component
HX4082-S
Public Made by Adomby adom
ZHHXDZ RS-485 / RS-422 ICs, SOP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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| docs | 17d ago |
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| hx4082-s-etched.step | 17d ago |
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| hx4082-s-hero.overlay.json | 17d ago |
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HX4082-S
ZHHXDZ · RS-485 / RS-422 ICs · SOP-8
HX4082-S from ZHHXDZ, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO | output | Receiver data output, which is driven low or high according to the receiver truth table and is high-impedance when RE is high. |
| 2 | RE | input | Receiver enable: RE low enables the receiver output RO, and RE high puts RO into the high-impedance (Z) state. |
| 3 | DE | input | Driver enable: DE high enables the driver to transmit (driver truth table), and DE low places the chip in receive mode with the driver outputs at high impedance. |
| 4 | DI | input | Driver data input: a high DI drives A high and B low, and a low DI drives A low and B high when DE is high. |
| 5 | GND | power_in | Ground reference; the datasheet states that all voltages are referenced to ground. |
| 6 | A | bidirectional | Driver differential output and receiver differential input (A side of the RS-485/RS-422 bus), rated ±15 kV ESD (HBM) between A and B. |
| 7 | B | bidirectional | Driver differential output and receiver differential input (B side of the RS-485/RS-422 bus), rated ±15 kV ESD (HBM) between A and B. |
| 8 | VCC | power_in | Power supply; the datasheet gives a working voltage range of 4.5 V to 5.5 V (5 V nominal) and an absolute maximum of 6.0 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | ZHHXDZ |
| Package | SOP-8 |
| Category | Interface |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage | VCC | -0.3 | 6 | V | 2 | ||
| Control input voltage | DE,RE | -0.3 | 6 | V | 2 | ||
| Drive input voltage | DI | -0.3 | 6 | V | 2 | ||
| Drive output voltage / receive input voltage | A,B | -7 | 12 | V | 2 | ||
| Receiving output voltage | RO | -0.5 | V | Maximum printed as VCC+0.3, not numeric | 2 | ||
| Storage temperature range | TSTG | -55 | 150 | ℃ | 2 | ||
| Operating temperature range | TOP | -40 | 85 | ℃ | 2 | ||
| Maximum operating temperature range (label as printed TMOP) | TMOP | -55 | 125 | ℃ | 2 | ||
| Power dissipation | PD | 470 | mW | SOP-8 (+70℃ or above) | 2 | ||
| Solder temperature | TL | 300 | ℃ | 10 seconds | 2 | ||
| Working voltage range | Vcc | 4.5 | 5.5 | V | Vcc=5V±5%, TA=25℃ | 2 | |
| Driver differential output (no load) | VOD1 | 5 | V | No load | 2 | ||
| Driver differential output | VOD2 | 1.5 | V | R=54Ω or R=27Ω, Figure 1 | 2 | ||
| Change in magnitude of differential output voltage | ΔVOD | 0.2 | V | 2 | |||
| Driver common mode output voltage | VOC | 1 | 3 | V | 2 | ||
| Change in magnitude of common mode output voltage | ΔVOC | 0.2 | V | 2 | |||
| Input high voltage | VIH | 2 | V | DE,RE,DI | 2 | ||
| Input low voltage | VIL | 0.8 | V | DE,RE,DI | 2 | ||
| Input current | IIN1 | -2 | 2 | uA | DE,RE,DI | 2 | |
| Input current (A, B) | IIN2 | 40 | 90 | uA | DE=0V, Vcc=5V, VIN=5V | 2 | |
| Input current (A, B) | IIN2 | 60 | 100 | uA | DE=0V, Vcc=5V, VIN=0V | 2 | |
| Receiver differential input threshold voltage | VTH | -200 | -50 | mV | -7V ≤ VCM ≤ +12V | 2 | |
| Receiver output high level | VOH | 4 | V | IO=-8mA | 2 | ||
| Receiver output low level | VOL | 0.4 | V | IO=8mA | 2 | ||
| Receiver output leakage (tri-state) | IOZR | 1 | uA | 0.4V ≤ Vo ≤ 2.4V | 2 | ||
| No load operating current | ICC | 480 | 600 | uA | -7V ≤ VCM ≤ +12V, RE=DI=GND or DE=Vcc | 2 | |
| Operating current | ICC | 450 | 600 | uA | Vcc, DE=GND | 2 | |
| Receiver output short-circuit current | IOSR | 95 | mA | 0V ≤ VRO ≤ (remainder of condition not legible) | 2 | ||
| ESD protection, human body model | -15 | 15 | kV | Between A/B, human body mode | 2 | ||
| Driver driver input to output propagation delay (low-to-high) | tDPLH | 250 | 1000 | nS | RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 | 2 | |
| Driver input to output propagation delay (high-to-low) | tDPHL | 250 | 1000 | nS | RDIFF=50Ω, CL1=CL2=100pF, Figure 3,5 | 2 | |
| Driver output offset /tDPLH, tDPHL/ | tDSKEW | -100 | 100 | nS | RDIFF=50Ω, CL1=CL2=100pF | 2 | |
| Drive up and down time | tDR / tDF | 200 | 750 | nS | RDIFF=50Ω, CL1=CL2=100pF | 2 | |
| Driver enables high output | tDZH | 2500 | nS | CL=100pF, Figure 4,6, S2 closed | 2 | ||
| Driver enables output to be low | tDZL | 2500 | nS | CL=100pF, Figure 4,6, S1 closed | 2 | ||
| Drive from low to off | tDLZ | 100 | nS | CL=15pF, Figure 4,6, S1 closed | 2 | ||
| Drive from high to off | tDHZ | 100 | nS | CL=15pF, Figure 4,6, S2 closed | 2 | ||
| Receiver input to output (low-to-high) | tRPLH | 200 | nS | /VID/ ≥ 2.0V; rising and falling time ≤ 15nS, Figure 7,9 | 2 | ||
| Receiver input to output (high-to-low) | tRPHL | 200 | nS | /VID/ ≥ 2.0V; rising and falling time ≤ 15nS, Figure 7,9 | 2 | ||
| Differential receiver offset /tRPLH, tRPHL/ | tRSKEW | -30 | 30 | nS | 2 | ||
| Receiver enable to output low (S1 closed) | tRZL | 20 | 50 | nS | CL=100pF, Figure 2,8 | 2 | |
| Receiver enable to output high (S2 closed) | tRZH | 20 | 50 | nS | CL=100pF, Figure 2,8 | 2 | |
| Receiver from low to off (S1 closed) | tRLZ | 20 | 50 | nS | CL=100pF, Figure 2,8 | 2 | |
| Receiver from high to off (S2 closed) | tRHZ | 20 | 50 | nS | CL=100pF, Figure 2,8 | 2 | |
| Maximum data speed | fMAX | 250 | 500 | Mbps | 3 | ||
| Driver output short-circuit current | IOD | 100 | mA | Short circuit current between A/B | 2 | ||
| Receiver differential input impedance | RIN | 96 | kΩ | 2 | |||
| Change in differential receiver threshold (hysteresis) | ΔVTH | 25 | mV | 2 |
CAD (KiCad official)
- Symbol:
HX4082-S - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOP-8 (KiCad packages3D, STEP)
- 3D model files:
hx4082-s-etched.step/hx4082-s-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);hx4082-s.step/hx4082-s.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: ZHHXDZ datasheet (4 pp, sha256
cec6d0a583acd3dc, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).