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Contents

README

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IR2106STRPBF

Infineon Technologies · Gate Drivers · SOIC-8

IR2106STRPBF from Infineon Technologies, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Low side and logic fixed supply, recommended 10 V to 20 V and absolute maximum -0.3 V to 25 V referenced to COM.
2 HIN input Logic input for the high side gate driver output (HO), in phase, with a logic '1' input minimum of 2.9 V and a logic '0' input maximum of 0.8 V, compatible with 3.3 V, 5 V and 15 V logic.
3 LIN input Logic input for the low side gate driver output (LO), in phase, with a logic '1' input minimum of 2.9 V and a logic '0' input maximum of 0.8 V.
4 COM power_in Low side return and reference node for all voltage parameters, including the VIN, VO and IO ratings.
5 LO output Low side gate drive output referenced to COM, with typical pulsed short-circuit output source current of 200 mA and sink current of 350 mA (PW ≤ 10 µs).
6 VS power_in High side floating supply return (offset), rated from VB - 25 V to VB + 0.3 V with a maximum allowable dVS/dt of 50 V/ns and operation to 600 V.
7 HO output High side gate drive output referenced to VS, with high side floating output voltage between VS - 0.3 V and VB + 0.3 V.
8 VB power_in High side floating supply, absolute maximum -0.3 V to 625 V referenced to COM and recommended operation at VS + 10 V to VS + 20 V.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
High side floating absolute voltage VB -0.3 625 V 2
Low side output voltage VLO -0.3 V 2
Low side and logic fixed supply voltage VCC -0.3 25 V 2
Allowable offset supply voltage transient dVS/dt 50 V/ns 2
Package power dissipation (8 lead SOIC) PD 0.625 W TA ≤ +25°C, 8 lead SOIC 2
Thermal resistance, junction to ambient (8 lead SOIC) RthJA 200 °C/W 8 lead SOIC 2
Junction temperature TJ 150 °C 2
Storage temperature TS -50 150 °C 2
Lead temperature TL 300 °C soldering, 10 seconds 2
High side floating supply offset voltage VS 600 V Note 1 3
Low side and logic fixed supply voltage (IR2106(4)) VCC 10 20 V IR2106(4) 3
Low side output voltage VLO 0 V 3
Ambient temperature TA -40 125 °C 3
Turn-on propagation delay ton 220 300 ns VS = 0V 3
Turn-off propagation delay toff 200 280 ns VS = 0V or 600V 3
Delay matching, HS & LS turn-on/off MT 0 30 ns 3
Turn-on rise time tr 150 220 ns VS = 0V 3
Turn-off fall time tf 50 80 ns VS = 0V 3
Logic "1" input voltage (IR2106(4)) VIH 2.9 V VCC = 10V to 20V 4
Logic "0" input voltage (IR2106(4)) VIL 0.8 V VCC = 10V to 20V 4
High level output voltage, VBIAS - VO VOH 0.8 1.4 V IO = 20 mA 4
Low level output voltage, VO VOL 0.3 0.6 V IO = 20 mA 4
Offset supply leakage current ILK 50 µA VB = VS = 600V 4
Quiescent VBS supply current IQBS 20 75 130 µA VIN = 0V or 5V 4
Quiescent VCC supply current IQCC 60 120 180 µA VIN = 0V or 5V 4
Logic "1" input bias current IIN+ 5 20 µA VIN = 5V (IR2106(4)) 4
Logic "0" input bias current IIN- 2 µA VIN = 0V (IR2106(4)) 4
VCC supply undervoltage positive going threshold VCCUV+ 8 8.9 9.8 V 4
VBS supply undervoltage positive going threshold VBSUV+ 8 8.9 9.8 V 4
VCC supply undervoltage negative going threshold VCCUV- 7.4 8.2 9 V 4
VBS supply undervoltage negative going threshold VBSUV- 7.4 8.2 9 V 4
VCC undervoltage hysteresis VCCUVH 0.3 0.7 V 4
VBS undervoltage hysteresis VBSUVH 0.3 0.7 V 4
Output high short circuit pulsed current IO+ 120 200 mA VO = 0V, PW ≤ 10 µs 4
Output low short circuit pulsed current IO- 250 350 mA VO = 15V, PW ≤ 10 µs 4

CAD (KiCad official)

  • Symbol: IR2106STRPBF
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ir2106strpbf-etched.step / ir2106strpbf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ir2106strpbf.step / ir2106strpbf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (23 pp, sha256 37b9286c1cdf22ed, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF