component
ICL7667CBAZA
Public Made by Adomby adom
RENESAS Pre-ordered Chips, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownICL7667CBAZA
RENESAS · Pre-ordered Chips · SOIC-8
ICL7667CBAZA from RENESAS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | N/C | unconnected | No connection. |
| 2 | IN A | input | Driver A TTL/CMOS-compatible input (logic low 0.8V max, logic high 2.0V min); never leave floating, tie unused input to V- or ground. |
| 3 | V- | power_in | Negative supply and ground return for inputs and outputs, from 0V (ground) down to -15V; keep common ground impedance minimal. |
| 4 | IN B | input | Driver B TTL/CMOS-compatible input (logic low 0.8V max, logic high 2.0V min); never leave floating, tie unused input to V- or ground. |
| 5 | OUT B | output | Driver B inverting CMOS high-current output swinging between V- and V+, with typical ROUT of 7 ohms at V+ = 15V. |
| 6 | V+ | power_in | Positive supply, +4.5V to +15V, requiring bypassing with a 4.7µF tantalum in parallel with a 0.1µF low-inductance capacitor. |
| 7 | OUT A | output | Driver A inverting CMOS high-current output swinging between V- and V+, with typical ROUT of 7 ohms at V+ = 15V. |
| 8 | N/C | unconnected | No connection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage V+ to V- | 18 | V | printed ±18V | 2 | |||
| Storage Temperature | -65 | 150 | °C | 2 | |||
| Lead Temperature | 300 | °C | Soldering 10s, SOIC lead tips only | 2 | |||
| Operating Temperature | 0 | 70 | °C | ICL7667C | 2 | ||
| Supply Voltage V+ | V+ | 4.5 | 15 | V | 2 | ||
| Supply Voltage V- | V- | -15 | 0 | V | Ground to -15V | 2 | |
| Thermal Resistance Junction-Ambient | θJA | 170 | °C/W | 8 Ld SOIC, typical | 2 | ||
| Logic 1 Input Voltage | VIH | 2 | V | V+ = 4.5V, TA = +25°C | 2 | ||
| Logic 0 Input Voltage | VIL | 0.8 | V | V+ = 4.5V, TA = +25°C | 2 | ||
| Logic 0 Input Voltage | VIL | 0.5 | V | V+ = 4.5V, 0°C ≤ TA ≤ +70°C | 2 | ||
| Input Current | IIL | -0.1 | 0.1 | µA | V+ = 15V, VIN = 0V and 15V, TA = +25°C | 2 | |
| Output Voltage Low | VOL | 0 | 0.05 | V | V+ = 4.5V and 15V, TA = +25°C | 2 | |
| Output Voltage Low | VOL | 0.1 | V | V+ = 4.5V and 15V, 0°C ≤ TA ≤ +70°C | 2 | ||
| Output Resistance | ROUT | 7 | 10 | Ω | VIN = VIL, IOUT = -10mA, V+ = 15V, TA = +25°C | 2 | |
| Output Resistance | ROUT | 12 | Ω | VIN = VIL, IOUT = -10mA, V+ = 15V, 0°C ≤ TA ≤ +70°C | 2 | ||
| Output Resistance | ROUT | 8 | 12 | Ω | VIN = VIH, IOUT = 10mA, V+ = 15V, TA = +25°C | 2 | |
| Output Resistance | ROUT | 13 | Ω | VIN = VIH, IOUT = 10mA, V+ = 15V, 0°C ≤ TA ≤ +70°C | 2 | ||
| Power Supply Current | ICC | 5 | 7 | mA | V+ = 15V, VIN = 3V both inputs, TA = +25°C | 2 | |
| Power Supply Current | ICC | 8 | mA | V+ = 15V, VIN = 3V both inputs, 0°C ≤ TA ≤ +70°C | 2 | ||
| Power Supply Current | ICC | 150 | 400 | µA | V+ = 15V, VIN = 0V both inputs, TA = +25°C | 2 | |
| Power Supply Current | ICC | 400 | µA | V+ = 15V, VIN = 0V both inputs, 0°C ≤ TA ≤ +70°C | 2 | ||
| Delay Time | TD2 | 35 | 50 | ns | Figure 3, TA = +25°C | 2 | |
| Delay Time | TD2 | 60 | ns | Figure 3, 0°C ≤ TA ≤ +70°C | 2 | ||
| Rise Time | TR | 20 | 30 | ns | Figure 3, TA = +25°C | 2 | |
| Rise Time | TR | 40 | ns | Figure 3, 0°C ≤ TA ≤ +70°C | 2 | ||
| Fall Time | TF | 20 | 30 | ns | Figure 3, TA = +25°C | 2 | |
| Fall Time | TF | 40 | ns | Figure 3, 0°C ≤ TA ≤ +70°C | 2 | ||
| Delay Time | TD1 | 20 | 30 | ns | Figure 3, TA = +25°C | 2 | |
| Delay Time | TD1 | 40 | ns | Figure 3, 0°C ≤ TA ≤ +70°C | 2 |
CAD (KiCad official)
- Symbol:
ICL7667CBAZA - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
icl7667cbaza-etched.step/icl7667cbaza-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);icl7667cbaza.step/icl7667cbaza.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RENESAS datasheet (11 pp, sha256
bccbe452e5a3abfa, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).