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IRF7324TRPBF

Infineon Technologies · MOSFETs · SO-8

IRF7324TRPBF from Infineon Technologies, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source of P-channel MOSFET 1; MOSFET 1 is rated for -20V drain-source and -9.0A continuous drain current at TA = 25°C.
2 G1 input Gate of P-channel MOSFET 1; gate-to-source voltage is limited to ±12V.
3 S2 passive Source of P-channel MOSFET 2; MOSFET 2 is rated for -20V drain-source and -9.0A continuous drain current at TA = 25°C.
4 G2 input Gate of P-channel MOSFET 2; gate-to-source voltage is limited to ±12V.
5 D2 passive Drain of P-channel MOSFET 2 (joined with pin 6); drain-source voltage rated to -20V and pulsed drain current to -71A.
6 D2 passive Drain of P-channel MOSFET 2 (joined with pin 5); drain-source voltage rated to -20V and pulsed drain current to -71A.
7 D1 passive Drain of P-channel MOSFET 1 (joined with pin 8); drain-source voltage rated to -20V and pulsed drain current to -71A.
8 D1 passive Drain of P-channel MOSFET 1 (joined with pin 7); drain-source voltage rated to -20V and pulsed drain current to -71A.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SO-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-to-Source Voltage VDS -20 V 1
Continuous Drain Current, TA = 25°C ID -9 A VGS @ -4.5V 1
Continuous Drain Current, TA = 70°C ID -7.1 A VGS @ -4.5V 1
Pulsed Drain Current IDM -71 A 1
Maximum Power Dissipation, TA = 25°C PD 2 W 1
Maximum Power Dissipation, TA = 70°C PD 1.3 W 1
Linear Derating Factor 16 mW/°C 1
Gate-to-Source Voltage VGS -12 12 V 1
Junction and Storage Temperature Range TJ, TSTG -55 150 °C 1
Maximum Junction-to-Ambient Thermal Resistance RθJA 62.5 °C/W 1
Diode Forward Voltage VSD -1.2 V TJ = 25°C, IS = -2.0A, VGS = 0V 2
Reverse Recovery Time trr 180 270 ns TJ = 25°C, IF = -2.0A 2
Reverse Recovery Charge Qrr 300 450 nC di/dt = -100A/µs 2
Drain-to-Source Breakdown Voltage V(BR)DSS -20 V VGS = 0V, ID = -250µA 2
Static Drain-to-Source On-Resistance RDS(on) 0.018 Ω VGS = -4.5V, ID = -9.0A 2
Static Drain-to-Source On-Resistance RDS(on) 0.026 Ω VGS = -2.5V, ID = -7.7A 2
Gate Threshold Voltage VGS(th) -0.45 -1 V VDS = VGS, ID = -250µA 2
Forward Transconductance gfs 19 S VDS = -10V, ID = -9.0A 2
Drain-to-Source Leakage Current IDSS -1 VDS = -16V, VGS = 0V 2
Drain-to-Source Leakage Current, TJ = 125°C IDSS -25 VDS = -16V, VGS = 0V, TJ = 125°C 2
Gate-to-Source Forward Leakage -100 VGS = -12V 2
Gate-to-Source Reverse Leakage 100 VGS = 12V 2
Total Gate Charge Qg 42 63 nC ID = -9.0A 2
Gate-to-Source Charge Qgs 7.1 11 nC VDS = -16V 2
Gate-to-Drain (Miller) Charge Qgd 12 18 nC VGS = -5.0V 2
Continuous Source Current (Body Diode) IS 2 2
Pulsed Source Current (Body Diode) ISM -71 2

CAD (KiCad official)

  • Symbol: IRF7324TRPBF
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SO-8 (KiCad packages3D, STEP)
  • 3D model files: irf7324trpbf-etched.step / irf7324trpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irf7324trpbf.step / irf7324trpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (8 pp, sha256 2a6baa0cad8d40cd, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF