component
HY1106S
Public Made by Adomby adom
HUAYI MOSFETs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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HY1106S
HUAYI · MOSFETs · SOP-8
HY1106S from HUAYI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source of the N-channel MOSFET, tied to the other source pins (pins 1-3). |
| 2 | S | passive | Source of the N-channel MOSFET, tied to the other source pins (pins 1-3). |
| 3 | S | passive | Source of the N-channel MOSFET, tied to the other source pins (pins 1-3). |
| 4 | G | input | Gate of the N-channel MOSFET; gate-source voltage rated ±20 V. |
| 5 | D | passive | Drain of the N-channel MOSFET, tied to the other drain pins (pins 5-8). |
| 6 | D | passive | Drain of the N-channel MOSFET, tied to the other drain pins (pins 5-8). |
| 7 | D | passive | Drain of the N-channel MOSFET, tied to the other drain pins (pins 5-8). |
| 8 | D | passive | Drain of the N-channel MOSFET, tied to the other drain pins (pins 5-8). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUAYI |
| Package | SOP-8 |
| Category | Transistors |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 60 | V | VGS=0V, IDS=250μA | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 1 | μA | VDS=60V, VGS=0V | 2 | ||
| Zero Gate Voltage Drain Current | IDSS | 30 | μA | TJ=85°C | 2 | ||
| Gate Threshold Voltage | VGS(th) | 1 | 2 | 3 | V | VDS=VGS, IDS=250μA | 2 |
| Gate Leakage Current | IGSS | -100 | 100 | nA | VGS=±20V, VDS=0V | 2 | |
| Diode Forward Voltage | VSD | 0.7 | 1 | V | VGS=0V | 2 | |
| Drain-Source Voltage | VDSS | 60 | V | TC=25°C | 2 | ||
| Gate-Source Voltage | VGSS | -20 | 20 | V | TC=25°C | 2 | |
| Maximum Junction Temperature | TJ | 175 | °C | 2 | |||
| Storage Temperature Range | TSTG | -55 | 175 | °C | 2 | ||
| Maximum Power Dissipation | PD | 3.5 | W | TC=25°C | 2 | ||
| Maximum Power Dissipation | PD | 2.4 | W | TC=70°C | 2 | ||
| Thermal Resistance-Junction to Case | RθJC | 43 | °C/W | 2 | |||
| Thermal Resistance-Junction to Ambient | RθJA | 75 | °C/W | 2 | |||
| Drain-Source On-state Resistance | RDS(ON) | 11 | mΩ | VGS=10V | 1 | ||
| Drain-Source On-state Resistance | RDS(ON) | 13.5 | mΩ | VGS=4.5V | 1 | ||
| Gate Resistance | RG | 1 | Ω | VGS=0V,VDS=0V,F=1MHz | 3 | ||
| Gate-Source Charge | Qgs | 6.4 | nC | VGS=10V | 3 | ||
| Gate-Drain Charge | Qgd | 15.3 | nC | VGS=10V | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Note: lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. lead-free products meet or exceed the lead-fre | 1 |
CAD (KiCad official)
- Symbol:
HY1106S - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hy1106s-etched.step/hy1106s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hy1106s.step/hy1106s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HUAYI datasheet (12 pp, sha256
2459536919648e35, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# HY1106S
**HUAYI** · MOSFETs · SOP-8
HY1106S from HUAYI, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | S | passive | Source of the N-channel MOSFET, tied to the other source pins (pins 1-3). |
| 2 | S | passive | Source of the N-channel MOSFET, tied to the other source pins (pins 1-3). |
| 3 | S | passive | Source of the N-channel MOSFET, tied to the other source pins (pins 1-3). |
| 4 | G | input | Gate of the N-channel MOSFET; gate-source voltage rated ±20 V. |
| 5 | D | passive | Drain of the N-channel MOSFET, tied to the other drain pins (pins 5-8). |
| 6 | D | passive | Drain of the N-channel MOSFET, tied to the other drain pins (pins 5-8). |
| 7 | D | passive | Drain of the N-channel MOSFET, tied to the other drain pins (pins 5-8). |
| 8 | D | passive | Drain of the N-channel MOSFET, tied to the other drain pins (pins 5-8). |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HUAYI |
| Package | SOP-8 |
| Category | Transistors |
| Pins | 8 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | BVDSS | 60 | | | V | VGS=0V, IDS=250μA | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 1 | μA | VDS=60V, VGS=0V | 2 |
| Zero Gate Voltage Drain Current | IDSS | | | 30 | μA | TJ=85°C | 2 |
| Gate Threshold Voltage | VGS(th) | 1 | 2 | 3 | V | VDS=VGS, IDS=250μA | 2 |
| Gate Leakage Current | IGSS | -100 | | 100 | nA | VGS=±20V, VDS=0V | 2 |
| Diode Forward Voltage | VSD | | 0.7 | 1 | V | VGS=0V | 2 |
| Drain-Source Voltage | VDSS | | | 60 | V | TC=25°C | 2 |
| Gate-Source Voltage | VGSS | -20 | | 20 | V | TC=25°C | 2 |
| Maximum Junction Temperature | TJ | | | 175 | °C | | 2 |
| Storage Temperature Range | TSTG | -55 | | 175 | °C | | 2 |
| Maximum Power Dissipation | PD | | | 3.5 | W | TC=25°C | 2 |
| Maximum Power Dissipation | PD | | | 2.4 | W | TC=70°C | 2 |
| Thermal Resistance-Junction to Case | RθJC | | | 43 | °C/W | | 2 |
| Thermal Resistance-Junction to Ambient | RθJA | | | 75 | °C/W | | 2 |
| Drain-Source On-state Resistance | RDS(ON) | | 11 | | mΩ | VGS=10V | 1 |
| Drain-Source On-state Resistance | RDS(ON) | | 13.5 | | mΩ | VGS=4.5V | 1 |
| Gate Resistance | RG | | 1 | | Ω | VGS=0V,VDS=0V,F=1MHz | 3 |
| Gate-Source Charge | Qgs | | 6.4 | | nC | VGS=10V | 3 |
| Gate-Drain Charge | Qgd | | 15.3 | | nC | VGS=10V | 3 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Note: lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. lead-free products meet or exceed the lead-fre | 1 |
## CAD (KiCad official)
- Symbol: `HY1106S`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files: `hy1106s-etched.step` / `hy1106s-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hy1106s.step` / `hy1106s.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [HUAYI datasheet](docs/hy1106s-datasheet.pdf) (12 pp, sha256 `2459536919648e35`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/hy1106s-datasheet.pdf)