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Contents

README

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IRF7319TR

UMW · MOSFETs · SOP-8

IRF7319TR from UMW, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 S1 passive Source terminal of the first MOSFET channel; the device is rated VDS 30V for the N-channel and -30V for the P-channel.
2 G1 input Gate terminal of the first MOSFET channel; VGS is rated ±20V for both channels.
3 S2 passive Source terminal of the second MOSFET channel; the device is rated VDS 30V for the N-channel and -30V for the P-channel.
4 G2 input Gate terminal of the second MOSFET channel; VGS is rated ±20V for both channels.
5 D2 passive Drain terminal of the second MOSFET channel, tied to pin 6 on the package.
6 D2 passive Drain terminal of the second MOSFET channel, tied to pin 5 on the package.
7 D1 passive Drain terminal of the first MOSFET channel, tied to pin 8 on the package.
8 D1 passive Drain terminal of the first MOSFET channel, tied to pin 7 on the package.

Key specifications

Parameter Value
Manufacturer UMW
Package SOP-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage (N-Channel) VDS 30 V 2
Drain-Source Voltage (P-Channel) VDS -30 V 2
Gate-Source Voltage (N-Channel and P-Channel) VGS -20 20 V 2
Continuous Drain Current (N-Channel) ID 6.5 A TA= 25°C 2
Continuous Drain Current (P-Channel) ID -4.9 A TA= 25°C 2
Continuous Drain Current (N-Channel) ID 5.2 A TA=70°C 2
Continuous Drain Current (P-Channel) ID -3.9 A TA=70°C 2
Pulsed Drain Current (N-Channel) IDM 30 A 2
Pulsed Drain Current (P-Channel) IDM -30 A 2
Continuous Source Current (Diode Conduction) (N-Channel) IS 2.5 A 2
Continuous Source Current (Diode Conduction) (P-Channel) IS -2.5 A 2
Single Pulse Avalanche Energy (N-Channel) EAS 82 mJ 2
Single Pulse Avalanche Energy (P-Channel) EAS 140 mJ 2
Avalanche Current (N-Channel) IAR 4 A 2
Avalanche Current (P-Channel) IAR -2.8 A 2
Repetitive Avalanche Energy (N-Channel) EAR 0.2 mJ 2
Peak Diode Recovery dv/dt (N-Channel) dv/dt 5 V/ns Note ②: N-Channel ISD≤4A, di/dt≤74A/μs, VDD≤V(BR)DSS, TJ≤150°C 2
Peak Diode Recovery dv/dt (P-Channel) dv/dt -5 V/ns Note ②: P-Channel ISD≤-2.8A, di/dt≤150A/μs, VDD≤V(BR)DSS, TJ≤150°C 2
Junction and Storage Temperature Range TJ, TSTG -55 150 °C 2
Maximum Power Dissipation PD 2 W TA= 25°C 2
Maximum Power Dissipation PD 1.3 W TA=70°C 2
Maximum Junction-to-Ambient RθJA 62.5 °C/W Note ⑤: surface mounted on FR-4 board, t≤10 sec 2
Drain-to-Source Breakdown Voltage (N-Channel) V(BR)DSS 30 V ID=250µA, VGS=0V 3
Drain-to-Source Breakdown Voltage (P-Channel) V(BR)DSS -30 V ID=-250µA, VGS=0V 3
Gate Threshold Voltage (N-Channel) VGS(th) 1 V VDS=VGS, ID=250μA 3
Gate Threshold Voltage (P-Channel) VGS(th) -1 V VDS=VGS, ID=-250μA 3
Forward Transconductance (N-Channel) gfs 14 S VDS=15V, ID=5.8A 3
Forward Transconductance (P-Channel) gfs 7.7 S VDS=-15V, ID=-4.9A 3
Drain-to-Source Leakage Current (N-Channel) IDSS 1 µA VDS=24V, VGS=0V 3
Drain-to-Source Leakage Current (P-Channel) IDSS -1 µA VDS=-24V, VGS=0V 3
Drain-to-Source Leakage Current (N-Channel) IDSS 25 µA VDS=24V, VGS=0V, TJ=55°C 3
Drain-to-Source Leakage Current (P-Channel) IDSS -25 µA VDS=-24V, VGS=0V, TJ=55°C 3
Gate-to-Source Forward Leakage Current IGSS -100 100 nA VGS=±20V 3
Turn-Off Delay Time (N-Channel) tD(off) 26 39 ns 4
Turn-Off Delay Time (P-Channel) tD(off) 34 51 ns P-Ch: VDD=-15A, ID=-1A, RG=6Ω, RD=15Ω 4
Fall Time (N-Channel) tf 17 26 ns 4
Fall Time (P-Channel) tf 32 48 ns P-Ch: VDD=-15A, ID=-1A, RG=6Ω, RD=15Ω 4
Diode Forward Voltage (N-Channel) VSD 0.78 1 V TJ=25°C, IS=1.7A,VGS=0V 4
Diode Forward Voltage (P-Channel) VSD -0.78 -1 V TJ=25°C, IS=-1.7A,VGS=0V 4
Reverse Recovery Time (N-Channel) trr 45 68 ns N-Ch: TJ=25°C, IF=1.7A, di/dt=100A/µs 4
Reverse Recovery Time (P-Channel) trr 44 66 ns P-Ch: TJ=25°C, IF=-1.7A, di/dt=100A/µs 4
Reverse Recovery Charge (N-Channel) Qrr 58 87 nC N-Ch: TJ=25°C, IF=1.7A, di/dt=100A/µs 4
Reverse Recovery Charge (P-Channel) Qrr 42 63 nC P-Ch: TJ=25°C, IF=-1.7A, di/dt=100A/µs 4
Pulsed Source Current (Body Diode) (N-Channel) ISM 30 A Note ①: repetitive rating; pulse width limited by max. junction temperature 4
Pulsed Source Current (Body Diode) (P-Channel) ISM -30 A Note ①: repetitive rating; pulse width limited by max. junction temperature 4

CAD (KiCad official)

  • Symbol: IRF7319TR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: irf7319tr-etched.step / irf7319tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irf7319tr.step / irf7319tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: UMW datasheet (11 pp, sha256 84ae1600aff30f8e, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF