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IHW30N135R5

Infineon Technologies · IGBT Transistors / Modules · TO-247-3

IHW30N135R5 from Infineon Technologies, in a TO-247-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-emitter voltage max ±20 V (transient ±25 V for tp ≤10 µs), threshold VGE(th) 5.1 to 6.4 V at IC=0.75 mA, no integrated gate resistor.
2 C passive Collector (also connected to the mounting tab); collector-emitter voltage 1350 V, DC collector current 60 A at Tc=25°C and 30 A at Tc=100°C.
3 E passive Emitter, also the anode of the monolithic body diode; diode forward current 60 A at Tc=25°C and 30 A at Tc=100°C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-247-3
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Collector-emitter voltage VCE 1350 V Tvj >= 25C 3
DC collector current, Tc=25C IC 60 A Tc=25C, limited by Tvjmax 3
DC collector current, Tc=100C IC 30 A Tc=100C, limited by Tvjmax 3
Pulsed collector current ICpuls 90 A tp limited by Tvjmax 3
Non repetitive peak collector current ICSM 200 A capacitor charging saturation current, Tvj<175C, tp<3us (footnote 1) 3
Turn off safe operating area 90 A VCE<=1350V, Tvj<=175C, tp=1us 3
Diode forward current, Tc=25C IF 60 A Tc=25C, limited by Tvjmax 3
Diode forward current, Tc=100C IF 30 A Tc=100C, limited by Tvjmax 3
Diode pulsed current IFpuls 90 A tp limited by Tvjmax 3
Gate-emitter voltage VGE -20 20 V 3
Transient gate-emitter voltage VGE -25 25 V tp<=10us, D<0.010 3
Power dissipation, Tc=25C Ptot 330 W Tc=25C 3
Power dissipation, Tc=100C Ptot 165 W Tc=100C 3
Operating junction temperature Tvj -40 175 C 3
Storage temperature Tstg -55 150 C 3
Soldering temperature, wave soldering 260 C 1.6mm (0.063in.) from case for 10s 3
Mounting torque, M3 screw M 0.6 Nm maximum of mounting processes: 3 3
IGBT thermal resistance, junction-case Rth(j-c) 0.45 K/W 3
Diode thermal resistance, junction-case Rth(j-c) 0.45 K/W 3
Thermal resistance, junction-ambient Rth(j-a) 40 K/W 3
Collector-emitter breakdown voltage V(BR)CES 1350 V VGE=0V, IC=0.50mA 4
Collector-emitter saturation voltage, Tvj=25C VCEsat 1.95 V VGE=15.0V, IC=30.0A, Tvj=25C 4
Diode forward voltage, Tvj=25C VF 2.05 V VGE=0V, IF=30.0A, Tvj=25C 4
Gate-emitter threshold voltage VGE(th) 5.1 5.8 6.4 V IC=0.75mA, VCE=VGE 4
Zero gate voltage collector current, Tvj=25C ICES 100 uA VCE=1350V, VGE=0V, Tvj=25C 4
Gate-emitter leakage current IGES 100 nA VCE=0V, VGE=20V 4
Collector-emitter saturation voltage, Tvj=25C VCEsat 1.65 V VGE=15.0V, IC=30.0A, Tvj=25C 4
Collector-emitter saturation voltage, Tvj=125C VCEsat 1.95 V VGE=15.0V, IC=30.0A, Tvj=125C 4
Collector-emitter saturation voltage, Tvj=175C VCEsat 2.05 V VGE=15.0V, IC=30.0A, Tvj=175C 4
Diode forward voltage, Tvj=25C VF 1.85 V VGE=0V, IF=30.0A, Tvj=25C 4
Diode forward voltage, Tvj=125C VF 2.1 V VGE=0V, IF=30.0A, Tvj=125C 4
Diode forward voltage, Tvj=175C VF 2.25 V VGE=0V, IF=30.0A, Tvj=175C 4
Zero gate voltage collector current, Tvj=175C ICES 630 uA VCE=1350V, VGE=0V, Tvj=175C 4
Transconductance gfs 23 S VCE=20V, IC=30.0A 4
Input capacitance Cies 1810 pF VCE=25V, VGE=0V, f=1MHz 4
Output capacitance Coes 50 pF VCE=25V, VGE=0V, f=1MHz 4
Reverse transfer capacitance Cres 40 pF VCE=25V, VGE=0V, f=1MHz 4
Gate charge QG 235 nC VCC=1080V, IC=30.0A, VGE=15V 4
Internal emitter inductance LE 13 nH measured 5mm (0.197in.) from case 4
Turn-off delay time, Tvj=25C td(off) 310 ns Tvj=25C, VCC=600V, IC=30.0A, VGE=0.0/15.0V, RG(on)=10.0ohm, RG(off)=10.0ohm, Lsigma=175nH, Csigma=40pF 4
Fall time, Tvj=25C tf 120 ns Tvj=25C, VCC=600V, IC=30.0A, VGE=0.0/15.0V, RG(on)=10.0ohm, RG(off)=10.0ohm, Lsigma=175nH, Csigma=40pF 4
Turn-off energy, Tvj=25C Eoff 1.4 mJ Tvj=25C, VCC=600V, IC=30.0A, VGE=0.0/15.0V, RG(on)=10.0ohm, RG(off)=10.0ohm, Lsigma=175nH, Csigma=40pF 4
Turn-off energy, soft switching, Tvj=25C Eoff 0.17 mJ dv/dt=200.0V/us, Tvj=25C, VCC=600V, IC=30.0A, VGE=0.0/15.0V, RG(on)=10.0ohm, RG(off)=10.0ohm, Lsigma=175nH, Csigma=40pF 4
Turn-off delay time, Tvj=175C td(off) 385 ns Tvj=175C, VCC=600V, IC=30.0A, VGE=0.0/15.0V, RG(on)=10.0ohm, RG(off)=10.0ohm, Lsigma=175nH, Csigma=40pF 5
Fall time, Tvj=175C tf 295 ns Tvj=175C, VCC=600V, IC=30.0A, VGE=0.0/15.0V, RG(on)=10.0ohm, RG(off)=10.0ohm, Lsigma=175nH, Csigma=40pF 5
Turn-off energy, Tvj=175C Eoff 2.7 mJ Tvj=175C, VCC=600V, IC=30.0A, VGE=0.0/15.0V, RG(on)=10.0ohm, RG(off)=10.0ohm, Lsigma=175nH, Csigma=40pF 5
Turn-off energy, soft switching, Tvj=175C Eoff 0.57 mJ dv/dt=200.0V/us, Tvj=175C, VCC=600V, IC=30.0A, VGE=0.0/15.0V, RG(on)=10.0ohm, RG(off)=10.0ohm, Lsigma=175nH, Csigma=40pF 5

CAD (KiCad official)

  • Symbol: IHW30N135R5
  • Footprint: Package_TO_SOT_THT:TO-247-3_Vertical
  • 3D model: TO-247-3 (KiCad packages3D, STEP)
  • 3D model files: ihw30n135r5-etched.step / ihw30n135r5-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ihw30n135r5.step / ihw30n135r5.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (15 pp, sha256 93c940e23a232b56, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF