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Contents

README

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HX7133-1PKRG

HANSCHIP semiconductor · Voltage Regulators - Linear, Low Drop Out (LDO) Regulators · SOT-89-3

HX7133-1PKRG from HANSCHIP semiconductor, in a SOT-89-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin, listed in the datasheet pin table as 地 (ground) with no further electrical limits stated.
2 VIN power_in Input pin; the absolute maximum supply voltage is 30 V (-0.3 to +30 V), and regulation is specified with VIN = VOUT + 2 V.
3 VOUT power_out Regulated output pin, rated for a maximum output current of 100 mA, and the datasheet requires an output capacitor greater than 2.2 uF to ground.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOT-89-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
输出电压 (Output voltage), 7133-1 +3.3 V VOUT 3.234 3.3 3.366 V VIN=VOUT+2V, IOUT=10mA 4
输出电流 (Output current) IOUT 70 100 mA VIN=VOUT+2V 4
负载调节率 (Load regulation) ΔVOUT 25 60 mV VIN=VOUT+2V, 1mA ≤ IOUT ≤ 50mA 4
Dropout 电压 (Dropout voltage) VDIF 2 4 mV IOUT=1mA, △Vo=2% 4
静态电流 (Quiescent current) ISS 2 3 uA 无负载 (no load) 4
输入电压调节率 (Line regulation) ΔVOUT/(ΔVIN × VOUT) 0.2 %/V Vo+1V≤VIN≤30V, IOUT=1mA 4
输出电压温度系数 (Temperature coefficient) ΔVOUT/(ΔTa × VOUT) 100 ppm/℃ IOUT=10mA, -40℃<Ta<85℃ 4
输入电压 (Input voltage) VIN 30 V 4
电源供应电压 (Supply voltage) VIN -0.3 30 V 3
工作环境温度 (Operating ambient temperature) Ta -40 85 ℃ 3
储存温度范围 (Storage temperature) Tstg -45 140 ℃ 3
引脚温度(焊接 10s) (Lead soldering temperature, 10 s) 245 ℃ 焊接 10s (soldering 10 s) 3
热阻 θJA, SOT-89 (Thermal resistance, junction to ambient) θJA 200 ℃/W 假设无环境气流、五散热片 (as printed) 3
功耗 PD, SOT-89 (Power dissipation) PD 0.5 W Ta=25℃ 3

CAD (KiCad official)

  • Symbol: HX7133-1PKRG
  • Footprint: Package_TO_SOT_SMD:SOT-89-3
  • 3D model: SOT-89-3 (KiCad packages3D, STEP)
  • 3D model files: hx7133-1pkrg-etched.step / hx7133-1pkrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx7133-1pkrg.step / hx7133-1pkrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (10 pp, sha256 6536487ed3122840, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF