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IPD90N06S4-05-VB
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VBsemi Elec MOSFETs, TO-252. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownIPD90N06S4-05-VB
VBsemi Elec · MOSFETs · TO-252
IPD90N06S4-05-VB from VBsemi Elec, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal, with a maximum gate-source voltage of ±20 V. |
| 2 | D | passive | Drain terminal (also the mounting tab), rated for VDS of 60 V and continuous drain current of 97 A at TC = 25 °C. |
| 3 | S | passive | Source terminal, with a continuous diode source current rating of 100 A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | VBsemi Elec |
| Package | TO-252 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | 60 | V | TC = 25 °C | 1 | ||
| Gate-Source Voltage | VGS | -20 | 20 | V | TC = 25 °C | 1 | |
| Continuous Drain Current | ID | 97 | A | TC = 25 °C | 1 | ||
| Continuous Drain Current | ID | 56 | A | TC = 125 °C | 1 | ||
| Continuous Source Current (Diode Conduction) | IS | 100 | A | TC = 25 °C | 1 | ||
| Pulsed Drain Current | IDM | 290 | A | pulse width ≤ 300 μs, duty cycle ≤ 2 % | 1 | ||
| Single Pulse Avalanche Current | IAS | 45 | A | L = 0.1 mH | 1 | ||
| Single Pulse Avalanche Energy | EAS | 101 | mJ | L = 0.1 mH | 1 | ||
| Maximum Power Dissipation | PD | 136 | W | TC = 25 °C | 1 | ||
| Maximum Power Dissipation | PD | 45 | W | TC = 125 °C | 1 | ||
| Operating Junction and Storage Temperature Range | TJ, Tstg | -55 | 175 | °C | 1 | ||
| Junction-to-Ambient Thermal Resistance | RthJA | 50 | °C/W | PCB mount | 1 | ||
| Junction-to-Case (Drain) Thermal Resistance | RthJC | 1.1 | °C/W | 1 | |||
| Drain-Source Breakdown Voltage | VDS | 60 | V | VGS = 0 V, ID = 250 μA | 2 | ||
| Gate-Source Threshold Voltage | VGS(th) | 2 | 4 | V | VDS = VGS, ID = 250 μA | 2 | |
| Gate-Source Leakage | IGSS | -100 | 100 | nA | VDS = 0 V, VGS = ± 20 V | 2 | |
| Zero Gate Voltage Drain Current | IDSS | 1 | μA | VGS = 0 V, VDS = 60 V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 50 | μA | VGS = 0 V, VDS = 60 V, TJ = 125 °C | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 150 | μA | VGS = 0 V, VDS = 60 V, TJ = 175 °C | 2 | ||
| On-State Drain Current | ID(on) | 50 | A | VGS = 10 V, VDS ≥ 5 V | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.005 | Ω | VGS = 10 V, ID = 25 A | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.0117 | Ω | VGS = 10 V, ID = 25 A, TJ = 125 °C | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.0149 | Ω | VGS = 10 V, ID = 25 A, TJ = 175 °C | 2 | ||
| Drain-Source On-State Resistance | RDS(on) | 0.012 | Ω | VGS = 4.5 V, ID = 20 A | 2 | ||
| Forward Transconductance | gfs | 177 | S | VDS = 15 V, ID = 25 A | 2 | ||
| Input Capacitance | Ciss | 4844 | pF | VGS = 0 V, VDS = 25 V, f = 1 MHz | 2 | ||
| Output Capacitance | Coss | 441 | 555 | pF | VGS = 0 V, VDS = 25 V, f = 1 MHz | 2 | |
| Reverse Transfer Capacitance | Crss | 200 | 250 | pF | VGS = 0 V, VDS = 25 V, f = 1 MHz | 2 | |
| Total Gate Charge | Qg | 82 | nC | VGS = 10 V, VDS = 30 V, ID = 50 A | 2 | ||
| Gate-Source Charge | Qgs | 14.5 | nC | VGS = 10 V, VDS = 30 V, ID = 50 A | 2 | ||
| Gate-Drain Charge | Qgd | 13.5 | nC | VGS = 10 V, VDS = 30 V, ID = 50 A | 2 | ||
| Gate Resistance | Rg | 1 | 2 | 3 | Ω | f = 1 MHz | 2 |
| Turn-Off Delay Time | td(off) | 41 | 62 | ns | VDD = 30 V, RL = 0.6 Ω, ID ≅ 50 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Fall Time | tf | 7 | 11 | ns | VDD = 30 V, RL = 0.6 Ω, ID ≅ 50 A, VGEN = 10 V, Rg = 1 Ω | 2 | |
| Pulsed Current | ISM | 290 | A | 2 | |||
| Forward Voltage | VSD | 0.9 | 1.5 | V | IF = 50 A, VGS = 0 V | 2 |
CAD (KiCad official)
- Symbol:
IPD90N06S4-05-VB - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252 (KiCad packages3D, STEP)
- 3D model files:
ipd90n06s4-05-vb-etched.step/ipd90n06s4-05-vb-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ipd90n06s4-05-vb.step/ipd90n06s4-05-vb.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: VBsemi Elec datasheet (8 pp, sha256
504d67af73ddd9c3, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).