# INA180A1IDBVR

**Texas Instruments** · Current-Sensing Amplifiers · SOT-23-5

INA180A1IDBVR from Texas Instruments, in a SOT-23-5. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUT | output | Analog output voltage. Amplified representation of the differential sense-resistor voltage; output = Gain (20 V/V for A1) x (V(IN+) - V(IN-)). Swings within the V_S rail. |
| 2 | GND | power_in | Ground reference for the device. Connect to system ground. |
| 3 | IN+ | input | Current-sense amplifier positive input. For high-side applications, connect to bus-voltage side of the sense resistor; for low-side applications, connect to load side of the sense resistor. Common-mode range -0.2 V to +26 V. |
| 4 | IN- | input | Current-sense amplifier negative input. For high-side applications, connect to load side of the sense resistor; for low-side applications, connect to ground side of the sense resistor. Common-mode range -0.2 V to +26 V. |
| 5 | VS | power_in | Positive supply voltage, 2.7 V to 5.5 V (recommended). Bypass with a 0.1 uF capacitor close to the pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | SOT-23-5 |
| Category | Op-amp/Cmp |
| Pins | 5 |

## Ordering variants

Same part, different packaging or reel option.

- `INA180A1IDBVR`
- `INA180A1IDBVT`
- `INA180A1IDBVRDGK`
- `INA180A1IDBVRPW`

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Common-mode rejection ratio, RTI | CMRR | 84 | 100 |  | dB | VIN+ = 0 V to 26 V, VSENSE = 10 mV, TA = –40°C to +125°C | 7 |
| Offset voltage, RTI | VOS | -500 | 100 | 500 | µV | TA = 25°C, VS = 5 V, VIN+ = 12 V (table header) | 7 |
| Offset voltage, RTI | VOS | -150 | 25 | 150 | µV | VIN+ = 0 V | 7 |
| Power-supply rejection ratio, RTI | PSRR | -40 | 8 | 40 | µV/V | VS = 2.7 V to 5.5 V, VSENSE = 10 mV | 7 |
| Gain error | EG | -1 | 0.1 | 1 | % | VOUT = 0.5 V to VS – 0.5 V, TA = –40°C to +125°C | 7 |
| Gain error vs temperature |  |  | 1.5 | 20 | ppm/°C | TA = –40°C to +125°C | 7 |
| Offset drift, RTI | dVOS/dT |  | 0.2 | 1 | µV/°C | TA = –40°C to +125°C | 7 |
| Quiescent current (INA180) | IQ |  | 197 | 260 | µA | VSENSE = 10 mV | 7 |
| Quiescent current (INA180) | IQ |  |  | 300 | µA | VSENSE = 10 mV, TA = –40°C to +125°C | 7 |
| Maximum capacitive load |  |  |  | 1 | nF | No sustained oscillation | 7 |
| Input offset current | IIO | -0.05 |  | 0.05 | µA | VSENSE = 0 mV | 7 |
| Nonlinearity error |  | -0.01 |  | 0.01 | % | VOUT = 0.5 V to VS – 0.5 V | 7 |
| Gain (A1 devices) | G |  | 20 |  | V/V | A1 devices | 7 |
| Bandwidth (A1 devices) | BW |  | 350 |  | kHz | A1 devices, CLOAD = 10 pF | 7 |
| Slew rate | SR |  | 2 |  | V/µs |  | 7 |
| Supply voltage | VS |  |  | 6 | V |  | 6 |
| Differential input voltage (VIN+) – (VIN–) | VIN+ – VIN– | -26 |  | 26 | V |  | 6 |
| Common-mode input voltage | VCM |  |  | 26 | V | Minimum is GND – 0.3 V (expression, not numeric) | 6 |
| Maximum output current | IOUT |  |  | 8 | mA |  | 6 |
| Operating free-air temperature | TA | -55 |  | 150 | °C |  | 6 |
| Junction temperature | TJ |  |  | 150 | °C |  | 6 |
| Storage temperature | Tstg | -65 |  | 150 | °C |  | 6 |
| Common-mode input voltage (IN+ and IN–) | VCM | -0.2 | 12 | 26 | V |  | 6 |
| Operating supply voltage | VS | 2.7 | 5 | 5.5 | V |  | 6 |
| Operating free-air temperature | TA | -40 |  | 125 | °C |  | 6 |
| Junction-to-ambient thermal resistance (DBV) | RθJA |  | 197.1 |  | °C/W | DBV (SOT-23) package | 6 |
| Junction-to-case (top) thermal resistance (DBV) | RθJC(top) |  | 95.8 |  | °C/W | DBV (SOT-23) package | 6 |
| Junction-to-board thermal resistance (DBV) | RθJB |  | 53.1 |  | °C/W | DBV (SOT-23) package | 6 |
| Junction-to-top characterization parameter (DBV) | ψJT |  | 23.4 |  | °C/W | DBV (SOT-23) package | 6 |
| Junction-to-board characterization parameter (DBV) | ψJB |  | 52.7 |  | °C/W | DBV (SOT-23) package | 6 |

## CAD (KiCad official)

- Symbol: `INA180A1IDBVR`
- Footprint: `Package_TO_SOT_SMD:SOT-23-5`
- 3D model: SOT-23-5 (KiCad packages3D, STEP)
- 3D model files: `ina180a1idbvr-etched.step` / `ina180a1idbvr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ina180a1idbvr.step` / `ina180a1idbvr.glb` are the bare package body.

## 3D model downloads

Two STEP files. Same geometry, different body top:

| File | Size | Use it when |
|---|---|---|
| [`ina180a1idbvr.step`](ina180a1idbvr.step) | 85 KB | You want the bare part, or you mark your own boards. |
| [`ina180a1idbvr-etched.step`](ina180a1idbvr-etched.step) | 2.0 MB | You want the part with `INA180A1IDBVR` already on it. |

The marking in the etched file is real recessed geometry cut into the solid, not a
texture or a decal: 528 faces against 102 in the bare model. It
survives export, section views, and rendering in any CAD tool, and it drops straight
into KiCad or Fusion with no extra setup.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Texas Instruments datasheet](https://www.ti.com/lit/ds/symlink/ina180a1i.pdf) (42 pp, sha256 `b420aaae55e21d3e`, retrieved 2026-08-17, tier: manufacturer)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ina180a1idbvr-datasheet.pdf)