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Contents

README

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HX65HVD72-S

ZHHXDZ · RS-485 / RS-422 ICs · SOP-8

HX65HVD72-S from ZHHXDZ, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: RO is high when V(A) - V(B) is at or above -50 mV and low when V(A) - V(B) is at or below -200 mV, per the receiver truth table.
2 RE input Receiver output enable: RO is enabled when RE is low and the receiver is turned off (RO high impedance) when RE is high; when RE is high and DE is low the whole chip is shut down.
3 DE input Driver output enable: when DE is high the driver output is enabled, and when DE is low the driver turns off and its outputs enter a high-resistance state.
4 DI input Driver data input: when DI is high the bus output A goes high and B goes low, and when DI is low A goes low and B goes high (active only while DE is high).
5 GND power_in Ground reference for the device.
6 A bidirectional Non-inverting bus terminal shared by the driver output and the receiver input; it connects the driver output to the bus and the bus to the receiver input.
7 B bidirectional Inverting bus terminal shared by the driver output and the receiver input; it connects the inverted driver output to the bus and the bus to the receiver input.
8 VCC power_in Supply pin for the 3.3 V / 5 V supply; the datasheet gives an absolute maximum of +6.0 V and DC characteristics at VCC = 3.3 V ±5%.

Key specifications

Parameter Value
Manufacturer ZHHXDZ
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -0.3 6 V 2
Control input voltage (DE, RE) DE,RE -0.3 6 V 2
Driver input voltage DI -0.3 6 V 2
Driver output / receiver input voltage (bus pins) A,B -8 13 V 2
Storage temperature TSTG -65 150 ℃ 2
Operating temperature TOP -40 125 ℃ 2
Power dissipation 471 mW SOP-8 (above 70 ℃) 2
Soldering temperature 300 ℃ 10 seconds 2
Supply voltage tolerance VCC -5 5 % VCC=+3.3V±5%, TA=25℃ 2
Input high voltage (DE, DI, RE) VIH1 2 V DE,DI,RE 2
Input low voltage (DE, DI, RE) VIL1 0.8 V DE,DI,RE 2
Receiver differential threshold voltage VTH -200 -75 mV -7V≤VCM≤+12V 2
Receiver output low voltage VOL 0.4 V IO=4mA, VID=-1V 2
Receiver output short-circuit current IOSR -7 7 mA 0V≤VO≤VCC 2
Receiver input impedance RIN 96 kΩ -7V≤VCM≤+12V 2
Shutdown supply current 10 µA DE=GND, RE=VCC 2
ESD (human body model), pins A and B -15 15 kV Pin A, Pin B, human body model 2
ESD (human body model), other pins -4 4 kV Other pins, human body model 2
ESD (IEC 61000-4-2 contact discharge) -12 12 kV IEC61000-4-2 contact discharge 4
Shutdown supply current (typical) 1.8 µA RE high, DE low (shutdown) 4

CAD (KiCad official)

  • Symbol: HX65HVD72-S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hx65hvd72-s-etched.step / hx65hvd72-s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx65hvd72-s.step / hx65hvd72-s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ZHHXDZ datasheet (5 pp, sha256 b1db326a30dcbcf8, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF