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HYG067N07NQ1D

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HUAYI MOSFETs, TO-252-2L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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HYG067N07NQ1D

HUAYI · MOSFETs · TO-252-2L

HYG067N07NQ1D from HUAYI, in a TO-252-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; drives the MOSFET with VGS rated ±20 V, threshold 2 to 4 V at IDS=250 µA.
2 D passive Drain, the center position and the exposed tab; rated for VDSS 68 V and 70 A continuous at Tc=25°C.
3 S passive Source; also the body-diode anode, carrying source current up to 70 A continuous at Tc=25°C.

Key specifications

Parameter Value
Manufacturer HUAYI
Package TO-252-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 68 V VGS=0V, IDS=250μA 2
Drain-to-Source Leakage Current IDSS 1 μA VDS=68V, VGS=0V 2
Drain-to-Source Leakage Current IDSS 50 μA TJ=125°C 2
Gate Threshold Voltage VGS(th) 2 3 4 V VDS=VGS, IDS=250μA 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V, VDS=0V 2
Drain-Source On-State Resistance RDS(ON) 6.8 8.3 mΩ VGS=10V, IDS=30A 2
Diode Forward Voltage VSD 0.83 1.1 V ISD=30A, VGS=0V 2
Drain-Source Voltage VDSS 68 V 2
Gate-Source Voltage VGSS -20 20 V 2
Maximum Junction Temperature TJ -55 175 °C 2
Storage Temperature Range TSTG -55 175 °C 2
Source Current-Continuous (Body Diode) IS 70 A Tc=25°C; Mounted on Large Heat Sink 2
Pulsed Drain Current IDM 210 A Tc=25°C 2
Continuous Drain Current ID 70 A Tc=25°C 2
Continuous Drain Current ID 49 A Tc=100°C 2
Maximum Power Dissipation PD 93 W Tc=25°C 2
Maximum Power Dissipation PD 46 W Tc=100°C 2
Single Pulsed-Avalanche Energy EAS 192 mJ L=0.3mH 2
Thermal Resistance, Junction-to-Case RJC 1.6 °C/W 2
Thermal Resistance, Junction-to-Ambient RJA 110 °C/W Surface mounted on 1in2 FR-4 board 2

CAD (KiCad official)

  • Symbol: HYG067N07NQ1D
  • Footprint: Package_TO_SOT_SMD:TO-252-2
  • 3D model: TO-252-2L (KiCad packages3D, STEP)
  • 3D model files: hyg067n07nq1d-etched.step / hyg067n07nq1d-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hyg067n07nq1d.step / hyg067n07nq1d.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HUAYI datasheet (11 pp, sha256 69a18c4e94f52abd, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF