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Ray Publish 0.1.0 8976fa0 17d ago

HYG180N10LS1D

HUAYI · MOSFETs · TO-252-2L

HYG180N10LS1D from HUAYI, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, with VGS(th) of 1.0 V min to 3.0 V max at 250 µA and an absolute maximum VGSS of ±20 V.
2 D passive Drain, shown as the middle position and the exposed tab on TO-252-2L; rated 100 V VDSS and 45 A continuous at Tc=25°C.
3 S passive Source; carries the 45 A continuous body-diode source current (IS) at Tc=25°C and is the return for the gate drive.

Key specifications

Parameter Value
Manufacturer HUAYI
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 100 V VGS=0V, IDS=250μA 2
Drain-to-Source Leakage Current IDSS 1 μA VDS=100V, VGS=0V 2
Drain-to-Source Leakage Current IDSS 50 μA TJ=100°C 2
Gate Threshold Voltage VGS(th) 1 1.9 3 V VDS=VGS, IDS=250μA 2
Gate-Source Leakage Current IGSS 100 nA VGS=±20V, VDS=0V 2
Drain-Source On-State Resistance RDS(ON) 16 21 mΩ VGS=10V, IDS=25A 2
Drain-Source On-State Resistance RDS(ON) 24 30 mΩ VGS=6V, IDS=20A 2
Diode Forward Voltage VSD 0.94 1.3 V ISD=25A, VGS=0V 2
Gate-Source Voltage VGSS -20 20 V 2
Drain-Source Voltage VDSS 100 V 2
Maximum Junction Temperature TJ 175 °C 2
Storage Temperature Range TSTG -55 175 °C 2
Source Current-Continuous (Body Diode) IS 45 A Tc=25°C, mounted on large heat sink 2
Pulsed Drain Current IDM 150 A Tc=25°C 2
Continuous Drain Current ID 45 A Tc=25°C 2
Continuous Drain Current ID 31 A Tc=100°C 2
Maximum Power Dissipation PD 71.4 W Tc=25°C 2
Maximum Power Dissipation PD 35.7 W Tc=100°C 2
Single Pulsed-Avalanche Energy EAS 62.1 mJ L=0.3mH 2
Thermal Resistance, Junction-to-Case RθJC 2.1 °C/W 2
Thermal Resistance, Junction-to-Ambient RθJA 110 °C/W Surface mounted on FR-4 board 2

CAD (KiCad official)

  • Symbol: HYG180N10LS1D
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: hyg180n10ls1d-etched.step / hyg180n10ls1d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hyg180n10ls1d.step / hyg180n10ls1d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HUAYI datasheet (9 pp, sha256 cbf7819878db0b3c, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF