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Contents

README

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HXC6219B182MR

HXY MOSFET · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-23-5L

HXC6219B182MR from HXY MOSFET, in a SOT-23-5L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VIN power_in Regulator supply input; the absolute maximum input voltage is 8 V and the electrical table gives VIN 6.0 V, with VIN = VOUT + 1 V used for the rated characteristics.
2 VSS power_in Ground reference pin for the regulator (GND).
3 CE input Chip enable; the datasheet states that controlling this pin turns the output off, with shutdown current of 1 µA maximum at VCE = 0 V.
4 NC unconnected No connection (listed as floating / 悬空 in the pin table).
5 VOUT power_out Regulated output; the B182 variant is 1.8 V nominal with 0.98× to 1.02× tolerance and up to 300 mA maximum output current.

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOT-23-5L
Category Power Management (PMIC)
Pins 5

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
输出电压 (output voltage, VOUT(E)) VOUT(E) 0.98 1.02 x VOUT(T) IOUT=40mA, VIN=Vout+1V 3
输入电压 (input voltage) VIN 6 V 3
最大输出电流 (max output current) IOUTmax 300 mA VIN=Vout+1V 3
负载特性 (load regulation) ΔVOUT 20 mV VIN=Vout+1V, 1mA≤IOUT≤100mA 3
压差 (dropout voltage) 1 Vdif1 35 mV IOUT =100mA 3
压差 (dropout voltage) 2 Vdif2 280 mV IOUT =200mA 3
关断电流 (off current) ICEL 1 μA Vce=0V 3
电源电压调整率 (line regulation) ΔVOUT/(ΔVIN•VOUT) 0.2 %/V IOUT =40mA, Vout+1V ≤VIN≤8V 3
输出噪声 (output noise) en 50 uVrms IOUT =40mA,300Hz~50kHz 3
静态电流 (quiescent current) ISS 25 μA VIN=VCE=5V 3
纹波抑制比 (PSRR) PSRR 75 dB Vin= [Vout+1]V +1Vp-pAC, IOUT =40mA, f=1kHz 3
规定输出电压 (specified output voltage, 1.8V variant) VOUT(T) 1.8 V HXC6219B182MR 1
输入电压 最大值 (absolute max input voltage) Vin 8 V 2
输出电流 (absolute max output current) Iout 500 mA 2
最大允许功耗 (max power dissipation) PD 220 mW 2
工作温度 (operating temperature) TOPR -20 60 ℃ 2
存储温度 (storage temperature) Tstg -40 125 ℃ 2
焊接温度 (soldering temperature) Tsolder 260 ℃ 10s 2

CAD (KiCad official)

  • Symbol: HXC6219B182MR
  • Footprint: Package_TO_SOT_SMD:SOT-23-5
  • 3D model: SOT-23-5L (KiCad packages3D, STEP)
  • 3D model files: hxc6219b182mr-etched.step / hxc6219b182mr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hxc6219b182mr.step / hxc6219b182mr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (5 pp, sha256 e31e8d24ee3a50f6, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF