component
IPU60R2K1CEAKMA1
Public Made by Adomby adom
Infineon Technologies MOSFETs, TO-251-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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IPU60R2K1CEAKMA1
Infineon Technologies · MOSFETs · TO-251-3
IPU60R2K1CEAKMA1 from Infineon Technologies, in a TO-251-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate pin of the MOSFET with static VGS limits of -20 V to 20 V (dynamic -30 V to 30 V). |
| 2 | Drain | passive | Drain pin (also connected to the tab) with V(BR)DSS of 600 V minimum and continuous drain current of 3.7 A at TC=25°C. |
| 3 | Source | passive | Source pin with continuous diode forward current of 2.7 A at TC=25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-251-3 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous drain current | ID | 3.7 | A | TC=25°C | 3 | ||
| Continuous drain current | ID | 2.4 | A | TC=100°C | 3 | ||
| Pulsed drain current | ID,pulse | 6 | A | TC=25°C | 3 | ||
| Avalanche energy, single pulse | EAS | 11 | mJ | ID=0.4A; VDD=50V | 3 | ||
| Avalanche energy, repetitive | EAR | 0.06 | mJ | ID=0.4A; VDD=50V | 3 | ||
| Avalanche current, repetitive | IAR | 0.4 | A | 3 | |||
| MOSFET dv/dt ruggedness | dv/dt | 50 | V/ns | VDS=0...480V | 3 | ||
| Gate source voltage (static) | VGS | -20 | 20 | V | static | 3 | |
| Gate source voltage (dynamic) | VGS | -30 | 30 | V | AC (f>1 Hz) | 3 | |
| Power dissipation TO-251, TO252 | Ptot | 38 | W | TC=25°C | 3 | ||
| Storage temperature | Tstg | -40 | 150 | °C | 3 | ||
| Operating junction temperature | Tj | -40 | 150 | °C | 3 | ||
| Continuous diode forward current | IS | 2.7 | A | TC=25°C | 3 | ||
| Diode pulse current | IS,pulse | 6 | A | TC=25°C | 3 | ||
| Reverse diode dv/dt | dv/dt | 15 | V/ns | VDS=0...400V,ISD<=IS,Tj=25°C | 3 | ||
| Maximum diode commutation speed | dif/dt | 500 | A/µs | VDS=0...400V,ISD<=IS,Tj=25°C | 3 | ||
| Thermal resistance, junction - case | RthJC | 3.26 | °C/W | 3 | |||
| Thermal resistance, junction - ambient | RthJA | 62 | °C/W | leaded | 3 | ||
| Soldering temperature, wave soldering | Tsold | 260 | °C | 1.6mm (0.063 in.) from case for 10s | 3 | ||
| Drain-source breakdown voltage | V(BR)DSS | 600 | V | VGS=0V,ID=0.25mA | 4 | ||
| Gate threshold voltage | V(GS)th | 2.5 | 3 | 3.5 | V | VDS=VGS,ID=0.06mA | 4 |
| Zero gate voltage drain current | IDSS | 10 | µA | VDS=600,VGS=0V,Tj=25°C | 4 | ||
| Gate-source leakage current | IGSS | 100 | nA | VGS=20V,VDS=0V | 4 | ||
| Drain-source on-state resistance | RDS(on) | 1.8 | 2.1 | Ω | VGS=10V,ID=0.76A,Tj=25°C | 4 | |
| Drain-source on-state resistance | RDS(on) | 4.68 | Ω | VGS=10V,ID=0.76A,Tj=150°C | 4 | ||
| Zero gate voltage drain current | IDSS | 1 | µA | VDS=600,VGS=0V,Tj=150°C | 4 | ||
| Gate resistance | RG | 12 | Ω | f=1MHz,open drain | 4 | ||
| Input capacitance | Ciss | 140 | pF | VGS=0V,VDS=100V,f=1MHz | 4 | ||
| Output capacitance | Coss | 12 | pF | VGS=0V,VDS=100V,f=1MHz | 4 | ||
| Effective output capacitance, energy related | Co(er) | 8.5 | pF | VGS=0V,VDS=0...480V | 4 | ||
| Effective output capacitance, time related | Co(tr) | 30 | pF | ID=constant,VGS=0V,VDS=0...480V | 4 | ||
| Turn-on delay time | td(on) | 7 | ns | VDD=400V,VGS=10V,ID=0.9A,RG=12.2Ω | 4 | ||
| Rise time | tr | 7 | ns | VDD=400V,VGS=10V,ID=0.9A,RG=12.2Ω | 4 | ||
| Turn-off delay time | td(off) | 30 | ns | VDD=400V,VGS=10V,ID=0.9A,RG=12.2Ω | 4 | ||
| Fall time | tf | 50 | ns | VDD=400V,VGS=10V,ID=0.9A,RG=12.2Ω | 4 | ||
| Gate to source charge | Qgs | 0.8 | nC | VDD=480V,ID=0.9A,VGS=0to10V | 4 | ||
| Gate to drain charge | Qgd | 3.6 | nC | VDD=480V,ID=0.9A,VGS=0to10V | 4 | ||
| Gate charge total | Qg | 6.7 | nC | VDD=480V,ID=0.9A,VGS=0to10V | 4 | ||
| Gate plateau voltage | Vplateau | 5.4 | V | VDD=480V,ID=0.9A,VGS=0to10V | 4 | ||
| Diode forward voltage | VSD | 0.9 | V | VGS=0V,IF=0.9A,Tj=25°C | 5 | ||
| Reverse recovery time | trr | 180 | ns | VR=400V,IF=0.9A,diF/dt=100A/µs | 5 | ||
| Reverse recovery charge | Qrr | 0.67 | µC | VR=400V,IF=0.9A,diF/dt=100A/µs | 5 | ||
| Peak reverse recovery current | Irrm | 7.1 | A | VR=400V,IF=0.9A,diF/dt=100A/µs | 5 |
CAD (KiCad official)
- Symbol:
IPU60R2K1CEAKMA1 - Footprint:
Package_TO_SOT_THT:TO-251-3_Vertical - 3D model: TO-251-3 (KiCad packages3D, STEP)
- 3D model files:
ipu60r2k1ceakma1-etched.step/ipu60r2k1ceakma1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ipu60r2k1ceakma1.step/ipu60r2k1ceakma1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (14 pp, sha256
dd11cca11833ef1e, retrieved 2026-10-27, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# IPU60R2K1CEAKMA1
**Infineon Technologies** · MOSFETs · TO-251-3
IPU60R2K1CEAKMA1 from Infineon Technologies, in a TO-251-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate pin of the MOSFET with static VGS limits of -20 V to 20 V (dynamic -30 V to 30 V). |
| 2 | Drain | passive | Drain pin (also connected to the tab) with V(BR)DSS of 600 V minimum and continuous drain current of 3.7 A at TC=25°C. |
| 3 | Source | passive | Source pin with continuous diode forward current of 2.7 A at TC=25°C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-251-3 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous drain current | ID | | | 3.7 | A | TC=25°C | 3 |
| Continuous drain current | ID | | | 2.4 | A | TC=100°C | 3 |
| Pulsed drain current | ID,pulse | | | 6 | A | TC=25°C | 3 |
| Avalanche energy, single pulse | EAS | | | 11 | mJ | ID=0.4A; VDD=50V | 3 |
| Avalanche energy, repetitive | EAR | | | 0.06 | mJ | ID=0.4A; VDD=50V | 3 |
| Avalanche current, repetitive | IAR | | | 0.4 | A | | 3 |
| MOSFET dv/dt ruggedness | dv/dt | | | 50 | V/ns | VDS=0...480V | 3 |
| Gate source voltage (static) | VGS | -20 | | 20 | V | static | 3 |
| Gate source voltage (dynamic) | VGS | -30 | | 30 | V | AC (f>1 Hz) | 3 |
| Power dissipation TO-251, TO252 | Ptot | | | 38 | W | TC=25°C | 3 |
| Storage temperature | Tstg | -40 | | 150 | °C | | 3 |
| Operating junction temperature | Tj | -40 | | 150 | °C | | 3 |
| Continuous diode forward current | IS | | | 2.7 | A | TC=25°C | 3 |
| Diode pulse current | IS,pulse | | | 6 | A | TC=25°C | 3 |
| Reverse diode dv/dt | dv/dt | | | 15 | V/ns | VDS=0...400V,ISD<=IS,Tj=25°C | 3 |
| Maximum diode commutation speed | dif/dt | | | 500 | A/µs | VDS=0...400V,ISD<=IS,Tj=25°C | 3 |
| Thermal resistance, junction - case | RthJC | | | 3.26 | °C/W | | 3 |
| Thermal resistance, junction - ambient | RthJA | | | 62 | °C/W | leaded | 3 |
| Soldering temperature, wave soldering | Tsold | | | 260 | °C | 1.6mm (0.063 in.) from case for 10s | 3 |
| Drain-source breakdown voltage | V(BR)DSS | 600 | | | V | VGS=0V,ID=0.25mA | 4 |
| Gate threshold voltage | V(GS)th | 2.5 | 3 | 3.5 | V | VDS=VGS,ID=0.06mA | 4 |
| Zero gate voltage drain current | IDSS | | | 10 | µA | VDS=600,VGS=0V,Tj=25°C | 4 |
| Gate-source leakage current | IGSS | | | 100 | nA | VGS=20V,VDS=0V | 4 |
| Drain-source on-state resistance | RDS(on) | | 1.8 | 2.1 | Ω | VGS=10V,ID=0.76A,Tj=25°C | 4 |
| Drain-source on-state resistance | RDS(on) | | 4.68 | | Ω | VGS=10V,ID=0.76A,Tj=150°C | 4 |
| Zero gate voltage drain current | IDSS | | 1 | | µA | VDS=600,VGS=0V,Tj=150°C | 4 |
| Gate resistance | RG | | 12 | | Ω | f=1MHz,open drain | 4 |
| Input capacitance | Ciss | | 140 | | pF | VGS=0V,VDS=100V,f=1MHz | 4 |
| Output capacitance | Coss | | 12 | | pF | VGS=0V,VDS=100V,f=1MHz | 4 |
| Effective output capacitance, energy related | Co(er) | | 8.5 | | pF | VGS=0V,VDS=0...480V | 4 |
| Effective output capacitance, time related | Co(tr) | | 30 | | pF | ID=constant,VGS=0V,VDS=0...480V | 4 |
| Turn-on delay time | td(on) | | 7 | | ns | VDD=400V,VGS=10V,ID=0.9A,RG=12.2Ω | 4 |
| Rise time | tr | | 7 | | ns | VDD=400V,VGS=10V,ID=0.9A,RG=12.2Ω | 4 |
| Turn-off delay time | td(off) | | 30 | | ns | VDD=400V,VGS=10V,ID=0.9A,RG=12.2Ω | 4 |
| Fall time | tf | | 50 | | ns | VDD=400V,VGS=10V,ID=0.9A,RG=12.2Ω | 4 |
| Gate to source charge | Qgs | | 0.8 | | nC | VDD=480V,ID=0.9A,VGS=0to10V | 4 |
| Gate to drain charge | Qgd | | 3.6 | | nC | VDD=480V,ID=0.9A,VGS=0to10V | 4 |
| Gate charge total | Qg | | 6.7 | | nC | VDD=480V,ID=0.9A,VGS=0to10V | 4 |
| Gate plateau voltage | Vplateau | | 5.4 | | V | VDD=480V,ID=0.9A,VGS=0to10V | 4 |
| Diode forward voltage | VSD | | 0.9 | | V | VGS=0V,IF=0.9A,Tj=25°C | 5 |
| Reverse recovery time | trr | | 180 | | ns | VR=400V,IF=0.9A,diF/dt=100A/µs | 5 |
| Reverse recovery charge | Qrr | | 0.67 | | µC | VR=400V,IF=0.9A,diF/dt=100A/µs | 5 |
| Peak reverse recovery current | Irrm | | 7.1 | | A | VR=400V,IF=0.9A,diF/dt=100A/µs | 5 |
## CAD (KiCad official)
- Symbol: `IPU60R2K1CEAKMA1`
- Footprint: `Package_TO_SOT_THT:TO-251-3_Vertical`
- 3D model: TO-251-3 (KiCad packages3D, STEP)
- 3D model files: `ipu60r2k1ceakma1-etched.step` / `ipu60r2k1ceakma1-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ipu60r2k1ceakma1.step` / `ipu60r2k1ceakma1.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Infineon Technologies datasheet](docs/ipu60r2k1ceakma1-datasheet.pdf) (14 pp, sha256 `dd11cca11833ef1e`, retrieved 2026-10-27, tier: manufacturer)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ipu60r2k1ceakma1-datasheet.pdf)