main
History Download
Ray Publish 0.1.0 6004c94 8d ago

IP6806_NF

INJOINIC · Battery Management ICs · QFN-32-EP(5x5)

IP6806_NF from INJOINIC, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Analog ground.
2 IGND input Current communication/demodulation negative input, connected across the external 20 mΩ sampling resistor.
3 ISENSE input Current communication/demodulation positive input, connected across the external 20 mΩ sampling resistor.
4 VCC power_in Internal VCC supply, powered from VIN through a 100R resistor or from a 4V LDO (recommended range 3.8V to 5V).
5 PGND power_in Power ground of the internal power MOS transistor, connected to the positive terminal of the external 20 mΩ sampling resistor.
6 NC unconnected NC pin, left floating and cannot be grounded.
7 NC unconnected NC pin, left floating and cannot be grounded.
8 NC unconnected NC pin, left floating and cannot be grounded.
9 NC unconnected NC pin, left floating and cannot be grounded.
10 DEBUG output Debug pin, serial output of print information.
11 NTC input NTC input pin that sources 20uA and senses NTC voltage; power transfer stops below 0.5V and resumes above 0.72V, ground through 100K if unused.
12 LOSS_THR input Dynamic FOD parameter adjustment, set by an external resistor to GND (50K to 130K, default 100K).
13 LED1 output LED1 output, 2 mA min to 4 mA source current capability.
14 IO4 bidirectional Internal GPIO4, I/O range GND-0.3V to VCC+0.3V.
15 LED3 output LED3 output, 2 mA min to 4 mA source current capability.
16 LED2 output LED2 output, 2 mA min to 4 mA source current capability.
17 IO7 bidirectional Internal GPIO7, I/O range GND-0.3V to VCC+0.3V.
18 V_DECODE input Voltage communication/demodulation input.
19 BST1 passive Internal high voltage drive supply, connect a capacitor to LX1.
20 LX1 output H-bridge switching node 1.
21 LX1 output H-bridge switching node 1.
22 LX2 output H-bridge switching node 2.
23 LX2 output H-bridge switching node 2.
24 BST2 passive Internal high voltage drive supply, connect a capacitor to LX2.
25 NC unconnected NC pin, left floating and cannot be grounded.
26 VIN power_in External voltage input pin, 4.5V to 12V recommended, 16V absolute maximum.
27 VIN power_in External voltage input pin, 4.5V to 12V recommended, 16V absolute maximum.
28 DM bidirectional USB DM, absolute maximum 12V and recommended GND-0.3V to 5.5V.
29 DP bidirectional USB DP, absolute maximum 12V and recommended GND-0.3V to 5.5V.
30 VDET input Coil voltage sense input, a 2.2nF capacitor to ground sets default static FOD sensitivity.
31 NC unconnected NC pin, left floating and cannot be grounded.
32 AGND power_in Analog ground.
33 EPAD power_in Exposed pad, power ground of the internal power MOS transistor, connected to the positive terminal of the external 20 mΩ sampling resistor.

Key specifications

Parameter Value
Manufacturer INJOINIC
Package QFN-32-EP(5x5)
Category Power Management ICs
Pins 33

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
VIN input voltage (absolute maximum) VIN -0.3 16 V Voltages referenced to GND 5
VCC voltage (absolute maximum) VCC -0.3 12 V Voltages referenced to GND 5
DP, DM voltage (absolute maximum) DP,DM -0.3 12 V Voltages referenced to GND 5
Junction temperature range TJ -40 125 ℃ 5
Storage temperature range Tstg -60 125 ℃ 5
Package thermal resistance θJA 40 ℃/W 5
VIN input voltage range VIN 4.5 12 V Typ printed as 5/9 5
VCC voltage range VCC 3.8 4.2 5 V 5
VIN VIN 4.5 12 V TA=25℃; typ printed as 5/9 5
VCC VCC 3.8 4.2 5 V TA=25℃ 5
LED1,LED2,LED3 source current output capability 2 4 mA Source current to output high level is 0.8*VCC 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing Abs Human Body Model (HBM) ESD 4KV V *Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. 5

CAD (KiCad official)

  • Symbol: IP6806_NF
  • Footprint: Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm
  • 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: ip6806-nf-etched.step / ip6806-nf-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ip6806-nf.step / ip6806-nf.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: INJOINIC datasheet (16 pp, sha256 7fb46bdfb81c3610, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF