component
IPP026N04NF2S
Public Made by Adomby adom
Infineon Technologies MOSFETs, TO-220-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
| Name | Last updated |
|---|---|
| docs | 2d ago |
| viewers | 2d ago |
| ipp026n04nf2s-etched.glb | 2d ago |
| ipp026n04nf2s-etched.step | 2d ago |
| ipp026n04nf2s-hero.glb | 2d ago |
| ipp026n04nf2s-hero.overlay.json | 2d ago |
| ipp026n04nf2s.glb | 2d ago |
| ipp026n04nf2s.kicad_mod | 2d ago |
| ipp026n04nf2s.kicad_sym | 2d ago |
| ipp026n04nf2s.lbr | 2d ago |
| ipp026n04nf2s.step | 2d ago |
| package.json | 2d ago |
| page.json | 2d ago |
| README.md | 2d ago |
| verification.json | 2d ago |
IPP026N04NF2S
Infineon Technologies · MOSFETs · TO-220-3
IPP026N04NF2S from Infineon Technologies, in a TO-220-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate of the N-channel MOSFET, rated for VGS from -20 V to 20 V, with gate threshold VGS(th) of 2.1 V to 3.4 V at VDS=VGS and ID=81 µA. |
| 2 | Drain | passive | Drain of the MOSFET, rated for 40 V drain-source breakdown voltage (V(BR)DSS) and 121 A continuous drain current at TC=25°C with VGS=10 V. |
| 3 | Source | passive | Source of the MOSFET and reference terminal for VGS; the datasheet gives a body-diode continuous forward current IS of 94 A at TC=25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-220-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous drain current (VGS=10V, TC=25°C) | ID | 121 | A | VGS=10V, TC=25°C | 3 | ||
| Continuous drain current (VGS=10V, TC=100°C) | ID | 93 | A | VGS=10V, TC=100°C | 3 | ||
| Continuous drain current (VGS=10V, TA=25°C) | ID | 29 | A | VGS=10V, TA=25°C, RTHJA=40°C/W | 3 | ||
| Pulsed drain current | ID,pulse | 484 | A | TA=25°C | 3 | ||
| Avalanche energy, single pulse | EAS | 167 | mJ | ID=70A, RGS=25Ω | 3 | ||
| Gate source voltage | VGS | -20 | 20 | V | 3 | ||
| Power dissipation (TC=25°C) | Ptot | 150 | W | TC=25°C | 3 | ||
| Power dissipation (TA=25°C) | Ptot | 3.8 | W | TA=25°C, RTHJA=40°C/W | 3 | ||
| Operating and storage temperature | Tj,Tstg | -55 | 175 | °C | 3 | ||
| Thermal resistance, junction - case | RthJC | 1 | °C/W | 3 | |||
| Thermal resistance, junction - ambient, 6 cm² cooling area | RthJA | 40 | °C/W | 6 cm² cooling area (footnote 2) | 3 | ||
| Thermal resistance, junction - ambient, minimal footprint | RthJA | 62 | °C/W | minimal footprint | 3 | ||
| Drain-source breakdown voltage | V(BR)DSS | 40 | V | VGS=0V, ID=1mA | 4 | ||
| Gate threshold voltage | VGS(th) | 2.1 | 2.8 | 3.4 | V | VDS=VGS, ID=81µA | 4 |
| Zero gate voltage drain current (Tj=25°C) | IDSS | 0.1 | 1 | µA | VDS=40V, VGS=0V, Tj=25°C | 4 | |
| Zero gate voltage drain current (Tj=125°C) | IDSS | 10 | 100 | µA | VDS=40V, VGS=0V, Tj=125°C | 4 | |
| Gate-source leakage current | IGSS | 10 | 100 | nA | VGS=20V, VDS=0V | 4 | |
| Drain-source on-state resistance (VGS=10V) | RDS(on) | 2.1 | 2.6 | mΩ | VGS=10V, ID=70A | 4 | |
| Drain-source on-state resistance (VGS=6V) | RDS(on) | 2.3 | 3.2 | mΩ | VGS=6V, ID=35A | 4 | |
| Transconductance | gfs | 120 | S | /VDS/≥2/ID/RDS(on)max, ID=70A | 4 | ||
| Gate charge total | Qg | 68 | 102 | nC | VDD=20V, ID=70A, VGS=0 to 10V | 4 | |
| Diode continuous forward current | IS | 94 | A | TC=25°C | 5 | ||
| Diode pulse current | IS,pulse | 484 | A | TC=25°C | 5 | ||
| Diode forward voltage | VSD | 0.88 | 1.1 | V | VGS=0V, IF=70A, Tj=25°C | 5 |
CAD (KiCad official)
- Symbol:
IPP026N04NF2S - Footprint:
Package_TO_SOT_THT:TO-220-3_Vertical - 3D model: TO-220-3 (KiCad packages3D, STEP)
- 3D model files:
ipp026n04nf2s-etched.step/ipp026n04nf2s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ipp026n04nf2s.step/ipp026n04nf2s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (11 pp, sha256
a08394c0d8ada06b, retrieved 2026-11-05, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).