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IPN80R900P7ATMA1

Infineon Technologies · MOSFETs · SOT-223

IPN80R900P7ATMA1 from Infineon Technologies, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the 800 V CoolMOS P7 MOSFET, with static gate-source voltage limited to ±20 V and AC (f>1 Hz) limited to ±30 V, and an integrated Zener diode for ESD protection.
2 Drain passive Drain terminal, also connected to the tab, rated for V(BR)DSS of 800 V minimum and a continuous drain current of 6 A at TC=25°C.
3 Source passive Source terminal, the reference for the gate and drain, with a continuous body-diode forward current limit of 1.7 A at TC=25°C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-223
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous drain current ID 6 A TC=25°C 3
Continuous drain current ID 3.9 A TC=100°C 3
Pulsed drain current ID,pulse 14 A TC=25°C 3
Avalanche energy, single pulse EAS 13 mJ ID=0.9A; VDD=50V 3
Avalanche energy, repetitive EAR 0.11 mJ ID=0.9A; VDD=50V 3
Avalanche current, repetitive IAR 0.9 A 3
MOSFET dv/dt ruggedness dv/dt 100 V/ns VDS=0 to 400V 3
Gate source voltage VGS -20 20 V static 3
Gate source voltage VGS -30 30 V AC (f>1 Hz) 3
Power dissipation Ptot 7 W TC=25°C 3
Operating and storage temperature Tj,Tstg -55 150 °C 3
Continuous diode forward current IS 1.7 A TC=25°C 3
Diode pulse current IS,pulse 14 A TC=25°C 3
Reverse diode dv/dt dv/dt 1 V/ns VDS=0 to 400V, ISD<=1.1A, Tj=25°C 3
Maximum diode commutation speed dif/dt 50 A/µs VDS=0 to 400V, ISD<=1.1A, Tj=25°C 3
Thermal resistance, junction - solder point RthJS 17.8 °C/W 3
Thermal resistance, junction - ambient RthJA 160 °C/W Device on PCB, minimal footprint 3
Thermal resistance, junction - ambient, soldered on copper area RthJA 75 °C/W Device on 40mm40mm1.5mm epoxy PCB FR4 with 6cm2 copper area for drain connection and cooling; vertical, no air stream cooling 3
Soldering temperature, wave- & reflow soldering allowed Tsold 260 °C reflow MSL1 3
Drain-source breakdown voltage V(BR)DSS 800 V VGS=0V, ID=1mA 4
Gate threshold voltage VGS(th) 2.5 3 3.5 V VDS=VGS, ID=0.11mA 4
Gate-source leakage current incl. zener diode IGSS 1 µA VGS=20V, VDS=0V 4
Drain-source on-state resistance RDS(on) 0.77 0.9 Ω VGS=10V, ID=2.2A, Tj=25°C 4

CAD (KiCad official)

  • Symbol: IPN80R900P7ATMA1
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: ipn80r900p7atma1-etched.step / ipn80r900p7atma1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ipn80r900p7atma1.step / ipn80r900p7atma1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (13 pp, sha256 f5c047ca558c84af, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF