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IDH04SG60C

Infineon Technologies · SiC Diodes · TO-220-2

IDH04SG60C from Infineon Technologies, in a TO-220-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C passive Cathode of the diode; the datasheet gives the device ratings (repetitive peak reverse voltage V_RRM 600 V at Tj=25 °C, continuous forward current I_F 4 A at TC<130 °C) but no pin-specific limits.
2 A passive Anode of the diode; the datasheet gives the device ratings (repetitive peak reverse voltage V_RRM 600 V at Tj=25 °C, continuous forward current I_F 4 A at TC<130 °C) but no pin-specific limits.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-220-2
Category Silicon Carbide (SiC) Devices
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Continuous forward current IF 4 A TC<130 °C 1
Non-repetitive peak forward current, sine halfwave IF,SM 18 A TC=25 °C, tp=10 ms 1
Non-repetitive peak forward current, sine halfwave IF,SM 13.5 A TC=150 °C, tp=10 ms 1
Non-repetitive peak forward current IF,max 120 A TC=25 °C, tp=10 µs 1
i²t value ∫i²dt 1.8 A²s TC=25 °C, tp=10 ms 1
i²t value ∫i²dt 0.93 A²s TC=150 °C, tp=10 ms 1
Repetitive peak reverse voltage VRRM 600 V Tj=25 °C 1
Diode dv/dt ruggedness dv/dt 50 V/ns VR=0….480 V 1
Power dissipation Ptot 43 W TC=25 °C 1
Operating and storage temperature Tj, Tstg -55 175 °C 1
Soldering temperature, wavesoldering only allowed at leads Tsold 260 °C 1.6 mm (0.063 in.) from case for 10 s 1
Mounting torque M3 and M3.5 screws 60 Ncm 1
Thermal resistance, junction - case RthJC 3.5 K/W 2
Thermal resistance, junction - ambient, leaded RthJA 62 K/W 2
DC blocking voltage VDC 600 V IR=0.05 mA, Tj=25 °C 2
Diode forward voltage VF 2.3 V IF=4 A, Tj=25 °C 2
Reverse current IR 25 µA VR=600 V, Tj=25 °C 2
Reverse current IR 270 µA VR=600 V, Tj=150 °C 2
Switching time tc 10 ns 2

CAD (KiCad official)

  • Symbol: IDH04SG60C
  • Footprint: Package_TO_SOT_THT:TO-220-2_Vertical
  • 3D model: TO-220-2 (KiCad packages3D, STEP)
  • 3D model files: idh04sg60c-etched.step / idh04sg60c-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); idh04sg60c.step / idh04sg60c.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (7 pp, sha256 2e2844769088bde6, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF