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Contents

README

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IRF7351PBF-HXY

HXY MOSFET · MOSFETs · SOP-8

IRF7351PBF-HXY from HXY MOSFET, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of MOSFET 1 (N-channel), with VDS rated 60 V and continuous drain current 15 A.
2 G1 input Gate of MOSFET 1, with gate-source voltage rated ±20 V and threshold 1.0 to 2.5 V.
3 S2 passive Source of MOSFET 2 (N-channel), with VDS rated 60 V and continuous drain current 15 A.
4 G2 input Gate of MOSFET 2, with gate-source voltage rated ±20 V and threshold 1.0 to 2.5 V.
5 D2 passive Drain of MOSFET 2, tied internally with pin 6, with VDS rated 60 V.
6 D2 passive Drain of MOSFET 2, tied internally with pin 5, with VDS rated 60 V.
7 D1 passive Drain of MOSFET 1, tied internally with pin 8, with VDS rated 60 V.
8 D1 passive Drain of MOSFET 1, tied internally with pin 7, with VDS rated 60 V.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 60 V VGS=0V, ID=250μA 2
Zero Gate Voltage Drain Current IDSS 1 μA VDS=60V, VGS=0V 2
Gate to Body Leakage Current IGSS -100 100 nA VDS=0V, VGS=±20V 2
Gate Threshold Voltage VGS(th) 1 1.6 2.5 V VDS=VGS, ID=250μA 2
Static Drain-Source On-Resistance RDS(on) 12 15 mΩ VGS=10V, ID=20A 2
Static Drain-Source On-Resistance RDS(on) 15 20 mΩ VGS=4.5V, ID=10A 2
Maximum Continuous Drain to Source Diode Forward Current IS 15 A 2
Maximum Pulsed Drain to Source Diode Forward Current ISM 180 A 2
Drain to Source Diode Forward Voltage VSD 1.2 V VGS=0V, IS=30A 2
Drain source voltage VDS 60 V TA=25℃ 1
Gate source voltage VGS -20 20 V TA=25℃ 1
Continuous drain current ID 15 A TA=25℃ 1
Pulsed drain current ID, pulse 180 A TA=25℃ 1
Power dissipation PD 60 W TA=25℃ 1
Operation and storage temperature Tstg, Tj -55 150 ℃ 1
Thermal resistance, junction-case RθJC 2.5 °C/W 1
Input Capacitance Ciss 930 pF VDS=25V, VGS=0V, f=1.0MHz 2
Output Capacitance Coss 230 pF VDS=25V, VGS=0V, f=1.0MHz 2
Reverse Transfer Capacitance Crss 8 pF VDS=25V, VGS=0V, f=1.0MHz 2
Total Gate Charge Qg 22 nC VDS=30V, ID=20A, VGS=10V 2
Gate-Source Charge Qgs 4.5 nC VDS=30V, ID=20A, VGS=10V 2
Gate-Drain Charge Qgd 3.5 nC VDS=30V, ID=20A, VGS=10V 2
Turn-on Delay Time td(on) 4.5 ns VDD=30V, ID=20A, RG=1.6Ω, VGS=10V 2
Turn-on Rise Time tr 2.7 ns VDD=30V, ID=20A, RG=1.6Ω, VGS=10V 2
Turn-off Delay Time td(off) 13.8 ns VDD=30V, ID=20A, RG=1.6Ω, VGS=10V 2
Turn-off Fall Time tf 2.7 ns VDD=30V, ID=20A, RG=1.6Ω, VGS=10V 2
Body Diode Reverse Recovery Time trr 18 ns TJ=25℃, IF=20A, dI/dt=100A/μs 2
Body Diode Reverse Recovery Charge Qrr 12 nC TJ=25℃, IF=20A, dI/dt=100A/μs 2

CAD (KiCad official)

  • Symbol: IRF7351PBF-HXY
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: irf7351pbf-hxy-etched.step / irf7351pbf-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irf7351pbf-hxy.step / irf7351pbf-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (6 pp, sha256 d3d7ad9b3d55a629, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF