component
HX65176-S
Public Made by Adomby adom
ZHHXDZ RS-485 / RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownHX65176-S
ZHHXDZ · RS-485 / RS-422 ICs · SOP-8
HX65176-S from ZHHXDZ, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver data output; driven high when A-B is at or above -50 mV, low when A-B is at or below -200 mV, and high for open or shorted receiver inputs (fail-safe). |
| 2 | RE | input | Receiver enable, active low: the receiver is enabled when RE is low and its output goes to high impedance when RE is high (per the truth table, RE high with DE low puts RO in high-impedance state). |
| 3 | DE | input | Driver enable, active high: the driver is enabled when DE is high and A/B go to high impedance when DE is low; the datasheet's truth table shows DE low with RE low places the chip in receive mode. |
| 4 | DI | input | Driver data input; sets the differential output on A/B when the driver is enabled (DI high gives A high / B low, DI low gives A low / B high). |
| 5 | GND | power_in | Ground reference for the device; all voltages are referenced to ground. |
| 6 | A | bidirectional | Driver differential output and receiver differential input (non-inverting bus line); ESD protected to ±15 kV human body model. |
| 7 | B | bidirectional | Driver differential output and receiver differential input (inverting bus line); ESD protected to ±15 kV human body model. |
| 8 | Vcc | power_in | Power supply, 5 V nominal; working voltage range 4.5 V to 5.5 V (5 V ±5%). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ZHHXDZ |
| Package | SOP-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working voltage range | VCC | 4.5 | 5.5 | V | Vcc=5V±5%, TA=25℃ | 2 | |
| Driver differential output (no load) | VOD1 | 5 | V | no load | 2 | ||
| Driver differential output (with load) | VOD2 | 1.5 | V | R=54Ω or R=27Ω Figure 1 | 2 | ||
| Change in driver differential output magnitude | ΔVOD | 0.2 | V | R=54Ω or R=27Ω Figure 1 | 2 | ||
| Driver common mode output voltage | VOC | 3 | V | Vcc=5V±5%, TA=25℃ | 2 | ||
| Change in driver common mode output voltage | ΔVOC | 0.2 | V | Vcc=5V±5%, TA=25℃ | 2 | ||
| Input high voltage | VIH | 2 | V | DE, RE, DI | 2 | ||
| Input low voltage | VIL | 0.8 | V | DE, RE, DI | 2 | ||
| Input current (DE, RE, DI) | IIN1 | -2 | 2 | uA | DE, RE, DI | 2 | |
| Input current (A, B), DE=0V | IIN2 | 40 | 90 | uA | DE=0V, Vcc=5V | 2 | |
| Input current (A, B), VIN=0V | IIN2 | 60 | 100 | uA | VIN=0V | 2 | |
| Receiver differential input threshold voltage | VTH | -200 | -50 | mV | -7V ≤ VCM ≤ +12V | 2 | |
| Receiver differential input threshold voltage change | ΔVTH | 25 | mV | 2 | |||
| Receiver output high level | VOH | 4 | V | IO=-8mA | 2 | ||
| Receiver output low level | VOL | 0.4 | V | IO=8mA | 2 | ||
| Receiver output leakage current (tri-state) | IOZR | 1 | uA | 0.4V ≤ Vo ≤ 2.4V | 2 | ||
| Receiver input impedance | RIN | 96 | kΩ | -7V ≤ VCM ≤ +12V | 2 | ||
| No load operating current | ICC | 480 | 600 | uA | no load; DE = Vcc; RE=DI=GND or Vcc | 2 | |
| No load operating current | ICC | 450 | 600 | uA | no load; DE = GND; RE=DI=GND or Vcc | 2 | |
| Receiver output short-circuit current | IOSR | 95 | mA | 0V ≤ VRO ≤ VCC | 2 | ||
| ESD protection, A/B human body model | -15 | 15 | kV | Between A/B, human body mode | 2 | ||
| Driver input to output delay (tDPLH) | tDPLH | 60 | nS | RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 | 2 | ||
| Driver input to output delay (tDPHL) | tDPHL | 60 | nS | RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 | 2 | ||
| Driver output skew | tDSKEW | -10 | 10 | nS | 2 | ||
| Drive rise time | tDR | 25 | nS | RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 | 2 | ||
| Drive fall time | tDF | 25 | nS | RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 | 2 | ||
| Driver enables high output | tDZH | 150 | nS | CL=100pF, Figure 4,6, S2 closed | 2 | ||
| Driver enables output to be low | tDZL | 150 | nS | CL=100pF, Figure 4,6, S1 closed | 2 | ||
| Drive from high to off | tDHZ | 100 | nS | CL=15pF, Figure 4,6, S2 closed | 2 | ||
| Drive from low to off | tDLZ | 100 | nS | CL=15pF, Figure 4,6, S1 closed | 2 | ||
| Receiver input to output delay (tRPLH) | tRPLH | 150 | nS | /VID/ ≥ 2.0V; rising and falling time ≤ 15nS, Figure 7,9 | 2 | ||
| Receiver input to output delay (tRPHL) | tRPHL | 150 | nS | /VID/ ≥ 2.0V; rising and falling time ≤ 15nS, Figure 7,9 | 2 | ||
| Differential receiver offset | tRSKEW | -10 | 0 | 10 | nS | 2 | |
| Receiver enable to output low | tRZL | 20 | 50 | nS | CL=100pF, Figure 2,8 | 2 | |
| Receiver enable to output high | tRZH | 20 | 50 | nS | CL=100pF, Figure 2,8 | 2 | |
| Receiver from low to off | tRLZ | 20 | 50 | nS | CL=100pF, Figure 2,8 | 2 | |
| Receiver from high to off | tRHZ | 20 | 50 | nS | CL=100pF, Figure 2,8 | 2 | |
| Maximum data speed | fMAX | 10 | Mbps | 3 | |||
| Supply voltage | VCC | 6 | V | 2 | |||
| Control input voltage (DE, RE) | DE,RE | 6 | V | 2 | |||
| Driver input voltage (DI) | DI | 6 | V | 2 | |||
| Drive output voltage / receive input voltage (A, B) | A,B | -7 | 12 | V | 2 | ||
| Receiving output voltage (RO) | RO | -0.3 | V | maximum printed as VCC+0.3 | 2 | ||
| Storage temperature range | TSTG | -55 | 150 | ℃ | 2 | ||
| Operating temperature range | TOP | -40 | 85 | ℃ | 2 | ||
| Maximum operating temperature range | TMOP | -55 | 125 | ℃ | 2 | ||
| Power dissipation | PD | 470 | mW | SOP-8 (+70℃ or above) | 2 | ||
| Solder temperature | TL | 300 | ℃ | 10 seconds | 2 |
CAD (KiCad official)
- Symbol:
HX65176-S - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hx65176-s-etched.step/hx65176-s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hx65176-s.step/hx65176-s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ZHHXDZ datasheet (4 pp, sha256
577f43375f690c76, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).