component
IR21364STRPBF
Public Made by Adomby adom
Infineon Technologies Gate Drive ICs, SOIC-28-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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IR21364STRPBF
Infineon Technologies · Gate Drive ICs · SOIC-28-300mil
IR21364STRPBF from Infineon Technologies, in a SOIC-28-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Low side supply voltage, recommended 11.5 V to 20 V (absolute max 25 V). |
| 2 | HIN1 | input | Logic input for high side gate driver output HO1, in phase; 3.3 V logic compatible. |
| 3 | HIN2 | input | Logic input for high side gate driver output HO2, in phase; 3.3 V logic compatible. |
| 4 | HIN3 | input | Logic input for high side gate driver output HO3, in phase; 3.3 V logic compatible. |
| 5 | LIN1 | input | Logic input for low side gate driver output LO1, in phase; 3.3 V logic compatible. |
| 6 | LIN2 | input | Logic input for low side gate driver output LO2, in phase; 3.3 V logic compatible. |
| 7 | LIN3 | input | Logic input for low side gate driver output LO3, in phase; 3.3 V logic compatible. |
| 8 | FAULT | output | Active-low open-drain output indicating an over-current (ITRIP) or low-side undervoltage lockout has occurred. |
| 9 | ITRIP | input | Analog input for overcurrent shutdown that turns off all outputs and activates FAULT and RCIN low; threshold typically 0.46 V. |
| 10 | EN | input | Positive-logic enable input; I/O logic functions when EN is high, with no effect on FAULT and not latched. |
| 11 | RCIN | input | External RC network input that sets the FAULT clear delay tFLTCLR of about R*C; FAULT releases when RCIN exceeds 8 V. |
| 12 | VSS | power_in | Logic ground. |
| 13 | COM | power_in | Low side gate drivers return. |
| 14 | LO3 | output | Low side gate driver output for phase 3. |
| 15 | LO2 | output | Low side gate driver output for phase 2. |
| 16 | LO1 | output | Low side gate driver output for phase 1. |
| 17 | NC | unconnected | No pin is drawn at this position in the package drawing (removed lead). |
| 18 | VS3 | passive | High voltage floating supply return for phase 3, up to 600 V offset. |
| 19 | HO3 | output | High side gate driver output for phase 3. |
| 20 | VB3 | power_in | High side floating supply for phase 3, VS3 +11.5 V to VS3 +20 V. |
| 21 | NC | unconnected | No pin is drawn at this position in the package drawing (removed lead). |
| 22 | VS2 | passive | High voltage floating supply return for phase 2, up to 600 V offset. |
| 23 | HO2 | output | High side gate driver output for phase 2. |
| 24 | VB2 | power_in | High side floating supply for phase 2, VS2 +11.5 V to VS2 +20 V. |
| 25 | NC | unconnected | No pin is drawn at this position in the package drawing (removed lead). |
| 26 | VS1 | passive | High voltage floating supply return for phase 1, up to 600 V offset. |
| 27 | HO1 | output | High side gate driver output for phase 1. |
| 28 | VB1 | power_in | High side floating supply for phase 1, VS1 +11.5 V to VS1 +20 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | SOIC-28-300mil |
| Category | Power Management ICs |
| Pins | 28 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| High side floating supply voltage | VB | -0.3 | 625 | V | 3 | ||
| Low side and logic fixed supply voltage | VCC | -0.3 | 25 | V | 3 | ||
| Allowable offset voltage slew rate | dV/dt | 50 | V/ns | 3 | |||
| Package power dissipation (28 lead SOIC) | PD | 1.6 | W | TA ≤ +25 °C | 3 | ||
| Thermal resistance, junction to ambient (28 lead SOIC) | RthJA | 78 | °C/W | 3 | |||
| Junction temperature | TJ | 150 | °C | 3 | |||
| Storage temperature | TS | -55 | 150 | °C | 3 | ||
| Lead temperature (soldering, 10 seconds) | TL | 300 | °C | 3 | |||
| High side floating supply voltage (VS1,2,3) | VS | 600 | V | Note 1 | 3 | ||
| Low side supply voltage | VCC | 11.5 | 20 | V | IR21364 | 3 | |
| Low side output voltage | VLO1,2,3 | 0 | V | max printed as VCC | 3 | ||
| Logic ground | VSS | -5 | 5 | V | 3 | ||
| Ambient temperature | TA | -40 | 125 | °C | 3 | ||
| Logic "0" input voltage | VIH | 0.8 | V | 4 | |||
| Logic "1" input voltage | VIL | 2.5 | V | 4 | |||
| Enable positive going threshold | VEN,TH+ | 2.5 | V | 4 | |||
| Enable negative going threshold | VEN,TH- | 0.8 | V | 4 | |||
| ITRIP positive going threshold | VIT,TH+ | 0.37 | 0.46 | 0.55 | V | 4 | |
| High level output voltage, VBIAS - VO | VOH | 0.9 | 1.4 | V | Io = 20 mA | 4 | |
| Low level output voltage, VO | VOL | 0.4 | 0.6 | V | Io = 20 mA | 4 | |
| VCC supply undervoltage positive going threshold | VCCUV+ | 9.6 | 10.4 | 11.2 | V | IR21364 | 4 |
| VCC supply undervoltage negative going threshold | VCCUV- | 8.6 | 9.4 | 10.2 | V | IR21364 | 4 |
| VBS supply undervoltage positive going threshold | VBSUV+ | 9.6 | 10.4 | 11.2 | V | IR21364 | 4 |
| VBS supply undervoltage negative going threshold | VBSUV- | 8.6 | 9.4 | 10.2 | V | IR21364 | 4 |
| Offset supply leakage current | llk | 50 | µA | VB = VS = 600 V | 4 | ||
| Quiescent VBS supply current | IQBS | 70 | 120 | µA | VB1,2,3 = VS1,2,3 = 600 V | 4 | |
| Quiescent VCC supply current | IQCC | 0.6 | 1.3 | mA | VIN = 0 V or 5 V | 4 | |
| Input bias current (LOUT = HI) | ILIN+ | 100 | 195 | µA | VLIN = 3.3 V | 4 | |
| Input bias current (LOUT = LO) | ILIN- | -1 | µA | VLIN = 0 V | 4 | ||
| Input bias current (HOUT = HI) | IHIN+ | 100 | 195 | µA | VHIN = 3.3 V | 4 | |
| Input bias current (HOUT = LO) | IHIN- | -1 | µA | VHIN = 0 V | 4 | ||
| "High" ITRIP input bias current | IITRIP+ | 3.3 | 6 | µA | VITRIP = 3.3 V | 4 | |
| "Low" ITRIP input bias current | IITRIP- | -1 | µA | VITRIP = 0 V | 4 | ||
| "Low" ENABLE input bias current | IEN- | -1 | µA | VEN = 0 V | 4 | ||
| RCIN input bias current | IRCIN | 1 | µA | Vrcin = 0 V or 15 V | 4 | ||
| Output high short circuit pulsed current | Io+ | 120 | 200 | mA | Vo = 0 V, PW ≤ 10 µs | 4 | |
| Output low short circuit pulsed current | Io- | 250 | 350 | mA | Vo = 15 V, PW ≤ 10 µs | 4 | |
| RCIN low on resistance | Ron_RCIN | 50 | 100 | Ω | I = 1.5 mA | 4 | |
| FAULT low on resistance | Ron_FAULT | 50 | 100 | Ω | I = 1.5 mA | 4 | |
| Turn-on propagation delay | ton | 350 | 500 | 650 | ns | VIN = 0 V & 5 V | 5 |
| Turn-off propagation delay | toff | 375 | 530 | 685 | ns | VIN = 0 V & 5 V | 5 |
| Turn-on rise time | tr | 125 | 190 | ns | 5 | ||
| Turn-off fall time | tf | 50 | 75 | ns | 5 | ||
| ENABLE low to output shutdown propagation delay | tEN | 300 | 450 | 600 | ns | VIN, VEN = 0 V or 5 V | 5 |
| ITRIP to output shutdown propagation delay | tITRIP | 500 | 750 | 1000 | ns | VITRIP = 5 V | 5 |
| ITRIP blanking time | tbl | 100 | 150 | ns | VIN = 0 V or 5 V | 5 | |
| ITRIP to FAULT propagation delay | tFLT | 400 | 600 | 800 | ns | VITRIP = 5 V | 5 |
| Input filter time (HIN, LIN) | tFILIN | 100 | 200 | ns | VIN = 0 V & 5 V | 5 | |
| Enable input filter time | tfilterEn | 100 | 200 | ns | VIN = 0 V & 5 V | 5 | |
| Deadtime | DT | 220 | 290 | 360 | ns | VIN = 0 V & 5 V | 5 |
| Ton, off matching time (on all six channels) | MT | 75 | ns | External dead time >450 nsec | 5 | ||
| DT matching (Hi->Lo & Lo->Hi on all channels) | MDT | 70 | ns | External dead time >450 nsec | 5 | ||
| Pulse width distortion (pwin-pwout) | PM | 75 | ns | PW input =10 µs | 5 | ||
| FAULT clear time | tFLTCLR | 1.3 | 1.65 | 2 | ms | RCIN: R = 2 MΩ, C = 1 nF; VIN = 0 V or 5 V; VITRIP = 0 V | 5 |
CAD (KiCad official)
- Symbol:
IR21364STRPBF - Footprint:
Package_SO:SOIC-28W_7.5x17.9mm_P1.27mm - 3D model: SOIC-28-300mil (KiCad packages3D, STEP)
- 3D model files:
ir21364strpbf-etched.step/ir21364strpbf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ir21364strpbf.step/ir21364strpbf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (20 pp, sha256
c145cc055de4d3e4, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).