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Contents

README

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IIM-42352

TDK InvenSense · Accelerometers · LGA-14(2.5x3)

IIM-42352 from TDK InvenSense, in a LGA-14(2.5x3). Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 AP_SDO / AP_AD0 bidirectional SPI serial data output in 4-wire mode or I2C/I3C slave address LSB selection pin with configurable pull-up and pull-down.
2 RESV unconnected Reserved pin; no connect or connect to GND with optional pull-up enablement via PIN2_PU_EN register.
3 RESV unconnected Reserved pin; no connect or connect to GND with optional pull-up enablement via PIN3_PU_EN register.
4 INT1 / INT output Interrupt 1 output supporting both push-pull and open-drain drive circuits with optional pull-down and alternative function as all-interrupts-mapped pin.
5 VDDIO power_in IO power supply voltage input with operating range 1.71V to 3.6V requiring 10nF bypass capacitor.
6 GND power_in Power supply ground connection.
7 RESV unconnected Reserved pin; must connect to GND with optional pull-up enablement via PIN7_PU_EN register.
8 VDD power_in Primary power supply voltage input with operating range 1.71V to 3.6V requiring 0.1µF and 2.2µF bypass capacitors.
9 INT2 / FSYNC / CLKIN bidirectional Multi-function pin supporting Interrupt 2 output, frame sync input, or external clock input (31-50 kHz) selectable via PIN9_FUNCTION and mode registers with optional pull-down.
10 RESV unconnected Reserved pin; no connect or connect to GND with pull-up enabled by default and disableable via PIN10_PU_EN register.
11 RESV unconnected Reserved pin; no connect or connect to GND with pull-up enabled by default and disableable via PIN11_PU_EN register.
12 AP_CS input SPI chip select input active low or must connect to VDDIO when using I2C/I3C interface with configurable pull-up and pull-down.
13 AP_SCL / AP_SCLK input I2C serial clock (open-drain, 1 MHz maximum) or SPI serial clock input (24 MHz maximum) with configurable pull-up and pull-down.
14 AP_SDA / AP_SDIO / AP_SDI bidirectional I2C serial data (open-drain), SPI serial data I/O 3-wire mode, or SPI serial data input 4-wire mode with configurable pull-up and pull-down.

Key specifications

Parameter Value
Manufacturer TDK InvenSense
Package LGA-14(2.5x3)
Category Sensors
Pins 14

CAD (KiCad official)

  • Symbol: IIM-42352
  • Footprint: Package_LGA:Bosch_LGA-14_3x2.5mm_P0.5mm
  • 3D model: LGA-14(2.5x3) (KiCad packages3D, STEP)
  • 3D model files: iim-42352-etched.step / iim-42352-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); iim-42352.step / iim-42352.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TDK InvenSense datasheet (99 pp, sha256 65b3ee9c5a25dfe3, retrieved 2026-09-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.2, primary claude-haiku-4-5-20251001 (text), consensus claude-sonnet-4-6 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF