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IPF017N08NF2SATMA1
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Infineon Technologies MOSFETs, TO-263-7. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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IPF017N08NF2SATMA1
Infineon Technologies · MOSFETs · TO-263-7
IPF017N08NF2SATMA1 from Infineon Technologies, in a TO-263-7. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | Gate | input | Gate pin of the N-channel MOSFET, with VGS rated from -20 V to 20 V. |
| 2 | Source | passive | Source connection of the MOSFET, one of the source pins 2, 3, 5, 6 and 7 (continuous drain current up to 259 A at TC=25°C). |
| 3 | Source | passive | Source connection of the MOSFET, one of the source pins 2, 3, 5, 6 and 7 (continuous drain current up to 259 A at TC=25°C). |
| 4 | Drain | passive | Drain pin of the MOSFET, connected to the tab, with VDS of 80 V. |
| 5 | Source | passive | Source connection of the MOSFET, one of the source pins 2, 3, 5, 6 and 7 (continuous drain current up to 259 A at TC=25°C). |
| 6 | Source | passive | Source connection of the MOSFET, one of the source pins 2, 3, 5, 6 and 7 (continuous drain current up to 259 A at TC=25°C). |
| 7 | Source | passive | Source connection of the MOSFET, one of the source pins 2, 3, 5, 6 and 7 (continuous drain current up to 259 A at TC=25°C). |
| 8 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-263-7 |
| Category | Triode/MOS Tube/Transistor |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-source breakdown voltage | V(BR)DSS | 80 | V | VGS=0V, ID=1mA | 4 | ||
| Gate threshold voltage | VGS(th) | 2.2 | 3 | 3.8 | V | VDS=VGS, ID=194µA | 4 |
| Zero gate voltage drain current | IDSS | 0.1 | 1 | µA | VDS=80V, VGS=0V, Tj=25°C | 4 | |
| Zero gate voltage drain current | IDSS | 10 | 100 | µA | VDS=80V, VGS=0V, Tj=125°C | 4 | |
| Gate-source leakage current | IGSS | 10 | 100 | nA | VGS=20V, VDS=0V | 4 | |
| Drain-source on-state resistance | RDS(on) | 1.4 | 1.7 | mΩ | VGS=10V, ID=100A | 4 | |
| Drain-source on-state resistance | RDS(on) | 1.8 | 2.4 | mΩ | VGS=6V, ID=50A | 4 | |
| Transconductance | gfs | 112 | S | /VDS/≥2/ID/RDS(on)max, ID=100A | 4 | ||
| Gate charge total | Qg | 124 | 186 | nC | VDD=40V, ID=100A, VGS=0 to 10V | 4 | |
| Diode continuous forward current | IS | 181 | A | TC=25°C | 5 | ||
| Diode pulse current | IS,pulse | 1036 | A | TC=25°C | 5 | ||
| Diode forward voltage | VSD | 0.87 | 1.2 | V | VGS=0V, IF=100A, Tj=25°C | 5 | |
| Continuous drain current | ID | 259 | A | VGS=10V, TC=25°C | 3 | ||
| Continuous drain current | ID | 193 | A | VGS=10V, TC=100°C | 3 | ||
| Continuous drain current | ID | 162 | A | VGS=6V, TC=100°C | 3 | ||
| Continuous drain current | ID | 33 | A | VGS=10V, TA=25°C, RthJA=40°C/W | 3 | ||
| Pulsed drain current | ID,pulse | 1036 | A | TA=25°C | 3 | ||
| Avalanche energy, single pulse | EAS | 593 | mJ | ID=100A, RGS=25Ω | 3 | ||
| Gate source voltage | VGS | -20 | 20 | V | 3 | ||
| Power dissipation | Ptot | 250 | W | TC=25°C | 3 | ||
| Power dissipation | Ptot | 3.8 | W | TA=25°C, RthJA=40°C/W | 3 | ||
| Operating and storage temperature | Tj,Tstg | -55 | 175 | °C | 3 | ||
| Thermal resistance, junction - case | RthJC | 0.6 | °C/W | 3 | |||
| Thermal resistance, junction - ambient, 6 cm² cooling area | RthJA | 40 | °C/W | 6 cm² cooling area | 3 | ||
| Thermal resistance, junction - ambient, minimal footprint | RthJA | 62 | °C/W | minimal footprint | 3 | ||
| Gate resistance | RG | 1.2 | Ω | 4 | |||
| Input capacitance | Ciss | 8700 | pF | VGS=0V, VDS=40V, f=1MHz | 4 | ||
| Output capacitance | Coss | 1400 | pF | VGS=0V, VDS=40V, f=1MHz | 4 | ||
| Reverse transfer capacitance | Crss | 61 | pF | VGS=0V, VDS=40V, f=1MHz | 4 | ||
| Turn-on delay time | td(on) | 21 | ns | VDD=40V, VGS=10V, ID=100A, RG,ext=1.6Ω | 4 | ||
| Rise time | tr | 62 | ns | VDD=40V, VGS=10V, ID=100A, RG,ext=1.6Ω | 4 | ||
| Turn-off delay time | td(off) | 50 | ns | VDD=40V, VGS=10V, ID=100A, RG,ext=1.6Ω | 4 | ||
| Fall time | tf | 26 | ns | VDD=40V, VGS=10V, ID=100A, RG,ext=1.6Ω | 4 | ||
| Output charge | Qoss | 145 | nC | VDS=40V, VGS=0V | 4 | ||
| Reverse recovery time | trr | 44 | ns | VR=40V, IF=100A, diF/dt=500A/µs | 5 | ||
| Reverse recovery charge | Qrr | 285 | nC | VR=40V, IF=100A, diF/dt=500A/µs | 5 |
CAD (KiCad official)
- Symbol:
IPF017N08NF2SATMA1 - Footprint:
Package_TO_SOT_SMD:TO-263-7_TabPin8 - 3D model: TO-263-7 (KiCad packages3D, STEP)
- 3D model files:
ipf017n08nf2satma1-etched.step/ipf017n08nf2satma1-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ipf017n08nf2satma1.step/ipf017n08nf2satma1.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (11 pp, sha256
ef0a8db9cd0cb071, retrieved 2026-11-02, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).