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Ray Publish 0.1.0 485fd81 23d ago

IPN80R4K5P7ATMA1

Infineon Technologies · MOSFETs · SOT-223

IPN80R4K5P7ATMA1 from Infineon Technologies, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate of the 800 V CoolMOS P7 MOSFET, rated for gate-source voltage of -20 V to 20 V static and -30 V to 30 V for AC (f>1 Hz), with integrated Zener diode ESD protection.
2 Drain passive Drain of the MOSFET, also connected to the tab; the device is rated for a minimum drain-source breakdown voltage V(BR)DSS of 800 V and a continuous drain current of 1.5 A at TC=25°C.
3 Source passive Source of the MOSFET; RDS(on) is specified from drain to source at VGS=10 V, ID=0.4 A, with a maximum of 4.5 Ω at Tj=25°C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-223
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous drain current (TC=25°C) ID 1.5 A TC=25°C 3
Continuous drain current (TC=100°C) ID 1 A TC=100°C 3
Pulsed drain current ID,pulse 2.6 A TC=25°C 3
Avalanche energy, single pulse EAS 1 mJ ID=0.2A; VDD=50V 3
Avalanche energy, repetitive EAR 0.02 mJ ID=0.2A; VDD=50V 3
Avalanche current, repetitive IAR 0.2 A 3
MOSFET dv/dt ruggedness dv/dt 100 V/ns VDS=0 to 400V 3
Gate source voltage, static VGS -20 20 V static 3
Gate source voltage, AC VGS -30 30 V AC (f>1 Hz) 3
Power dissipation Ptot 6 W TC=25°C 3
Operating and storage temperature Tj,Tstg -55 150 °C 3
Continuous diode forward current IS 0.7 A TC=25°C 3
Diode pulse current IS,pulse 2.6 A TC=25°C 3
Reverse diode dv/dt dv/dt 1 V/ns VDS=0 to 400V, ISD<=0.2A, Tj=25°C 3
Maximum diode commutation speed dif/dt 50 A/µs VDS=0 to 400V, ISD<=0.2A, Tj=25°C 3
Thermal resistance, junction - solder point RthJS 21.5 °C/W 3
Thermal resistance, junction - ambient (minimal footprint) RthJA 160 °C/W Device on PCB, minimal footprint 3
Thermal resistance, junction - ambient (soldered on copper area) RthJA 75 °C/W Device on 40mm40mm1.5mm epoxy PCB FR4 with 6cm2 copper area for drain connection and cooling; vertical PCB, no air stream cooling 3
Soldering temperature, wave & reflow Tsold 260 °C reflow MSL1 3
Drain-source breakdown voltage V(BR)DSS 800 V VGS=0V, ID=1mA 4
Gate threshold voltage VGS(th) 2.5 3 3.5 V VDS=VGS, ID=0.02mA 4
Gate-source leakage current incl. zener diode IGSS 1 µA VGS=20V, VDS=0V 4
Drain-source on-state resistance (Tj=25°C) RDS(on) 3.8 4.5 Ω VGS=10V, ID=0.4A, Tj=25°C 4

CAD (KiCad official)

  • Symbol: IPN80R4K5P7ATMA1
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: ipn80r4k5p7atma1-etched.step / ipn80r4k5p7atma1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ipn80r4k5p7atma1.step / ipn80r4k5p7atma1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (13 pp, sha256 abfc5ec8cba52c37, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF