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Contents

README

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IPD60R400CE

Infineon Technologies · MOSFETs · TO-252

IPD60R400CE from Infineon Technologies, in a TO-252. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate of the MOSFET; the datasheet limits gate-source voltage to ±20 V static and ±30 V dynamic (AC, f>1 Hz).
2 Drain passive Drain of the MOSFET, also connected to the tab; the device is rated for V(BR)DSS of 600 V minimum and 14.7 A continuous drain current at TC=25°C.
3 Source passive Source of the MOSFET, the reference terminal for the gate-source voltage ratings (±20 V static, ±30 V dynamic).

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-252
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous drain current (TC=25°C) ID 14.7 A TC=25°C 3
Continuous drain current (TC=100°C) ID 9.3 A TC=100°C 3
Pulsed drain current ID,pulse 30 A TC=25°C 3
Avalanche energy, single pulse EAS 210 mJ ID=1.8A; VDD=50V; see table 11 3
Avalanche energy, repetitive EAR 0.32 mJ ID=1.8A; VDD=50V; see table 11 3
Avalanche current, repetitive IAR 1.8 A 3
MOSFET dv/dt ruggedness dv/dt 50 V/ns VDS=0...480V 3
Gate source voltage (static) VGS -20 20 V static 3
Gate source voltage (dynamic) VGS -30 30 V AC (f>1 Hz) 3
Power dissipation (TO-252, TO-251) Ptot 112 W TC=25°C 3
Storage temperature Tstg -40 150 °C 3
Operating junction temperature Tj -40 150 °C 3
Continuous diode forward current IS 10.4 A TC=25°C 3
Diode pulse current IS,pulse 30 A TC=25°C 3
Reverse diode dv/dt dv/dt 15 V/ns VDS=0...400V,ISD<=IS,Tj=25°C 3
Maximum diode commutation speed dif/dt 500 A/µs VDS=0...400V,ISD<=IS,Tj=25°C 3
Thermal resistance, junction - case RthJC 1.12 °C/W 4
Thermal resistance, junction - ambient RthJA 62 °C/W device on PCB, minimal footprint 4
Thermal resistance, junction - ambient (SMD version) RthJA 35 45 °C/W Device on 40mm40mm1.5mm epoxy PCB FR4, 6cm² copper (one layer, 70µm), vertical, no air stream cooling 4
Soldering temperature, wave & reflow Tsold 260 °C reflow MSL3 4
Drain-source breakdown voltage V(BR)DSS 600 V VGS=0V,ID=0.25mA 5
Gate threshold voltage V(GS)th 2.5 3 3.5 V VDS=VGS,ID=0.3mA 5
Zero gate voltage drain current (Tj=25°C) IDSS 10 µA VDS=600,VGS=0V,Tj=25°C 5
Zero gate voltage drain current (Tj=150°C) IDSS 1 µA VDS=600,VGS=0V,Tj=150°C 5
Gate-source leakage current IGSS 100 nA VGS=20V,VDS=0V 5
Drain-source on-state resistance (Tj=25°C) RDS(on) 0.34 0.4 Ω VGS=10V,ID=3.8A,Tj=25°C 5
Drain-source on-state resistance (Tj=150°C) RDS(on) 0.89 Ω VGS=10V,ID=3.8A,Tj=150°C 5

CAD (KiCad official)

  • Symbol: IPD60R400CE
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252 (KiCad packages3D, STEP)
  • 3D model files: ipd60r400ce-etched.step / ipd60r400ce-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ipd60r400ce.step / ipd60r400ce.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (17 pp, sha256 560b61bbea22b44c, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF