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HX83088-S

ZHHXDZ · RS-485 / RS-422 ICs · SOP-8

HX83088-S from ZHHXDZ, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver data output; per the receiver truth table it is high when A-B is -50 mV or more, low when A-B is -200 mV or less, and high-impedance when RE is high and DE is high.
2 RE input Receiver output enable, active low: the receiver is enabled when RE is low and RO goes high-impedance when RE is high (inferred from the truth table; the source text for this pin is partly garbled).
3 DE input Driver output enable, active high: when DE is high the driver drives A and B according to DI, and when DE is low A and B are high-impedance.
4 DI input Driver data input: with DE high, DI high drives A high and B low, and DI low drives A low and B high.
5 GND power_in Ground reference for the device; all voltages are referenced to ground.
6 A bidirectional Non-inverting driver output and receiver input bus terminal, rated ESD ±15 kV (HBM) on A/B; receiver input impedance is 1/8 unit load (RIN 96 kΩ minimum).
7 B bidirectional Inverting driver output and receiver input bus terminal, rated ESD ±15 kV (HBM) on A/B; receiver input impedance is 1/8 unit load (RIN 96 kΩ minimum).
8 VCC power_in Power supply, 4.5 V to 5.5 V (5 V nominal); absolute maximum is 6.0 V.

Key specifications

Parameter Value
Manufacturer ZHHXDZ
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.5 6 V 2
Drive output voltage / receive input voltage A,B -7 12 V 2
Control input voltage DE,RE 6 V 2
Drive input voltage DI 6 V 2
Storage temperature range TSTG -55 150 °C 2
Operating temperature range TOP -40 85 °C 2
Maximum operating temperature range TMOP -55 125 °C 2
Power dissipation PD 470 mW 2
Solder temperature TL 300 °C 10 seconds 2
Working voltage range VCC 4.5 5.5 V Vcc=5V±5%, TA=25°C 2
Driver differential output (no load) VOD1 5 V 2
Driver differential output (with load) VOD2 1.5 V R=54Ω or R=27Ω, Figure 1 2
Change in magnitude of driver differential output voltage ΔVOD 0.2 V R=54Ω or R=27Ω, Figure 1 2
Change in magnitude of driver common-mode output voltage ΔVOC 0.2 V 2
Input high voltage VIH 2 V DE, RE, DI 2
Input low voltage VIL 0.8 V DE, RE, DI 2
Input current IIN1 -2 2 uA DE, RE, DI 2
Input current (A, B) IIN2 40 90 uA DE=0V, Vcc=5V 2
Input current (A, B) IIN2 60 100 uA VIN=0V 2
Receiver differential input threshold voltage VTH -200 -50 mV -7V ≤ VCM ≤ +12V 2
Receiver differential input threshold voltage change ΔVTH 25 mV 2
Receiver output high level VOH 4 V IO=-8mA 2
Receiver output low level VOL 0.4 V IO=8mA 2
Receiver output leakage (tri-state) IOZR 1 uA 0.4V ≤ Vo ≤ 2.4V 2
Receiver input impedance RIN 96 kΩ -7V ≤ VCM ≤ +12V 2
No load operating current ICC 480 600 uA DE = Vcc, RE=DI=GND or Vcc 2
No load operating current ICC 450 600 uA DE = GND, RE=DI=GND or Vcc 2
Receiver output short-circuit current IOSR 95 mA 0V ≤ VRO ≤ 2
ESD protection, human body model ESD -15 15 kV Between A/B, human body model 2
Driver input to output propagation delay (low to high) tDPLH 60 ns RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 2
Driver input to output propagation delay (high to low) tDPHL 60 ns RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 2
Driver output offset tDPLH, tDPHL -2.5 ns RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 2
Driver differential output skew tDSKEW -10 10 ns 2
Driver enable to output high tDZH 150 ns CL=100pF, Figure 4,6, S2 closed 2
Driver enable to output low tDZL 150 ns CL=100pF, Figure 4,6, S1 closed 2
Driver high to off tDLZ 100 ns CL=15pF, Figure 4,6, S1 closed 2
Driver low to off tDHZ 100 ns CL=15pF, Figure 4,6, S2 closed 2
Receiver input to output propagation delay (low to high) tRPLH 150 ns /VID/ ≥2.0V; rise/fall time ≤15 ns, Figure 7,9 2
Receiver input to output propagation delay (high to low) tRPHL 150 ns /VID/ ≥2.0V; rise/fall time ≤15 ns, Figure 7,9 2
Receiver differential offset (skew) tRSKEW -10 0 10 ns 2
Receiver enable to output low tRZL 20 50 ns CL=100pF, Figure 2,8 2
Receiver enable to output high tRZH 20 50 ns CL=100pF, Figure 2,8 2
Receiver from low to off tRLZ 20 50 ns CL=100pF, Figure 2,8 2
Receiver from high to off tRHZ 20 50 ns CL=100pF, Figure 2,8 2
Maximum data speed fMAX 10 Mbps 3

CAD (KiCad official)

  • Symbol: HX83088-S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hx83088-s-etched.step / hx83088-s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx83088-s.step / hx83088-s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ZHHXDZ datasheet (4 pp, sha256 3b87b722d113dbfa, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF