component
HX8552AIDRG
Public Made by Adomby adom
HANSCHIP semiconductor Precision Op Amps, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHX8552AIDRG
HANSCHIP semiconductor · Precision Op Amps · SOP-8
HX8552AIDRG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | OUTA | output | Channel A amplifier output with rail-to-rail swing. |
| 2 | INA- | input | Channel A inverting input; input common-mode range extends from VSS-0.1V to VDD+0.1V. |
| 3 | INA+ | input | Channel A non-inverting input; input common-mode range extends from VSS-0.1V to VDD+0.1V. |
| 4 | VSS | power_in | Negative supply or ground; for dual-supply operation bypass to ground with a 0.1µF ceramic capacitor. |
| 5 | INB+ | input | Channel B non-inverting input; input common-mode range extends from VSS-0.1V to VDD+0.1V. |
| 6 | INB- | input | Channel B inverting input; input common-mode range extends from VSS-0.1V to VDD+0.1V. |
| 7 | OUTB | output | Channel B amplifier output with rail-to-rail swing. |
| 8 | VDD | power_in | Positive supply, 1.8V to 5.5V (absolute max 7.5V VDD to VSS), with a 0.1µF ceramic bypass capacitor placed close to the pin. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | HANSCHIP semiconductor |
| Package | SOP-8 |
| Category | Amplifiers/Comparators |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Offset Voltage (VOS) | VOS | 1 | 30 | µV | 4 | ||
| Input Offset Voltage Drift (∆VOS/∆T) | ∆VOS/∆T | 10 | 50 | nV/℃ | 4 | ||
| Power Supply Voltage (VDD to Vss) | VDD | -0.5 | 7.5 | V | 3 | ||
| Analog Input Voltage (IN+ or IN-) | -0.5 | 0.5 | V | Printed as Vss-0.5V (min) and VDD+0.5V (max); values given as offsets from the supply rails | 3 | ||
| PDB Input Voltage | -0.5 | 7 | V | Printed as Vss-0.5V (min) | 3 | ||
| Operating Temperature Range | -40 | 85 | °C | 3 | |||
| Storage Temperature Range | -55 | 150 | °C | 3 | |||
| Junction Temperature | 160 | °C | 3 | ||||
| Lead Temperature (soldering) | 245 | °C | soldering, 10sec | 3 | |||
| ESD Susceptibility HBM | 6 | KV | HBM | 3 | |||
| ESD Susceptibility MM | 400 | V | MM | 3 | |||
| Single-supply operating voltage | VS | 1.8 | 5.5 | V | Single-supply operation | 1 | |
| Input Bias Current (IB) | IB | 20 | pA | 4 | |||
| Input Offset Current (IOS) | IOS | 10 | pA | 4 | |||
| Common-Mode Rejection Ratio (CMRR) | CMRR | 110 | dB | VCM = 0V to 5V | 4 | ||
| Large Signal Voltage Gain (AVO) | AVO | 145 | dB | RL = 10kΩ, VO = 0.3V to 4.7V | 4 | ||
| Output Voltage High (VOH) | VOH | 4.998 | V | RL = 100kΩ to - VS | 4 | ||
| Output Voltage High (VOH) | VOH | 4.994 | V | RL = 10kΩ to - VS | 4 | ||
| Output Voltage Low (VOL) | VOL | 2 | mV | RL = 100kΩ to + VS | 4 | ||
| Output Voltage Low (VOL) | VOL | 5 | mV | RL = 10kΩ to + VS | 4 | ||
| Short Circuit Limit (ISC) | ISC | 60 | mA | RL =10Ω to - VS | 4 | ||
| Output Current (IO) | IO | 65 | mA | 4 | |||
| Power Supply Rejection Ratio (PSRR) | PSRR | 115 | dB | VS = 2.5V to 5.5V | 4 | ||
| Quiescent Current (IQ) | IQ | 180 | µA | VO = 0V, RL = 0Ω | 4 | ||
| Gain-Bandwidth Product (GBP) | GBP | 1.8 | MHz | G = +100 | 4 | ||
| Slew Rate (SR) | SR | 0.95 | V/µs | RL = 10kΩ | 4 | ||
| Overload Recovery Time | 0.1 | ms | 4 | ||||
| Voltage Noise (en p-p) | en p-p | 0.3 | µVP-P | 0Hz to 10Hz | 4 | ||
| Voltage Noise Density (en) | en | 38 | nV Hz | f = 1kHz | 4 | ||
| Package Thermal Resistance SOP-8 (θJA) | θJA | 125 | °C/W | TA=+25℃ | 3 |
CAD (KiCad official)
- Symbol:
HX8552AIDRG - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hx8552aidrg-etched.step/hx8552aidrg-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hx8552aidrg.step/hx8552aidrg.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: HANSCHIP semiconductor datasheet (14 pp, sha256
349e7074a558e915, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).