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Ray Publish 0.1.0 c7b2d4b 8d ago

IPN70R750P7SATMA1

Infineon Technologies · MOSFETs · SOT-223

IPN70R750P7SATMA1 from Infineon Technologies, in a SOT-223. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate terminal of the 700 V CoolMOS P7 MOSFET; static gate-source voltage VGS is limited to -16 V to 16 V, and AC (f>1 Hz) to -30 V to 30 V, with typical gate resistance RG of 10 Ω.
2 Drain passive Drain terminal, also connected to the tab; continuous drain current ID is 6.5 A at TC=20°C and 4.0 A at TC=100°C, with drain-source breakdown voltage V(BR)DSS of 700 V minimum.
3 Source passive Source terminal; continuous diode forward current IS is limited to 2.0 A at TC=25°C, and diode pulse current IS,pulse to 15.4 A at TC=25°C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package SOT-223
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous drain current ID 6.5 A TC = 20°C 3
Continuous drain current ID 4 A TC = 100°C 3
Pulsed drain current ID,pulse 15.4 A TC=25°C 3
Avalanche current, single pulse (application flyback relevant) IAS 2 A Measured with standard leakage inductance of transformer of 7µH 3
MOSFET dv/dt ruggedness dv/dt 100 V/ns VDS=0...400V 3
Gate source voltage (static) VGS -16 16 V static 3
Gate source voltage (AC) VGS -30 30 V AC (f>1 Hz) 3
Power dissipation Ptot 6.7 W TC=25°C 3
Operating and storage temperature Tj,Tstg -40 150 °C 3
Continuous diode forward current IS 2 A TC=25°C 3
Diode pulse current IS,pulse 15.4 A TC = 25°C 3
Reverse diode dv/dt dv/dt 1 V/ns VDS=0...400V,ISD<=IS,Tj=25°C 3
Maximum diode commutation speed dif/dt 50 A/µs VDS=0...400V,ISD<=IS,Tj=25°C 3
Thermal resistance, junction - solder point RthJS 18.7 °C/W 3
Thermal resistance, junction - ambient, minimal footprint RthJA 160 °C/W minimal footprint 3
Thermal resistance, junction - ambient, soldered on copper area RthJA 75 °C/W Device on 40mm40mm1.5 epoxy PCB FR4 with 6cm2 (one layer 70µm thick) copper area for drain connection and cooling; PCB vertical without blown air 3
Soldering temperature, wavesoldering only allowed at leads Tsold 260 °C reflow MSL1 3
Drain-source breakdown voltage V(BR)DSS 700 V VGS=0V,ID=1mA 4
Gate threshold voltage V(GS)th 2.5 3 3.5 V VDS=VGS,ID=0.07mA 4
Zero gate voltage drain current IDSS 1 µA VDS=700V,VGS=0V,Tj=25°C 4
Gate-source leakage current incl. Zener diode IGSS 1 µA VGS=20V,VDS=0V 4
Drain-source on-state resistance RDS(on) 0.62 0.75 Ω VGS=10V,ID=1.4A,Tj=25°C 4

CAD (KiCad official)

  • Symbol: IPN70R750P7SATMA1
  • Footprint: Package_TO_SOT_SMD:SOT-223-3_TabPin2
  • 3D model: SOT-223 (KiCad packages3D, STEP)
  • 3D model files: ipn70r750p7satma1-etched.step / ipn70r750p7satma1-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ipn70r750p7satma1.step / ipn70r750p7satma1.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (13 pp, sha256 e4fb27dfe5ea2f02, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF