# HX3400X

**HX hengjiaxing** · MOSFETs · SOT-23-3

HX3400X from HX hengjiaxing, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | GATE | input | Gate of the N-channel MOSFET; gate-source voltage limited to ±12 V, with threshold Vth(GS) 0.7 V min, 0.9 V typ, 1.4 V max at ID=250 uA. |
| 2 | SOURCE | passive | Source of the N-channel MOSFET; continuous drain current is rated 5.8 A and body diode forward current is 2.9 A max. |
| 3 | DRAIN | passive | Drain of the N-channel MOSFET; drain-source voltage is rated 30 V and RDS(ON) is 41 mΩ max at VGS=10 V, ID=2.9 A. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HX hengjiaxing |
| Package | SOT-23-3 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Drain-Source Breakdown Voltage | V(BR)DSS | 30 |  |  | V | VGS=0V,ID=250uA | 1 |
| Gate-Threshold Voltage | Vth(GS) | 0.7 | 0.9 | 1.4 | V | VDS= VGS, ID=250 uA | 1 |
| Gate-body Leakage | IGSS | -100 |  | 100 | nA | VDS=0V, VGS=±12V | 1 |
| Zero Gate Voltage Drain Current | IDSS |  |  | 1 | uA | VDS=30V, VGS=0V | 1 |
| Drain-Source On-Resistance | RDS(ON) |  |  | 59 | mΩ | VGS=2.5V, ID=4A | 1 |
| Drain-Source On-Resistance | RDS(ON) |  |  | 45 | mΩ | VGS=4.5V, ID=2.9A | 1 |
| Drain-Source On-Resistance | RDS(ON) |  |  | 41 | mΩ | VGS=10V, ID=2.9A | 1 |
| Diode Forward Voltage | VSD |  | 0.75 | 1.2 | V | VGS=0V, ID=2.9A | 1 |
| Diode Forward Current | Is |  |  | 2.9 | A |  | 1 |
| Drain-Source Voltage | VDS |  |  | 30 | V |  | 1 |
| Gate-Source Voltage | VGS | -12 |  | 12 | V |  | 1 |
| Drain Current | ID |  |  | 5.8 | A |  | 1 |
| Power Dissipation | PD |  |  | 1.4 | W |  | 1 |
| Junction Temperature | Tj | -55 |  | 150 | ℃ |  | 1 |
| Storage Temperature | Tstg | -55 |  | 150 | ℃ |  | 1 |

## CAD (KiCad official)

- Symbol: `HX3400X`
- Footprint: `Package_TO_SOT_SMD:SOT-23-3`
- 3D model: SOT-23-3 (KiCad packages3D, STEP)
- 3D model files: `hx3400x-etched.step` / `hx3400x-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hx3400x.step` / `hx3400x.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HX hengjiaxing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590238321508188160) (2 pp, sha256 `56fd649c776f352a`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hx3400x-datasheet.pdf)