component
INA185A3IDCKR
Public Made by Adomby adom
Texas Instruments Current Sense Amplifiers, SC-70-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownINA185A3IDCKR
Texas Instruments · Current Sense Amplifiers · SC-70-6
INA185A3IDCKR from Texas Instruments, in a SC-70-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | REF | input | Reference input; the absolute maximum range is GND - 0.3 V to VS + 0.3 V. |
| 2 | GND | power_in | Analog ground. |
| 3 | VS | power_in | Power supply, 2.7 V to 5.5 V. |
| 4 | IN+ | input | Current-sense amplifier positive input; for high-side applications connect to the bus-voltage side of the sense resistor, for low-side applications connect to the load side of the sense resistor. |
| 5 | IN- | input | Current-sense amplifier negative input; for high-side applications connect to the load side of the sense resistor, for low-side applications connect to the ground side of the sense resistor. |
| 6 | OUT | output | Output voltage; the absolute maximum range is GND - 0.3 V to VS + 0.3 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SC-70-6 |
| Category | Amplifiers/Comparators |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Differential input voltage | (VIN+), (VIN-) | -26 | 26 | V | 4 | ||
| Supply voltage | VS | 6 | V | 4 | |||
| Common-mode voltage (absolute maximum) | VCM | 26 | V | Common-mode; printed minimum is GND, 0.3 V | 4 | ||
| Operating temperature | TA | -55 | 150 | °C | 4 | ||
| Junction temperature | TJ | 150 | °C | 4 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 4 | ||
| Common-mode input voltage | VCM | -0.2 | 12 | 26 | V | 4 | |
| Operating supply voltage | VS | 2.7 | 5 | 5.5 | V | 4 | |
| Operating free-air temperature | TA | -40 | 125 | °C | 4 | ||
| Common-mode rejection ratio, RTI (A2, A3 devices) | CMRR | 96 | 100 | dB | VIN+ = 0 V to 26 V, VSENSE = 0 mV, TA = -40°C to +125°C | 5 | |
| Offset voltage, RTI (A2, A3 devices) | VOS | -55 | 5 | 55 | µV | VSENSE = 0 mV, VIN+ = 0 V | 5 |
| Offset voltage, RTI (A2, A3 devices) | VOS | -130 | 25 | 130 | µV | VSENSE = 0 mV, VIN+ = 12 V | 5 |
| Offset drift, RTI | dVOS/dT | 0.2 | 0.5 | µV/°C | VSENSE = 0 mV, TA = -40°C to +125°C | 5 | |
| Power supply rejection ratio, RTI | PSRR | -30 | 8 | 30 | µV/V | VS = 2.7 V to 5.5 V, VIN+ = 12 V, VSENSE = 0 mV | 5 |
| Input offset current | IIO | -0.05 | 0.05 | µA | VSENSE = 0 mV | 5 | |
| Gain error (A1, A2, A3 devices) | EG | -0.2 | 0.05 | 0.2 | % | VOUT = 0.5 V to VS, 0.5 V, TA = -40°C to +125°C | 5 |
| Gain error drift | 1.5 | 8 | ppm/°C | TA = -40°C to +125°C | 5 | ||
| Nonlinearity error | -0.01 | 0.01 | % | VOUT = 0.5 V to VS, 0.5 V | 5 | ||
| Maximum capacitive load | CLOAD | 1 | nF | No sustained oscillation | 5 | ||
| Swing to GND (above GND) | VSN | 0.0005 | 0.0035 | V | RL = 10 kΩ to GND, VIN+, VIN- = -10mV, TA = -40°C to +125°C | 5 | |
| Zero current swing to GND (A2, A3, A4 devices) | VSG | 0.0005 | 0.012 | V | RL = Open, VIN+, VIN- = 0mV, VREF = 0 V, TA = -40°C to +125°C | 5 | |
| Quiescent current | IQ | 200 | 260 | µA | VSENSE = 0 mV | 5 | |
| Quiescent current over temperature | IQ | 300 | µA | VSENSE = 0 mV, TA = -40°C to +125°C | 5 | ||
| Gain (A3 device) | G | 100 | V/V | A3 device | 5 | ||
| Bandwidth (A3 device) | BW | 150 | kHz | CLOAD = 10 pF | 5 | ||
| Slew rate | SR | 2 | V/µs | 5 | |||
| Voltage noise density, RTI | 40 | nV/√Hz | 5 | ||||
| Junction-to-ambient thermal resistance (DCK SC70) | RθJA | 188 | °C/W | 4 | |||
| Junction-to-case (top) thermal resistance (DCK SC70) | RθJC(top) | 140.8 | °C/W | 4 | |||
| Junction-to-board thermal resistance (DCK SC70) | RθJB | 78.8 | °C/W | 4 | |||
| Junction-to-top characterization parameter (DCK SC70) | ψJT | 62.1 | °C/W | 4 | |||
| Junction-to-board characterization parameter (DCK SC70) | ψJB | 78.5 | °C/W | 4 |
CAD (KiCad official)
- Symbol:
INA185A3IDCKR - Footprint:
Package_TO_SOT_SMD:SOT-363_SC-70-6 - 3D model: SC-70-6 (KiCad packages3D, STEP)
- 3D model files:
ina185a3idckr-etched.step/ina185a3idckr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ina185a3idckr.step/ina185a3idckr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (37 pp, sha256
0b28c48a0eafba7d, retrieved 2026-10-28, tier: manufacturer) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).