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HX7550-1PKRG

HANSCHIP semiconductor · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89

HX7550-1PKRG from HANSCHIP semiconductor, in a SOT-89. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin (地), the reference for the regulator.
2 VIN power_in Input pin; the input voltage must not exceed 30 V (absolute maximum supply voltage -0.3 to +30 V).
3 VOUT power_out Regulated output pin, rated for output current up to 100 mA (minimum 70 mA at VIN=VOUT+2V; 100 mA for the 5.0 V version the minimum is 100 mA).

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOT-89
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
输入电压 (Input voltage) VIN 30 V 5
输出电压 (Output voltage) VOUT 4.9 5 5.1 V VIN=VOUT+2V, IOUT=10mA 5
输出电流 (Output current) IOUT 100 150 mA VIN=VOUT+2V 5
负载调节率 (Load regulation) △VOUT 25 60 mV VIN=VOUT+2V, 1mA ≤ IOUT ≤ 50mA 5
Dropout 电压 (Dropout voltage) VDIF 2 4 mV IOUT=1mA, △Vo=2% 5
静态电流 (Quiescent current) ISS 2 3 uA 无负载 (no load) 5
输入电压调节率 (Input voltage regulation) 0.2 %/V Vo+1V≤VIN≤30V, IOUT=1mA 5
电源供应电压 (Supply voltage, absolute max) -0.3 30 V 3
工作环境温度 (Operating ambient temperature) -40 85 ℃ 3
储存温度范围 (Storage temperature range) -45 140 ℃ 3
引脚温度 (Lead temperature, soldering) 245 ℃ Soldering 10 s 3
功耗限值 (Power dissipation limit) PD 0.5 W SOT-89 package, as stated in usage note example 6
输出电容 (Output capacitor to GND) 2.2 uF Required output capacitor, per usage notes 6
输入/输出电容 (Recommended input/output polarized capacitor) 10 uF Recommended at VIN and VOUT, placed close to pins 6

CAD (KiCad official)

  • Symbol: HX7550-1PKRG
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89 (KiCad packages3D, STEP)
  • 3D model files: hx7550-1pkrg-etched.step / hx7550-1pkrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx7550-1pkrg.step / hx7550-1pkrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (10 pp, sha256 a83947423f60ac82, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF