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HX483-S

ZHHXDZ · RS-485 / RS-422 ICs · SOP-8

HX483-S from ZHHXDZ, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver data output; per the receiver truth table it is high when A-B is -50 mV or an open/short circuit at the input, and low when A-B is -200 mV.
2 RE input Receiver output enable; the receiver is active when RE is low and RO goes to high impedance (Z) when RE is high.
3 DE input Driver output enable; the driver is active when DE is high and A/B go to high impedance (Z) when DE is low.
4 DI input Driver data input; with DE high, DI high drives A high and B low, and DI low drives A low and B high.
5 GND power_in Ground reference for the device.
6 A bidirectional Driver data output and receiver data input (non-inverting bus line A); rated for ±15 kV HBM ESD protection.
7 B bidirectional Driver data output and receiver data input (inverting bus line B); rated for ±15 kV HBM ESD protection.
8 Vcc power_in Power supply; the working voltage range is 4.5 V to 5.5 V (5 V ±5%).

Key specifications

Parameter Value
Manufacturer ZHHXDZ
Package SOP-8
Category Interface
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage range VCC 4.5 5.5 V 2
Driver differential output VOD1 1.5 V R=54Ω or R=27Ω, Figure 1 2
Change in magnitude of driver differential output ΔVOD 0.2 V R=54Ω or R=27Ω, Figure 1; DI changes 2
Driver common-mode output voltage VOC 3 V Figure 1 2
Change in common-mode output voltage ΔVOC 0.2 V Figure 1; DI changes 2
Input high voltage VIH 2 V DE, RE, DI 2
Input low voltage VIL 0.8 V DE, RE, DI 2
Input current (DE, RE, DI) IIN1 -2 2 uA 2
Input current (A, B) IIN2 90 uA DE=0V, Vcc=5V 2
Receiver differential input threshold voltage VTH -200 -50 mV -7V ≤ VCM ≤ +12V 2
Receiver differential input threshold hysteresis change ΔVTH 25 mV 2
Receiver output high voltage VOH 4 V IO=-8mA 2
Receiver output low voltage VOL 0.4 V IO=8mA 2
Tri-state receiver output leakage current IOZR -1 1 uA 0.4V ≤ VO ≤ 2.4V 2
Receiver input resistance RIN 96 kΩ -7V ≤ VCM ≤ +12V 2
No-load operating current ICC 480 600 uA DE = Vcc; RE=DI=GND or Vcc 2
No-load operating current ICC 450 600 uA DE = GND; RE=DI=GND or Vcc 2
Receiver output short-circuit current IOSR 95 mA 0V ≤ VRO ≤ VCC 2
ESD protection between A/B (human body model) ESD -15 15 kV Between A/B, human body model 2
Driver output short-circuit current IOD 100 mA Short circuit current between A/B 2
Drive input to output propagation delay (low-to-high) tDPLH 250 1000 ns RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 2
Drive input to output propagation delay (high-to-low) tDPHL 250 1000 ns RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 2
Driver output skew tDSKEW -100 -3 100 ns /tDPLH, tDPHL/, RDIFF=50Ω, CL1=CL2=100pF 2
Driver enable to output high tDZH 2500 ns CL=100pF, Figure 4,6, S2 closed 2
Driver enable to output low tDZL 2500 ns CL=100pF, Figure 4,6, S1 closed 2
Receiver input to output (low-to-high) tRPLH 200 ns /VID/ ≥ 2.0V; rising and falling time ≤ 15ns, Figure 7,9 2
Receiver input to output (high-to-low) tRPHL 200 ns /VID/ ≥ 2.0V; rising and falling time ≤ 15ns, Figure 7,9 2
Differential receiver offset tRSKEW -30 30 ns 2
Receiver enable to output high / off tRHZ 50 ns CL=100pF, Figure 2,8 2
Receiver enable to output low / off tRLZ 50 ns CL=100pF, Figure 2,8 2
Supply voltage VCC -0.5 6 V 2
Control input voltage DE, RE -0.5 6 V 2
Drive input voltage DI -0.5 6 V 2
Drive output voltage / receive input voltage A, B -7 12 V 2
Receive output voltage RO -0.3 V Printed max is VCC+0.3 V 2
Storage temperature range TSTG -55 150 ℃ 2
Operating temperature range TOP -40 85 ℃ 2
Maximum operating temperature range TMOP -55 125 ℃ 2
Power dissipation (SOP-8) PD 470 mW SOP-8 (+70℃ or above) 2
Solder temperature 300 ℃ 10 seconds 2

CAD (KiCad official)

  • Symbol: HX483-S
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hx483-s-etched.step / hx483-s-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx483-s.step / hx483-s.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: ZHHXDZ datasheet (4 pp, sha256 e36b0534f81f31f9, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF