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IPD60R650CE

Infineon Technologies · MOSFETs · TO-252

IPD60R650CE from Infineon Technologies, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate pin of the MOSFET; static gate-source voltage limited to ±20 V (±30 V dynamic AC, f>1 Hz), with threshold 2.5 to 3.5 V.
2 Drain passive Drain pin (connected to the tab) with 600 V minimum drain-source breakdown and 9.9 A continuous drain current at TC=25°C.
3 Source passive Source pin of the MOSFET; continuous diode forward current up to 7 A at TC=25°C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-252
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-source breakdown voltage V(BR)DSS 600 V VGS=0V,ID=0.25mA 5
Gate threshold voltage V(GS)th 2.5 3 3.5 V VDS=VGS,ID=0.2mA 5
Zero gate voltage drain current IDSS 1 10 µA VDS=600,VGS=0V,Tj=25°C 5
Gate-source leakage current IGSS 100 nA VGS=20V,VDS=0V 5
Drain-source on-state resistance RDS(on) 0.54 0.65 Ω VGS=10V,ID=2.4A,Tj=25°C 5
Continuous drain current ID 9.9 A TC=25°C 3
Continuous drain current ID 6.2 A TC=100°C 3
Pulsed drain current ID,pulse 19 A TC=25°C 3
Avalanche energy, single pulse EAS 133 mJ ID=1.3A; VDD=50V 3
Avalanche energy, repetitive EAR 0.2 mJ ID=1.3A; VDD=50V 3
Avalanche current, repetitive IAR 1.3 A 3
MOSFET dv/dt ruggedness dv/dt 50 V/ns VDS=0...480V 3
Gate source voltage (static) VGS -20 20 V static 3
Gate source voltage (dynamic) VGS -30 30 V AC (f>1 Hz) 3
Power dissipation (Non FullPAK) TO-252 Ptot 82 W TC=25°C 3
Storage temperature Tstg -40 150 °C 3
Operating junction temperature Tj -40 150 °C 3
Continuous diode forward current IS 7 A TC=25°C 3
Diode pulse current IS,pulse 19 A TC=25°C 3
Reverse diode dv/dt dv/dt 15 V/ns VDS=0...400V,ISD<=IS,Tj=25°C 3
Maximum diode commutation speed dif/dt 500 A/µs VDS=0...400V,ISD<=IS,Tj=25°C 3
Thermal resistance, junction - case RthJC 1.52 °C/W 4
Thermal resistance, junction - ambient RthJA 62 °C/W device on PCB, minimal footprint 4
Thermal resistance, junction - ambient for SMD version RthJA 35 45 °C/W Device on 40mm40mm1.5mm epoxy PCB FR4 with 6cm² copper area 4
Soldering temperature Tsold 260 °C reflow MSL3 4
Gate resistance RG 10 Ω f=1MHz,open drain 5
Input capacitance Ciss 440 pF VGS=0V,VDS=100V,f=1MHz 5
Output capacitance Coss 30 pF VGS=0V,VDS=100V,f=1MHz 5
Gate charge total Qg 20.5 nC VDD=480V,ID=3A,VGS=0to10V 5
Diode forward voltage VSD 0.9 V VGS=0V,IF=3A,Tj=25°C 6

CAD (KiCad official)

  • Symbol: IPD60R650CE
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: ipd60r650ce-etched.step / ipd60r650ce-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ipd60r650ce.step / ipd60r650ce.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (16 pp, sha256 a9afe115f9137687, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF