component
ICL3232IBNZ-T
Public Made by Adomby adom
RENESAS RS232 ICs, SOIC-16. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownICL3232IBNZ-T
RENESAS · RS232 ICs · SOIC-16
ICL3232IBNZ-T from RENESAS, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | C1+ | passive | External capacitor (voltage doubler) is connected to this lead. |
| 2 | V+ | power_out | Internally generated positive transmitter supply (+5.5V). |
| 3 | C1- | passive | External capacitor (voltage doubler) is connected to this lead. |
| 4 | C2+ | passive | External capacitor (voltage inverter) is connected to this lead. |
| 5 | C2- | passive | External capacitor (voltage inverter) is connected to this lead. |
| 6 | V- | power_out | Internally generated negative transmitter supply (-5.5V). |
| 7 | T2OUT | output | RS-232 level (nominally ±5.5V) transmitter output. |
| 8 | R2IN | input | RS-232 compatible receiver input. |
| 9 | R2OUT | output | TTL/CMOS level receiver output. |
| 10 | T2IN | input | TTL/CMOS compatible transmitter input. |
| 11 | T1IN | input | TTL/CMOS compatible transmitter input. |
| 12 | R1OUT | output | TTL/CMOS level receiver output. |
| 13 | R1IN | input | RS-232 compatible receiver input. |
| 14 | T1OUT | output | RS-232 level (nominally ±5.5V) transmitter output. |
| 15 | GND | power_in | Ground connection. |
| 16 | VCC | power_in | System power supply input (3.0V to 5.5V). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | RENESAS |
| Package | SOIC-16 |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 16 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| VCC to Ground | VCC | -0.3 | 6 | V | 9 | ||
| V+ to Ground | V+ | -0.3 | 7 | V | 9 | ||
| V- to Ground | V- | 0.3 | -7 | V | 9 | ||
| V+ to V- | V+ - V- | 14 | V | 9 | |||
| Input voltage TIN, FORCEOFF, FORCEON, EN, SHDN | TIN | -0.3 | 6 | V | 9 | ||
| Input voltage RIN | RIN | -25 | 25 | V | 9 | ||
| Output voltage TOUT | TOUT | -13.2 | 13.2 | V | 9 | ||
| Output voltage ROUT, INVALID | ROUT, INVALID | -0.3 | V | upper limit VCC+0.3 | 9 | ||
| Maximum Junction Temperature (Plastic Package) | TJ | 150 | °C | 9 | |||
| Maximum Storage Temperature Range | TSTG | -65 | 150 | °C | 9 | ||
| Thermal Resistance θJA, 16 Ld Narrow SOIC | θJA | 115 | °C/W | 16 Ld Narrow SOIC Package, typical | 9 | ||
| Temperature Range ICL32xxIx | TA | -40 | 85 | °C | ICL32xxIx | 10 | |
| Supply Current, Automatic Power-Down Disabled | ICC | 0.3 | 1 | mA | All outputs unloaded, FORCEON = FORCEOFF = SHDN = VCC; VCC = 3.15V, ICL3221-32; 25°C | 10 | |
| Input Logic Threshold Low | VIL | 0.8 | V | TIN, FORCEON, FORCEOFF, EN, SHDN; Full temp | 10 | ||
| Input Logic Threshold High, VCC=3.3V | VIH | 2 | V | VCC = 3.3V; TIN, FORCEON, FORCEOFF, EN, SHDN; Full temp | 10 | ||
| Input Logic Threshold High, VCC=5.0V | VIH | 2.4 | V | VCC = 5.0V; TIN, FORCEON, FORCEOFF, EN, SHDN; Full temp | 10 | ||
| Input Leakage Current | IIL | -1 | 0.01 | 1 | µA | TIN, FORCEON, FORCEOFF, EN, SHDN; Full temp | 10 |
| Output Voltage Low | VOL | 0.4 | V | IOUT = 1.6mA; Full temp | 10 | ||
| Input Threshold Low, VCC=3.3V | VIN_TH_L | 0.6 | 1.2 | V | VCC = 3.3V; 25°C | 10 | |
| Input Threshold Low, VCC=5.0V | VIN_TH_L | 0.8 | 1.5 | V | VCC = 5.0V; 25°C | 10 | |
| Input Threshold High, VCC=3.3V | VIN_TH_H | 1.5 | 2.4 | V | VCC = 3.3V; 25°C | 10 | |
| Input Threshold High, VCC=5.0V | VIN_TH_H | 1.8 | 2.4 | V | VCC = 5.0V; 25°C | 10 | |
| Input Hysteresis | VHYS | 0.3 | V | 25°C | 10 | ||
| Receiver Input Voltage Range | VRIN | -25 | 25 | V | Full temp | 10 | |
| Input Resistance | RIN | 3 | 5 | 7 | kΩ | 25°C | 11 |
| Transmitter Output Voltage Swing | VO | 5 | 5.4 | V | All transmitter outputs loaded with 3kΩ to ground; Full temp | 11 | |
| Output Short-Circuit Current | IOS | -60 | 35 | 60 | mA | Full temp | 11 |
| Output Leakage Current | IOLK | -25 | 25 | µA | VOUT = ±12V, VCC = 0V or 3V to 5.5V; Automatic Powerdown or FORCEOFF = SHDN = GND; Full temp | 11 | |
| Maximum Data Rate | 250 | 500 | kbps | RL = 3kΩ, CL = 1000pF, one transmitter switching; Full temp | 11 | ||
| Receiver Propagation Delay tPHL | tPHL | 0.3 | µs | Receiver input to receiver output, CL = 150pF; 25°C | 11 | ||
| Receiver Propagation Delay tPLH | tPLH | 0.3 | µs | Receiver input to receiver output, CL = 150pF; 25°C | 11 | ||
| Receiver Skew tPHL - tPLH | 100 | 500 | ns | Full temp | 11 | ||
| Transition Region Slew Rate, CL=200pF to 2500pF | SR | 4 | 8 | 30 | V/µs | VCC = 3.3V, RL = 3kΩ to 7kΩ, measured from 3V to -3V or -3V to 3V, CL = 200pF to 2500pF; 25°C | 11 |
| Transition Region Slew Rate, CL=200pF to 1000pF | SR | 6 | 30 | V/µs | VCC = 3.3V, RL = 3kΩ to 7kΩ, measured from 3V to -3V or -3V to 3V, CL = 200pF to 1000pF; 25°C | 11 | |
| ESD RS-232 Pins Human Body Model | -15 | 15 | kV | TOUT, RIN; ICL3221 - ICL3243; 25°C | 11 | ||
| ESD RS-232 Pins IEC61000-4-2 Contact Discharge | -8 | 8 | kV | TOUT, RIN; ICL3221 - ICL3243; 25°C | 11 | ||
| ESD RS-232 Pins IEC61000-4-2 Air Gap Discharge | -8 | 8 | kV | TOUT, RIN; ICL3221 - ICL3232; 25°C | 11 | ||
| ESD All Other Pins Human Body Model | -2 | 2 | kV | All other pins; ICL3221 - ICL3243; 25°C | 11 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | C2- External capacitor (voltage inverter) is connected to this lead. TIN TTL/CMOS compatible transmitter Inputs. | 8 |
CAD (KiCad official)
- Symbol:
ICL3232IBNZ-T - Footprint:
Package_SO:SOIC-16_3.9x9.9mm_P1.27mm - 3D model: SOIC-16 (KiCad packages3D, STEP)
- 3D model files:
icl3232ibnz-t-etched.step/icl3232ibnz-t-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);icl3232ibnz-t.step/icl3232ibnz-t.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: RENESAS datasheet (36 pp, sha256
b2a9e9447525ad5b, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).