INA180A2IDBVR
Public Made by Adomby adom
Texas Instruments Current-Sensing Amplifiers, SOT-23-5. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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README
markdownINA180A2IDBVR
Texas Instruments · Current-Sensing Amplifiers · SOT-23-5
INA180A2IDBVR from Texas Instruments, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | output | Analog output voltage. OUT = Gain x (V(IN+) - V(IN-)), Gain = 50 V/V for the A2 device. Swings from ~(GND+0.5 mV) to ~(VS-0.02 V) with a 10 kΩ load. |
| 2 | GND | power_in | Device ground reference (0 V). |
| 3 | IN+ | input | Current-sense amplifier positive input. For high-side sensing, connect to the bus-voltage side of the sense resistor; for low-side sensing, connect to the load side of the sense resistor. Common-mode range -0.2 V to +26 V, independent of VS. |
| 4 | IN- | input | Current-sense amplifier negative input. For high-side sensing, connect to the load side of the sense resistor; for low-side sensing, connect to the ground side. Common-mode range -0.2 V to +26 V. Differential |
| 5 | VS | power_in | Positive supply, 2.7 V to 5.5 V (absolute max 6 V). Bypass to GND with a 0.1 µF ceramic capacitor placed close to the pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23-5 |
| Category | Op-amp/Cmp |
| Pins | 5 |
Ordering variants
Same part, different packaging or reel option.
INA180A2IDBVRINA180A2IDBVTINA180A2IDBVRIDGKRINA180A2IDBVRIDGKTINA180A2IDBVRIPWRINA180A2IDBVRIPWT
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating supply voltage | VS | 2.7 | 5 | 5.5 | V | 6 | |
| Common-mode input voltage (IN+ and IN–) | VCM | -0.2 | 12 | 26 | V | 6 | |
| Operating free-air temperature | TA | -40 | 125 | °C | 6 | ||
| Supply voltage | VS | 6 | V | 6 | |||
| Analog inputs, differential | -26 | 26 | V | Differential (VIN+) – (VIN–) | 6 | ||
| Analog inputs, common-mode | 26 | V | Common-mode | 6 | |||
| Maximum output current | IOUT | 8 | mA | 6 | |||
| Operating free-air temperature | TA | -55 | 150 | °C | 6 | ||
| Junction temperature | TJ | 150 | °C | 6 | |||
| Storage temperature | Tstg | -65 | 150 | °C | 6 | ||
| Electrostatic discharge, human-body model (HBM) | V(ESD) | -3000 | 3000 | V | Per ANSI/ESDA/JEDEC JS-001 | 6 | |
| Electrostatic discharge, charged-device model (CDM) | V(ESD) | -1000 | 1000 | V | Per JEDEC specification JESD22-C101 | 6 | |
| Common-mode rejection ratio, RTI | CMRR | 84 | 100 | dB | VIN+ = 0 V to 26 V, VSENSE = 10 mV, TA = –40°C to +125°C | 7 | |
| Offset voltage, RTI | VOS | -500 | 100 | 500 | µV | 7 | |
| Offset voltage, RTI | VOS | -150 | 25 | 150 | µV | VIN+ = 0 V | 7 |
| Offset drift, RTI | dVOS/dT | 0.2 | 1 | µV/°C | TA = –40°C to +125°C | 7 | |
| Power-supply rejection ratio, RTI | PSRR | -40 | 8 | 40 | µV/V | VS = 2.7 V to 5.5 V, VSENSE = 10 mV | 7 |
| Input offset current | IIO | -0.05 | 0.05 | µA | VSENSE = 0 mV | 7 | |
| Gain error | EG | -1 | 0.1 | 1 | % | VOUT = 0.5 V to VS – 0.5 V, TA = –40°C to +125°C | 7 |
| Gain error vs temperature | 1.5 | 20 | ppm/°C | TA = –40°C to +125°C | 7 | ||
| Nonlinearity error | -0.01 | 0.01 | % | VOUT = 0.5 V to VS – 0.5 V | 7 | ||
| Maximum capacitive load | 1 | nF | No sustained oscillation | 7 | |||
| Quiescent current (INA180) | IQ | 197 | 260 | µA | VSENSE = 10 mV | 7 | |
| Quiescent current (INA180), over temperature | IQ | 300 | µA | VSENSE = 10 mV, TA = –40°C to +125°C | 7 | ||
| Input bias current | IIB | 0.1 | µA | VSENSE = 0 mV, VIN+ = 0 V | 7 | ||
| Input bias current | IIB | 80 | µA | VSENSE = 0 mV | 7 | ||
| Gain (A2 devices) | G | 50 | V/V | A2 devices | 7 | ||
| Bandwidth | BW | 210 | kHz | A2 devices, CLOAD = 10 pF | 7 | ||
| Slew rate | SR | 2 | V/µs | 7 | |||
| Voltage noise density, RTI | 40 | nV/√Hz | 7 | ||||
| Junction-to-ambient thermal resistance | RθJA | 197.1 | °C/W | 6 | |||
| Junction-to-case (top) thermal resistance | RθJC(top) | 95.8 | °C/W | 6 | |||
| Junction-to-board thermal resistance | RθJB | 53.1 | °C/W | 6 | |||
| Junction-to-top characterization parameter | ψJT | 23.4 | °C/W | 6 | |||
| Junction-to-board characterization parameter | ψJB | 52.7 | °C/W | 6 |
CAD (KiCad official)
- Symbol:
INA180A2IDBVR - Footprint:
Package_TO_SOT_SMD:SOT-23-5 - 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files:
ina180a2idbvr-etched.step/ina180a2idbvr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ina180a2idbvr.step/ina180a2idbvr.glbare the bare package body.
3D model downloads
Two STEP files. Same geometry, different body top:
| File | Size | Use it when |
|---|---|---|
ina180a2idbvr.step |
85 KB | You want the bare part, or you mark your own boards. |
ina180a2idbvr-etched.step |
2.2 MB | You want the part with INA180A2IDBVR already on it. |
The marking in the etched file is real recessed geometry cut into the solid, not a texture or a decal: 548 faces against 102 in the bare model. It survives export, section views, and rendering in any CAD tool, and it drops straight into KiCad or Fusion with no extra setup.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (45 pp, sha256
c0bafee8d4b11bae, retrieved 2026-08-17, tier: manufacturer) - Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).