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IKW40N65ET7
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Infineon Technologies IGBT Transistors / Modules, TO-247-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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IKW40N65ET7
Infineon Technologies · IGBT Transistors / Modules · TO-247-3
IKW40N65ET7 from Infineon Technologies, in a TO-247-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate of the IGBT, with rated gate-emitter voltage VGE of ±20 V (±30 V transient for tp ≤ 10 µs) and threshold VGEth of 4.30 to 5.70 V at IC = 0.40 mA. |
| 2 | C | passive | Collector (also the backside tab) of the IGBT and cathode of the antiparallel diode, rated for VCE = 650 V and DC collector current of 76 A at TC = 25 °C. |
| 3 | E | passive | Emitter of the IGBT and anode of the antiparallel diode, with internal emitter inductance LE of 13.0 nH measured 5 mm from the case. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Infineon Technologies |
| Package | TO-247-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage temperature | Tstg | -55 | 150 | °C | 3 | ||
| Collector-emitter voltage | VCE | 650 | V | Tvj ≥ 25 °C | 3 | ||
| DC collector current | IC | 76 | A | TC = 25 °C | 3 | ||
| DC collector current | IC | 49.5 | A | TC = 100 °C | 3 | ||
| Pulsed collector current | ICpuls | 120 | A | tp limited by Tvjmax | 3 | ||
| Turn-off safe operating area | 120 | A | VCE ≤ 650 V, tP = 1 µs, Tvj ≤ 175 °C | 3 | |||
| Gate-emitter voltage | VGE | -20 | 20 | V | 3 | ||
| Transient gate-emitter voltage | VGE | -30 | 30 | V | tp ≤ 10 µs, D < 0.010 | 3 | |
| Short circuit withstand time | tSC | 5 | µs | VGE = 15 V, VCC ≤ 330 V, Tvj = 100 °C; allowed short circuits < 1000, time between short circuits ≥ 1.0 s | 3 | ||
| Short circuit withstand time | tSC | 3 | µs | VGE = 15 V, VCC ≤ 400 V, Tvj = 150 °C; allowed short circuits < 1000, time between short circuits ≥ 1.0 s | 3 | ||
| Power dissipation | Ptot | 230.8 | W | TC = 25 °C | 3 | ||
| Power dissipation | Ptot | 115.4 | W | TC = 100 °C | 3 | ||
| Collector-emitter saturation voltage | VCEsat | 1.35 | 1.65 | V | IC = 40.0 A, VGE = 15 V, Tvj = 25 °C | 4 | |
| Gate-emitter threshold voltage | VGEth | 4.3 | 5 | 5.7 | V | IC = 0.40 mA, VCE = VGE | 4 |
| Operating junction temperature | Tvj | -40 | 175 | °C | 6 | ||
| Diode forward current | IF | 72 | A | limited by bondwire, TC = 25 °C | 6 | ||
| Diode forward current | IF | 43.5 | A | limited by bondwire, TC = 100 °C | 6 | ||
| Diode pulsed current | IFpuls | 120 | A | limited by Tvjmax | 6 | ||
| Repetitive peak reverse voltage | VRRM | 650 | V | Tvj ≥ 25 °C | 6 | ||
| Diode forward voltage | VF | 1.65 | 2 | V | IF = 40.0 A, Tvj = 25 °C | 6 | |
| Operating junction temperature (diode) | Tvj | -40 | 175 | °C | 8 | ||
| Internal emitter inductance | LE | 13 | nH | measured 5 mm (0.197 in) from case | 3 | ||
| Soldering temperature | 260 | °C | wave soldering, 1.6 mm (0.063 in.) from case, for 10 s | 3 | |||
| Mounting torque, M3 screw | M | 0.6 | Nm | maximum of mounting processes: 3 | 3 | ||
| Thermal resistance, junction-ambient | Rth(j-a) | 40 | K/W | 3 | |||
| Collector-emitter saturation voltage | VCEsat | 1.5 | V | IC = 40.0 A, VGE = 15 V, Tvj = 125 °C | 4 | ||
| Collector-emitter saturation voltage | VCEsat | 1.6 | V | IC = 40.0 A, VGE = 15 V, Tvj = 175 °C | 4 | ||
| Zero gate voltage collector current | ICES | 40 | µA | VCE = 650 V, VGE = 0 V, Tvj = 25 °C | 4 | ||
| Zero gate voltage collector current | ICES | 900 | µA | VCE = 650 V, VGE = 0 V, Tvj = 175 °C | 4 | ||
| Gate-emitter leakage current | IGES | 100 | nA | VCE = 0 V, VGE = 20 V | 4 | ||
| Transconductance | gfs | 21 | S | IC = 40.0 A, VCE = 20 V | 4 | ||
| Short circuit collector current | ISC | 205 | A | VGE = 15 V, tSC ≤ 3 µs, allowed short circuits < 1000, time between short circuits ≥ 1.0 s | 4 | ||
| Input capacitance | Cies | 2475 | pF | VCE = 25 V, VGE = 0 V, f = 1000 kHz | 4 | ||
| Output capacitance | Coes | 77 | pF | VCE = 25 V, VGE = 0 V, f = 1000 kHz | 4 | ||
| Reverse transfer capacitance | Cres | 25 | pF | VCE = 25 V, VGE = 0 V, f = 1000 kHz | 4 | ||
| Gate charge | QG | 235 | nC | IC = 40.0 A, VGE = 15 V, VCE = 520 V | 4 | ||
| Turn-on energy | Eon | 1.05 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 25 °C, IC = 40.0 A | 5 | ||
| Turn-on energy | Eon | 0.45 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 25 °C, IC = 20.0 A | 5 | ||
| Turn-on energy | Eon | 1.65 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 175 °C, IC = 40.0 A | 5 | ||
| Turn-on energy | Eon | 0.84 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 175 °C, IC = 20.0 A | 5 | ||
| Turn-off energy | Eoff | 0.59 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 25 °C, IC = 40.0 A | 5 | ||
| Turn-off energy | Eoff | 0.26 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 25 °C, IC = 20.0 A | 5 | ||
| Turn-off energy | Eoff | 1.13 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 175 °C, IC = 40.0 A | 5 | ||
| Total switching energy | Ets | 1.64 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 25 °C, IC = 40.0 A | 6 | ||
| Total switching energy | Ets | 0.71 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 25 °C, IC = 20.0 A | 6 | ||
| Total switching energy | Ets | 2.78 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 175 °C, IC = 40.0 A | 6 | ||
| Total switching energy | Ets | 1.43 | mJ | VCE = 400 V, VGE = 15 V, RGon = 10.0 Ω, RGoff = 10.0 Ω, Lσ = 32 nH, Cσ = 30 pF, Tvj = 175 °C, IC = 20.0 A | 6 | ||
| IGBT thermal resistance, junction-case | Rthjc | 0.65 | K/W | 6 | |||
| Diode forward voltage | VF | 1.6 | V | IF = 40.0 A, Tvj = 125 °C | 6 | ||
| Diode forward voltage | VF | 1.55 | V | IF = 40.0 A, Tvj = 175 °C | 6 | ||
| Reverse leakage current | IR | 40 | µA | VR = 650 V, Tvj = 25 °C | 6 | ||
| Reverse leakage current | IR | 900 | µA | VR = 650 V, Tvj = 175 °C | 6 | ||
| Diode thermal resistance, junction-case | Rthjc | 0.9 | K/W | 8 |
CAD (KiCad official)
- Symbol:
IKW40N65ET7 - Footprint:
Package_TO_SOT_THT:TO-247-3_Vertical - 3D model: TO-247-3 (KiCad packages3D, STEP)
- 3D model files:
ikw40n65et7-etched.step/ikw40n65et7-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ikw40n65et7.step/ikw40n65et7.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Infineon Technologies datasheet (19 pp, sha256
414cc9e1cd90c9bd, retrieved 2026-10-16, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).