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docs igw50n60tp: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 5d ago
viewers igw50n60tp: viewers · Ray 27d ago
igw50n60tp-etched.fit.json igw50n60tp: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 5d ago
igw50n60tp-etched.glb igw50n60tp: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 5d ago
igw50n60tp-etched.step igw50n60tp: re-etch, flat white mark read from pin 1 (service-occt 1.4.0) + chip hero · Ray 5d ago
igw50n60tp.glb Publish 0.1.0 · Ray 27d ago
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page.json igw50n60tp: component.models_3d pose record per STEP (Z-up, seated z=0, pad-centre origin, identity binding) · Ray 20h ago
README.md igw50n60tp: laser-etched CAD + chip hero (factory 2.0.0 backfill) · Ray 19d ago

IGW50N60TP

Infineon Technologies · IGBT Transistors / Modules · TO-247-3

IGW50N60TP from Infineon Technologies, in a TO-247-3. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate. Insulated gate control input; VGE(th) typ. 5.1V, absolute maximum VGE = ±20V. Drive with a low-impedance gate driver through RG(on)/RG(off) (7.0Ω typical in datasheet test conditions).
2 C passive Collector. High-voltage power terminal, VCES = 600V, IC = 80A (TC=25°C), 61A (TC=100°C); pulsed IC = 150A. Electrically connected to the TO-247 metal tab (heat sink surface).
3 E passive Emitter. Return-side power terminal; source of the load current returning to the negative rail. Internal emitter inductance LE ≈ 13 nH measured 5 mm from case.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-247-3
Category Transistors/Thyristors
Pins 3

Ordering variants

Same part, different packaging or reel option.

  • IGW50N60TP

CAD (KiCad official)

  • Symbol: IGW50N60TP
  • Footprint: Package_TO_SOT_THT:TO-247-3_Vertical
  • 3D model: TO-247-3 (KiCad packages3D, STEP)
  • 3D model files: igw50n60tp-etched.step / igw50n60tp-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); igw50n60tp.step / igw50n60tp.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (14 pp, sha256 418df5458466f0d8, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF