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IDH03SG60CXKSA2

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Infineon Technologies SiC Diodes, TO-220-2. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componentsilicon carbide (sic) devicesidh03sg60cxksa2factory-2.0.0extractor-text

Changed since verified IDH03SG60CXKSA2

by Ray · last 31 Oct 2026 · 1 record · files changed since
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier lcsc, 2 pinschanged since
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: IDH03SG60CXKSA2 · TO-220-2 · 2 pins
  • ✓copper: 2 copper pads, none touching another net
  • ✓datasheet: all 2 pin names found in the 7-page datasheet
  • ✓distributor: lcsc C5361091, digikey 448-IDH03SG60CXKSA2-ND, mouser 726-IDH03SG60CXKSA2
  • ✓family: TO-220-2_Vertical
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-1xshyt0v/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 2 pins = 2 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 2 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files! idh03sg60cxksa2.kicad_sym✓ idh03sg60cxksa2.kicad_mod✓ idh03sg60cxksa2.step
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3D Model

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Symbol & Footprint

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Contents

README

markdown

IDH03SG60CXKSA2

Infineon Technologies · SiC Diodes · TO-220-2

IDH03SG60CXKSA2 from Infineon Technologies, in a TO-220-2. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 C passive Cathode of the SiC Schottky diode (Pin 1 per product summary); repetitive peak reverse voltage 600 V, continuous forward current 3 A at TC<130 °C.
2 A passive Anode of the SiC Schottky diode (Pin 2 per product summary); forward voltage typically 2.1 V at IF=3 A, Tj=25 °C.

Key specifications

Parameter Value
Manufacturer Infineon Technologies
Package TO-220-2
Category Silicon Carbide (SiC) Devices
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
DC blocking voltage VDC 600 V IR=0.05 mA, Tj=25 °C 2
Diode forward voltage VF 2.1 2.3 V IF=3 A, Tj=25 °C 2
Diode forward voltage VF 2.8 V IF=3 A, Tj=150 °C 2
Reverse current IR 0.23 15 µA VR=600 V, Tj=25 °C 2
Reverse current IR 1 150 µA VR=600 V, Tj=150 °C 2
Switching time tc 10 ns VR=400 V, IF≤IF,max, diF/dt=200 A/µs, Tj=150 °C 2
Thermal resistance, junction - case RthJC 3.9 K/W 2
Thermal resistance, junction - ambient, leaded RthJA 62 K/W 2
Continuous forward current IF 3 A TC<130 °C 1
Surge non-repetitive forward current, sine halfwave IF,SM 11.5 A TC=25 °C, tp=10 ms 1
Surge non-repetitive forward current, sine halfwave IF,SM 9.7 A TC=150 °C, tp=10 ms 1
Non-repetitive peak forward current IF,max 100 A TC=25 °C, tp=10 µs 1
i²t value ∫i²dt 0.61 A²s TC=25 °C, tp=10 ms 1
i²t value ∫i²dt 0.44 A²s TC=150 °C, tp=10 ms 1
Repetitive peak reverse voltage VRRM 600 V Tj=25 °C 1
Diode dv/dt ruggedness dv/dt 50 V/ns VR=0….480 V 1
Power dissipation Ptot 38 W TC=25 °C 1
Operating and storage temperature Tj, Tstg -55 175 °C 1
Soldering temperature, wavesoldering Tsold 260 °C 1.6mm (0.063 in.) from case for 10s 1
Mounting torque 60 Ncm M3 and M3.5 screws 1
Total capacitive charge Qc 3.2 nC 2
Total capacitance C 60 pF VR=1 V, f=1 MHz 2
Total capacitance C 8 pF VR=300 V, f=1 MHz 2

CAD (KiCad official)

  • Symbol: IDH03SG60CXKSA2
  • Footprint: Package_TO_SOT_THT:TO-220-2_Vertical
  • 3D model: TO-220-2 (KiCad packages3D, STEP)
  • 3D model files: idh03sg60cxksa2-etched.step / idh03sg60cxksa2-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); idh03sg60cxksa2.step / idh03sg60cxksa2.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Infineon Technologies datasheet (7 pp, sha256 d02df5393dfab56f, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF