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HYG023N04LS1B

HUAYI · MOSFETs · TO-263-2L

HYG023N04LS1B from HUAYI, in a TO-263-2L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; drive limit is VGSS ±20 V, with gate threshold VGS(th) of 1 V min, 1.9 V typ and 3 V max at VDS=VGS, IDS=250 μA.
2 D passive Drain, shown as the middle G-D-S label and the tab; VDSS is 40 V, with continuous drain current of 170 A at Tc=25°C.
3 S passive Source; continuous body-diode source current is 170 A at Tc=25°C.

Key specifications

Parameter Value
Manufacturer HUAYI
Package TO-263-2L
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSS 40 V 2
Gate-Source Voltage VGSS -20 20 V 2
Junction Temperature Range TJ -55 175 °C 2
Storage Temperature Range TSTG -55 175 °C 2
Source Current-Continuous (Body Diode) IS 170 A Tc=25°C 2
Pulsed Drain Current IDM 570 A Tc=25°C 2
Continuous Drain Current ID 170 A Tc=25°C 2
Continuous Drain Current ID 120 A Tc=100°C 2
Maximum Power Dissipation PD 150 W Tc=25°C 2
Maximum Power Dissipation PD 75 W Tc=100°C 2
Thermal Resistance, Junction-to-Case RJC 1 °C/W 2
Thermal Resistance, Junction-to-Ambient RJA 62.5 °C/W Surface mounted on 1in2 FR-4 board 2
Single Pulsed-Avalanche Energy EAS 450 mJ L=0.3mH 2
Drain-Source Breakdown Voltage BVDSS 40 V VGS=0V,IDS= 250μA 2
Drain-to-Source Leakage Current IDSS 1 μA VDS=40V,VGS=0V 2
Drain-to-Source Leakage Current IDSS 50 μA TJ=125°C 2
Gate Threshold Voltage VGS(th) 1 1.9 3 V VDS=VGS, IDS= 250μA 2
Gate-Source Leakage Current IGSS -100 100 nA VGS=±20V,VDS=0V 2
Drain-Source On-State Resistance RDS(ON) 2.1 2.6 mΩ VGS= 10V,IDS= 40A 2
Drain-Source On-State Resistance RDS(ON) 2.9 3.5 mΩ VGS= 4.5V,IDS= 40A 2
Diode Forward Voltage VSD 0.8 1.2 V ISD=40A,VGS=0V 2

CAD (KiCad official)

  • Symbol: HYG023N04LS1B
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263-2L (KiCad packages3D, STEP)
  • 3D model files: hyg023n04ls1b-etched.step / hyg023n04ls1b-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hyg023n04ls1b.step / hyg023n04ls1b.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HUAYI datasheet (10 pp, sha256 6960e44f5697164b, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF