Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

IRF100P218

Infineon Technologies · MOSFETs · TO-247-3

IRF100P218 from Infineon Technologies, in a TO-247-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the MOSFET; the gate-source voltage VGS is rated from -20 V to 20 V.
2 Drain passive Drain terminal of the MOSFET; continuous drain current is rated at 209 A (package limited) and 483 A (silicon limited) at TC=25°C.
3 Source passive Source terminal of the MOSFET and reference for the gate-source voltage VGS.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-247-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous drain current (VGS=10V, TC=25°C) ID 209 A VGS=10V,TC=25°C 3
Continuous drain current (silicon limited) ID 483 A VGS=10V,TC=25°C (silicon limited) 3
Continuous drain current (silicon limited, TC=100°C) ID 341 A VGS=10V,TC=100°C (silicon limited) 3
Pulsed drain current ID,pulse 836 A TC=25°C 3
Avalanche energy, single pulse EAS 1050 mJ ID=100A,RGS=50Ω 3
Gate source voltage VGS -20 20 V 3
Power dissipation (TC=25°C) Ptot 556 W TC=25°C 3
Power dissipation (TA=25°C) Ptot 3.8 W TA=25°C,RTHJA=40°C/W 3
Operating and storage temperature Tj,Tstg -55 175 °C IEC climatic category; DIN IEC 68-1: 55/175/56 3
Thermal resistance, junction-case RthJC 0.27 °C/W 3
Thermal resistance, junction-ambient RthJA 40 °C/W 3
Thermal resistance, case-to-sink, flat greased surface RthCS 0.24 °C/W 3
Drain-source breakdown voltage V(BR)DSS 100 V VGS=0V,ID=1mA 4
Gate threshold voltage VGS(th) 2.2 3.8 V VDS=VGS,ID=278µA 4
Zero gate voltage drain current (Tj=25°C) IDSS 5 µA VDS=100V,VGS=0V,Tj=25°C 4
Zero gate voltage drain current (Tj=125°C) IDSS 100 µA VDS=100V,VGS=0V,Tj=125°C 4
Gate-source leakage current IGSS 100 nA VGS=20V,VDS=0V 4
Drain-source on-state resistance (VGS=10V) RDS(on) 1.1 1.28 mΩ VGS=10V,ID=100A 4
Drain-source on-state resistance (VGS=6V) RDS(on) 1.3 1.5 mΩ VGS=6V,ID=50A 4
Gate charge total Qg 330 412 nC VDD=50V,ID=100A,VGS=0to10V 5
Diode continuous forward current IS 209 A TC=25°C 5
Diode pulse current IS,pulse 836 A TC=25°C 5
Diode forward voltage VSD 1.2 V VGS=0V,IF=100A,Tj=25°C 5

CAD (KiCad official)

  • Symbol: IRF100P218
  • Footprint: Package_TO_SOT_THT:TO-247-3_Vertical
  • 3D model: TO-247-3 (KiCad packages3D, STEP)
  • 3D model files: irf100p218-etched.step / irf100p218-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); irf100p218.step / irf100p218.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (11 pp, sha256 ccdac6e5b1222893, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF