component
HYG800P10LR1D
Public Made by Adomby adom
HUAYI MOSFETs, TO-252-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HYG800P10LR1D
HUAYI · MOSFETs · TO-252-2L
HYG800P10LR1D from HUAYI, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V, with threshold VGS(th) of -1.0 to -3.0 V at IDS=-250uA. |
| 2 | D | passive | Drain, connected to the exposed tab; drain-source voltage rated -100 V and continuous drain current -20 A at Tc=25°C. |
| 3 | S | passive | Source; continuous source current of -20 A at Tc=25°C, with the body diode forward voltage at most -1.2 V at ISD=-10A. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUAYI |
| Package | TO-252-2L |
| Category | Transistors/Thyristors |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | -100 | V | 2 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 2 | ||
| Maximum Junction Temperature | TJ | 175 | °C | 2 | |||
| Storage Temperature Range | TSTG | -55 | 175 | °C | 2 | ||
| Drain Current-Continuous | IS | -20 | A | Tc=25°C; Mounted on Large Heat Sink | 2 | ||
| Pulsed Drain Current | IDM | -75 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | -20 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | -14.1 | A | Tc=100°C | 2 | ||
| Maximum Power Dissipation | PD | 75 | W | Tc=25°C | 2 | ||
| Maximum Power Dissipation | PD | 37.5 | W | Tc=100°C | 2 | ||
| Thermal Resistance, Junction-to-Case | RJC | 2 | °C/W | 2 | |||
| Thermal Resistance, Junction-to-Ambient | RJA | 110 | °C/W | Surface mounted on FR-4 board | 2 | ||
| Single Pulsed-Avalanche Energy | EAS | 82.9 | mJ | L=0.3mH | 2 | ||
| Drain-Source Breakdown Voltage | BVDSS | -100 | V | VGS=0V,IDS=-250uA | 2 | ||
| Drain-to-Source Leakage Current | IDSS | -1 | uA | VDS=-100V, VGS=0V | 2 | ||
| Drain-to-Source Leakage Current | IDSS | -50 | uA | TJ=125°C | 2 | ||
| Gate Threshold Voltage | VGS(th) | -1 | -1.8 | -3 | V | VDS=VGS, IDS=-250uA | 2 |
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V,VDS=0V | 2 | |
| Drain-Source On-state Resistance | RDS(ON) | 77 | 98 | mΩ | VGS=-10V,ID= -10A | 2 | |
| Drain-Source On-state Resistance | RDS(ON) | 86 | 110 | mΩ | VGS=-4.5V,ID= -10A | 2 | |
| Diode Forward Voltage | VSD | -0.82 | -1.2 | V | ISD= -10A,VGS=0V | 2 |
CAD (KiCad official)
- Symbol:
HYG800P10LR1D - Footprint:
Package_TO_SOT_SMD:TO-252-2 - 3D model: TO-252-2L (KiCad packages3D, STEP)
- 3D model files:
hyg800p10lr1d-etched.step/hyg800p10lr1d-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hyg800p10lr1d.step/hyg800p10lr1d.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HUAYI datasheet (11 pp, sha256
70ad5bad067d8d58, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HYG800P10LR1D
**HUAYI** · MOSFETs · TO-252-2L
HYG800P10LR1D from HUAYI, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate; gate-source voltage limited to ±20 V, with threshold VGS(th) of -1.0 to -3.0 V at IDS=-250uA. |
| 2 | D | passive | Drain, connected to the exposed tab; drain-source voltage rated -100 V and continuous drain current -20 A at Tc=25°C. |
| 3 | S | passive | Source; continuous source current of -20 A at Tc=25°C, with the body diode forward voltage at most -1.2 V at ISD=-10A. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUAYI |
| Package | TO-252-2L |
| Category | Transistors/Thyristors |
| Pins | 3 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | | | -100 | V | | 2 |
| Gate-Source Voltage | VGSS | -20 | | 20 | V | | 2 |
| Maximum Junction Temperature | TJ | | | 175 | °C | | 2 |
| Storage Temperature Range | TSTG | -55 | | 175 | °C | | 2 |
| Drain Current-Continuous | IS | | | -20 | A | Tc=25°C; Mounted on Large Heat Sink | 2 |
| Pulsed Drain Current | IDM | | | -75 | A | Tc=25°C | 2 |
| Continuous Drain Current | ID | | | -20 | A | Tc=25°C | 2 |
| Continuous Drain Current | ID | | | -14.1 | A | Tc=100°C | 2 |
| Maximum Power Dissipation | PD | | | 75 | W | Tc=25°C | 2 |
| Maximum Power Dissipation | PD | | | 37.5 | W | Tc=100°C | 2 |
| Thermal Resistance, Junction-to-Case | RJC | | | 2 | °C/W | | 2 |
| Thermal Resistance, Junction-to-Ambient | RJA | | | 110 | °C/W | Surface mounted on FR-4 board | 2 |
| Single Pulsed-Avalanche Energy | EAS | | | 82.9 | mJ | L=0.3mH | 2 |
| Drain-Source Breakdown Voltage | BVDSS | -100 | | | V | VGS=0V,IDS=-250uA | 2 |
| Drain-to-Source Leakage Current | IDSS | | | -1 | uA | VDS=-100V, VGS=0V | 2 |
| Drain-to-Source Leakage Current | IDSS | | | -50 | uA | TJ=125°C | 2 |
| Gate Threshold Voltage | VGS(th) | -1 | -1.8 | -3 | V | VDS=VGS, IDS=-250uA | 2 |
| Gate-Source Leakage Current | IGSS | -100 | | 100 | nA | VGS=±20V,VDS=0V | 2 |
| Drain-Source On-state Resistance | RDS(ON) | | 77 | 98 | mΩ | VGS=-10V,ID= -10A | 2 |
| Drain-Source On-state Resistance | RDS(ON) | | 86 | 110 | mΩ | VGS=-4.5V,ID= -10A | 2 |
| Diode Forward Voltage | VSD | | -0.82 | -1.2 | V | ISD= -10A,VGS=0V | 2 |
## CAD (KiCad official)
- Symbol: `HYG800P10LR1D`
- Footprint: `Package_TO_SOT_SMD:TO-252-2`
- 3D model: TO-252-2L (KiCad packages3D, STEP)
- 3D model files: `hyg800p10lr1d-etched.step` / `hyg800p10lr1d-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hyg800p10lr1d.step` / `hyg800p10lr1d.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HUAYI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588904265519665152) (11 pp, sha256 `70ad5bad067d8d58`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hyg800p10lr1d-datasheet.pdf)