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HYG028N10NS1B6
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HUAYI MOSFETs, TO-263-6. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HYG028N10NS1B6
HUAYI · MOSFETs · TO-263-6
HYG028N10NS1B6 from HUAYI, in a TO-263-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET, with gate-source voltage rated at ±20 V and a threshold of 2 V min to 4 V max at 250 µA. |
| 2 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
| 3 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
| 4 | D | passive | Drain terminal (the short center lead, which the datasheet's symbol shows as pin 4), rated for 100 V drain-source voltage and 230 A continuous at Tc=25°C. |
| 5 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
| 6 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
| 7 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUAYI |
| Package | TO-263-6 |
| Category | Transistors/Thyristors |
| Pins | 7 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 100 | V | VGS=0V,IDS=250μA | 2 | ||
| Drain-to-Source Leakage Current | IDSS | 1 | μA | VDS=100V,VGS=0V | 2 | ||
| Drain-to-Source Leakage Current (TJ=125°C) | IDSS | 50 | μA | VDS=100V,VGS=0V, TJ=125°C | 2 | ||
| Gate Threshold Voltage | VGS(th) | 2 | 3 | 4 | V | VDS=VGS, IDS=250μA | 2 |
| Gate-Source Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V,VDS=0V | 2 | |
| Drain-Source On-State Resistance | RDS(ON) | 2.4 | 3.1 | mΩ | VGS=10V,IDS=50A | 2 | |
| Diode Forward Voltage | VSD | 0.84 | 1.3 | V | ISD=50A,VGS=0V | 2 | |
| Drain-Source Voltage | VDSS | 100 | V | 2 | |||
| Gate-Source Voltage | VGSS | -20 | 20 | V | 2 | ||
| Maximum Junction Temperature | TJ | -55 | 175 | °C | 2 | ||
| Storage Temperature Range | TSTG | -55 | 175 | °C | 2 | ||
| Source Current-Continuous (Body Diode) | IS | 230 | A | Tc=25°C, mounted on large heat sink | 2 | ||
| Pulsed Drain Current | IDM | 750 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | 230 | A | Tc=25°C | 2 | ||
| Continuous Drain Current | ID | 162 | A | Tc=100°C | 2 | ||
| Maximum Power Dissipation | PD | 300 | W | Tc=25°C | 2 | ||
| Maximum Power Dissipation | PD | 150 | W | Tc=100°C | 2 | ||
| Thermal Resistance, Junction-to-Case | RJC | 0.5 | °C/W | 2 | |||
| Thermal Resistance, Junction-to-Ambient | RJA | 60 | °C/W | Surface mounted on FR-4 board | 2 | ||
| Single Pulsed-Avalanche Energy | EAS | 1324.3 | mJ | L=0.3mH | 2 |
CAD (KiCad official)
- Symbol:
HYG028N10NS1B6 - Footprint:
Package_TO_SOT_SMD:TO-263-6 - 3D model: TO-263-6 (KiCad packages3D, STEP)
- 3D model files:
hyg028n10ns1b6-etched.step/hyg028n10ns1b6-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hyg028n10ns1b6.step/hyg028n10ns1b6.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HUAYI datasheet (9 pp, sha256
77c3b6098f30442c, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HYG028N10NS1B6
**HUAYI** · MOSFETs · TO-263-6
HYG028N10NS1B6 from HUAYI, in a TO-263-6. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the N-channel MOSFET, with gate-source voltage rated at ±20 V and a threshold of 2 V min to 4 V max at 250 µA. |
| 2 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
| 3 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
| 4 | D | passive | Drain terminal (the short center lead, which the datasheet's symbol shows as pin 4), rated for 100 V drain-source voltage and 230 A continuous at Tc=25°C. |
| 5 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
| 6 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
| 7 | S | passive | Source terminal, one of the pins 2, 3, 5, 6 and 7 tied together as source, with continuous drain current of 230 A at Tc=25°C. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUAYI |
| Package | TO-263-6 |
| Category | Transistors/Thyristors |
| Pins | 7 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 100 | | | V | VGS=0V,IDS=250μA | 2 |
| Drain-to-Source Leakage Current | IDSS | | | 1 | μA | VDS=100V,VGS=0V | 2 |
| Drain-to-Source Leakage Current (TJ=125°C) | IDSS | | | 50 | μA | VDS=100V,VGS=0V, TJ=125°C | 2 |
| Gate Threshold Voltage | VGS(th) | 2 | 3 | 4 | V | VDS=VGS, IDS=250μA | 2 |
| Gate-Source Leakage Current | IGSS | -100 | | 100 | nA | VGS=±20V,VDS=0V | 2 |
| Drain-Source On-State Resistance | RDS(ON) | | 2.4 | 3.1 | mΩ | VGS=10V,IDS=50A | 2 |
| Diode Forward Voltage | VSD | | 0.84 | 1.3 | V | ISD=50A,VGS=0V | 2 |
| Drain-Source Voltage | VDSS | | | 100 | V | | 2 |
| Gate-Source Voltage | VGSS | -20 | | 20 | V | | 2 |
| Maximum Junction Temperature | TJ | -55 | | 175 | °C | | 2 |
| Storage Temperature Range | TSTG | -55 | | 175 | °C | | 2 |
| Source Current-Continuous (Body Diode) | IS | | | 230 | A | Tc=25°C, mounted on large heat sink | 2 |
| Pulsed Drain Current | IDM | | | 750 | A | Tc=25°C | 2 |
| Continuous Drain Current | ID | | | 230 | A | Tc=25°C | 2 |
| Continuous Drain Current | ID | | | 162 | A | Tc=100°C | 2 |
| Maximum Power Dissipation | PD | | | 300 | W | Tc=25°C | 2 |
| Maximum Power Dissipation | PD | | | 150 | W | Tc=100°C | 2 |
| Thermal Resistance, Junction-to-Case | RJC | | | 0.5 | °C/W | | 2 |
| Thermal Resistance, Junction-to-Ambient | RJA | | | 60 | °C/W | Surface mounted on FR-4 board | 2 |
| Single Pulsed-Avalanche Energy | EAS | | | 1324.3 | mJ | L=0.3mH | 2 |
## CAD (KiCad official)
- Symbol: `HYG028N10NS1B6`
- Footprint: `Package_TO_SOT_SMD:TO-263-6`
- 3D model: TO-263-6 (KiCad packages3D, STEP)
- 3D model files: `hyg028n10ns1b6-etched.step` / `hyg028n10ns1b6-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hyg028n10ns1b6.step` / `hyg028n10ns1b6.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HUAYI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588945666139959296) (9 pp, sha256 `77c3b6098f30442c`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hyg028n10ns1b6-datasheet.pdf)