component
IBSP3030ADJDN10R00
Public Made by Adomby adom
Inbisen Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, DFN-10-EP(3x3). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Made with KiCad 10.0 · needs KiCad 10.0 or later to open · KiCad file format 20260206
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IBSP3030ADJDN10R00
Inbisen · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · DFN-10-EP(3x3)
IBSP3030ADJDN10R00 from Inbisen, in a DFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | IN | power_in | Regulator supply input with absolute maximum rating of -0.3V to 22V, requiring an input bypass capacitor and operating from a minimum of 2.4V to 20V. |
| 2 | IN | power_in | Regulator supply input (second IN pin, internally tied to pin 1) with absolute maximum rating of -0.3V to 22V, requiring an input bypass capacitor. |
| 3 | EN/UV | input | Enable and UVLO input: pulling low (below the typical 1.2V rising threshold, 100mV hysteresis) puts the device in shutdown with quiescent current below 1µA and the output off; do not leave floating, and tie to IN if soft shutdown is not needed; absolute maximum -0.3V to 22V. |
| 4 | PG | output | Open-collector power-good indicator that is pulled low when PGFB is below 300mV and left floating if unused; do not drive it more than 0.3V below GND, with absolute maximum -0.3V to 22V. |
| 5 | ILIM | input | Current-limit programming pin where a resistor to GND (Kelvin-connected) sets the limit, providing a 1:400 output-current-proportional signal and a 0V to 300mV monitor range; tie to GND if unused, do not drive more than 0.3V below GND, and the absolute maximum is -0.3V to 1V. |
| 6 | PGFB | input | Power-good feedback where PG goes high when PGFB rises above 300mV (10mV falling hysteresis), with threshold set by an OUT-PGFB-GND divider as 0.3V×(1+Rpgfb1/Rpgfb2); the application note requires PGFB to stay above 330mV, and tying it to IN disables power-good and soft-start functions, with absolute maximum -0.3V to 22V. |
| 7 | SET | output | Error-amplifier inverting input and regulation setpoint driven by a precision 100µA current source, so VOUT ≈ ISET×RSET; an optional capacitor to GND improves noise, PSRR and transient response at the cost of startup time, with absolute maximum -0.3V to 16V. |
| 8 | GND | power_in | Ground connection that must be tied directly to the output and SET capacitor grounds per the layout guidance. |
| 9 | OUTS | input | Output sense input connected to the non-inverting input of the internal error amplifier, which should be Kelvin-connected directly to the output capacitor and load, with absolute maximum -0.3V to 16V. |
| 10 | OUT | power_out | Regulator output that supplies the load and requires a minimum 4.7µF output capacitor with ESR below 50mΩ and ESL below 1nH for stability, with absolute maximum -0.3V to 16V. |
| 11 | GND | power_in | Exposed thermal pad that must be soldered to a large copper ground area with at least 85% solder coverage of the EPAD area to meet thermal and electrical performance specifications. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Inbisen |
| Package | DFN-10-EP(3x3) |
| Category | Power Management (PMIC) |
| Pins | 11 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Minimum input voltage (VIN UVLO rising) | VIN | 2.4 | V | ILOAD = 200mA, VIN UVLO rising | 4 | ||
| Dropout voltage | VDO | 300 | mV | ILOAD = 1mA, 50mA | 4 | ||
| Dropout voltage | VDO | 330 | mV | ILOAD = 150mA | 4 | ||
| Dropout voltage | VDO | 350 | mV | ILOAD = 200mA | 4 | ||
| Operating supply current | IGND | 2.7 | mA | ILOAD = 10μA | 4 | ||
| Operating supply current | IGND | 3 | 4 | mA | ILOAD = 10mA | 4 | |
| Operating supply current | IGND | 4 | 6 | mA | ILOAD = 50mA | 4 | |
| Operating supply current | IGND | 4.7 | 9 | mA | ILOAD = 100mA | 4 | |
| Operating supply current | IGND | 6.3 | 18 | mA | ILOAD = 200mA | 4 | |
| Shutdown current | ISD | 0.8 | 1 | μA | VEN/UV = 0V, VIN = 4V | 4 | |
| PGFB threshold (rising) | VPGFB | 290 | 300 | 310 | mV | PGFB threshold rising | 4 |
| PG output low voltage | VPG | 20 | 60 | mV | IPG = 100μA | 4 | |
| Input voltage range | VIN | 2.4 | 20 | V | Wide input voltage range as stated in features | 1 | |
| Output voltage range (adjustable) | VOUT | 0.5 | 16 | V | Set via external resistor on SET pin, see ordering info | 1 | |
| Output capacitor | COUT | 4.7 | μF | Ceramic, minimum value at OUT pin, recommended X7R or better | 3 | ||
| Output capacitor ESR | ESR | 50 | mΩ | Output capacitor at OUT pin | 3 | ||
| Output capacitor ESL | ESL | 1 | nH | Output capacitor at OUT pin | 3 | ||
| Operating ambient temperature | TA | -40 | 120 | ℃ | 工作环境温度(TA)范围 | 14 | |
| Storage temperature | TSTG | -50 | 150 | ℃ | 14 | ||
| Junction temperature | TJ | 150 | ℃ | 14 | |||
| Voltage on IN pin | IN | -0.3 | 22 | V | Pin rating per pin definition table | 2 | |
| Voltage on EN/UV pin | EN/UV | -0.3 | 22 | V | Pin rating per pin definition table | 2 | |
| Voltage on PG pin | PG | -0.3 | 22 | V | Pin rating per pin definition table | 2 | |
| Voltage on ILIM pin | ILIM | -0.3 | 1 | V | Pin rating per pin definition table | 2 | |
| Voltage on PGFB pin | PGFB | -0.3 | 22 | V | Pin rating per pin definition table | 3 | |
| Voltage on SET pin | SET | -0.3 | 16 | V | Pin rating per pin definition table | 3 | |
| Voltage on OUTS pin | OUTS | -0.3 | 16 | V | Pin rating per pin definition table | 3 | |
| Voltage on OUT pin | OUT | -0.3 | 16 | V | Pin rating per pin definition table | 3 | |
| Thermal resistance junction-to-ambient (DFN10) | RθJA | 33.5 | ℃/W | DFN10, 4-layer PCB 1.6mm, board area 3600mm², top copper 3600mm², bottom copper 3600mm², 25℃ ambient | 13 | ||
| Thermal resistance junction-to-ambient (DFN10) | RθJA | 36.2 | ℃/W | DFN10, 4-layer PCB 1.6mm, board area 100mm², top copper 3600mm², bottom copper 3600mm², 25℃ ambient | 13 |
CAD (KiCad official)
- Symbol:
IBSP3030ADJDN10R00 - Footprint:
Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm - 3D model: DFN-10-EP(3x3) (KiCad packages3D, STEP)
- 3D model files:
ibsp3030adjdn10r00-etched.step/ibsp3030adjdn10r00-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ibsp3030adjdn10r00.step/ibsp3030adjdn10r00.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Inbisen datasheet (17 pp, sha256
1e79d3c30a081e30, retrieved 2026-10-18, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).