V. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | SO-8 |
| Category | Transistors/Thyristors |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | | | 30 | V | TA = 25 °C | 1 |
| Gate-Source Voltage | VGS | -20 | | 20 | V | | 1 |
| Continuous Drain Current | ID | | | 6.8 | A | TJ = 150 °C, TC = 25 °C | 1 |
| Continuous Drain Current | ID | | | 5 | A | TJ = 150 °C, TC = 70 °C | 1 |
| Continuous Drain Current | ID | | | 6.5 | A | TA = 25 °C (note b, c) | 1 |
| Continuous Drain Current | ID | | | 4.9 | A | TA = 70 °C (note b, c) | 1 |
| Pulsed Drain Current | IDM | | | 30 | A | | 1 |
| Continuous Source-Drain Diode Current | IS | | | 2.7 | A | TC = 25 °C | 1 |
| Continuous Source-Drain Diode Current | IS | | | 1.7 | A | TA = 25 °C (note b, c) | 1 |
| Maximum Power Dissipation | PD | | | 4.1 | W | TC = 25 °C | 1 |
| Maximum Power Dissipation | PD | | | 2.6 | W | TC = 70 °C | 1 |
| Maximum Power Dissipation | PD | | | 2 | W | TA = 25 °C (note b, c) | 1 |
| Maximum Power Dissipation | PD | | | 1.25 | W | TA = 70 °C (note b, c) | 1 |
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | | 150 | °C | | 1 |
| Maximum Junction-to-Ambient | RthJA | | 45 | 62.5 | °C/W | t ≤ 5 s (note b, d) | 1 |
| Maximum Junction-to-Ambient, steady state | RthJA | | | 110 | °C/W | Steady State (value given in note d) | 1 |
| Maximum Junction-to-Foot | RthJF | | 25 | 30 | °C/W | Steady State | 1 |
| Drain-Source Breakdown Voltage | | 30 | | | V | VGS = 0 V, ID = 250 µA | 2 |
| Gate-Source Threshold Voltage | VGS(th) | 1 | | 3 | V | VDS = VGS, ID = 250 µA | 2 |
| Gate-Source Leakage | IGSS | -100 | | 100 | nA | VDS = 0 V, VGS = ±20 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | µA | VDS = 30 V, VGS = 0 V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 10 | µA | VDS = 30 V, VGS = 0 V, TJ = 55 °C | 2 |
| On-State Drain Current | ID(on) | 20 | | | A | VDS ≥ 5 V, VGS = 10 V | 2 |
| Drain-Source On-State Resistance | RDS(on) | | | 0.016 | Ω | VGS = 10 V, ID = 5 A | 2 |
| Drain-Source On-State Resistance | RDS(on) | | | 0.029 | Ω | VGS = 4.5 V, ID = 4 A | 2 |
| Forward Transconductance | gfs | | 24 | | S | VDS = 10 V, ID = 5 A | 2 |
| Input Capacitance | Ciss | | 1295 | | pF | VDS = 15 V, VGS = 0 V, f = 1 MHz | 2 |
| Output Capacitance | Coss | | 170 | | pF | VDS = 15 V, VGS = 0 V, f = 1 MHz | 2 |
| Reverse Transfer Capacitance | Crss | | 72 | | pF | VDS = 15 V, VGS = 0 V, f = 1 MHz | 2 |
| Total Gate Charge | Qg | | 21.8 | 33 | nC | VDS = 15 V, VGS = 10 V, ID = 5 A | 2 |
| Total Gate Charge | Qg | | 9.2 | 14 | nC | VDS = 15 V, VGS = 4.5 V, ID = 5 A | 2 |
| Gate-Source Charge | Qgs | | 3.8 | | nC | | 2 |
| Gate-Drain Charge | Qgd | | 2.5 | | nC | | 2 |
| Gate Resistance | Rg | | 2.4 | | Ω | f = 1 MHz | 2 |
| Turn-On Delay Time | td(on) | | 21 | 40 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω | 2 |
| Rise Time | tr | | 14 | 25 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 20 | 40 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω | 2 |
| Fall Time | tf | | 9 | 18 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 4.5 V, Rg = 1 Ω | 2 |
| Turn-On Delay Time | td(on) | | 10 | 20 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Rise Time | tr | | 8 | 16 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Turn-Off Delay Time | td(off) | | 21 | 35 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Fall Time | tf | | 8 | 16 | ns | VDD = 15 V, RL = 3 Ω, ID ≅ 5 A, VGEN = 10 V, Rg = 1 Ω | 2 |
| Continuous Source-Drain Diode Current | IS | | | 2.7 | A | TC = 25 °C | 2 |
| Pulse Diode Forward Current | ISM | | | 30 | A | | 2 |
| Body Diode Voltage | VSD | | 0.77 | 1.2 | V | IS = 1.7 A, VGS = 0 V | 2 |
| Body Diode Reverse Recovery Time | trr | | 21 | 40 | ns | IF = 3 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 |
| Body Diode Reverse Recovery Charge | Qrr | | 15 | 30 | nC | IF = 3 A, dI/dt = 100 A/µs, TJ = 25 °C | 2 |
| Reverse Recovery Fall Time | ta | | 13 | | ns | | 2 |
| Reverse Recovery Rise Time | tb | | 8 | | ns | | 2 |
| Drain-Source Breakdown Voltage Temperature Coefficient | ΔVDS/TJ | | 33 | | mV/°C | ID = 250 µA | 2 |
| Gate-Source Threshold Voltage Temperature Coefficient | ΔVGS(th)/TJ | | -6.2 | | | | 2 |
## CAD (KiCad official)
- Symbol: `IRF7401TRPBF-VB`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files: `irf7401trpbf-vb-etched.step` / `irf7401trpbf-vb-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `irf7401trpbf-vb.step` / `irf7401trpbf-vb.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [VBsemi Elec datasheet](docs/irf7401trpbf-vb-datasheet.pdf) (9 pp, sha256 `fca247fe313255bb`, retrieved 2026-11-05, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/irf7401trpbf-vb-datasheet.pdf)