# HX3400B

**HX hengjiaxing** · MOSFETs · SOT-23

HX3400B from HX hengjiaxing, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | G | input | Gate terminal of the MOSFET, with a gate-source voltage rating of ±12 V (VGS) per the absolute maximum ratings. |
| 2 | S | passive | Source terminal of the MOSFET; the datasheet gives no specific limit for this pin beyond the pin assignment and schematic. |
| 3 | D | passive | Drain terminal of the MOSFET, rated for a drain-source voltage of 30 V (VDS) and a continuous drain current of 5.8 A at Tj=125℃. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | HX hengjiaxing |
| Package | SOT-23 |
| Category | Transistors/Thyristors |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Gate threshold voltage | VGS(th) | 0.45 | 0.62 | 0.85 | V | VDS=VGS, ID=250µA | 2 |
| Gate-body leakage | IGSS | -100 |  | 100 | nA | VDS=0V, VGS=±12V | 2 |
| Drain-source breakdown voltage | BVDSS | 30 |  |  | V | VGS=0V, ID=250µA | 2 |
| Zero gate voltage drain current | IDSS |  |  | 1 | µA | VDS=30V, VGS=0V | 2 |
| Drain-source on-state resistance | RDS(ON) |  | 24 | 35 | mΩ | VGS=4.5V, ID=5A | 2 |
| Drain-source on-state resistance | RDS(ON) |  | 35 | 45 | mΩ | VGS=2.5V, ID=4A | 2 |
| Diode forward voltage | VSD |  | 0.76 | 1.16 | V | VGS=0V, Is=1A | 2 |
| Forward transconductance | gfs |  | 33 |  | S | VGS=5V, ID=5.8A | 2 |
| Drain-source voltage | VDS |  |  | 30 | V |  | 1 |
| Gate-source voltage | VGS | -12 |  | 12 | V |  | 1 |
| Drain current-continuous | ID |  |  | 5.8 | A | @Tj=125℃ | 1 |
| Pulsed drain current | IDM |  |  | 30 | A |  | 1 |
| Drain-source diode forward current | IS |  |  | 2 | A |  | 1 |
| Maximum power dissipation | PD |  |  | 1.4 | W |  | 1 |
| Operating junction temperature range | Tj | -55 |  | 150 | ℃ |  | 1 |
| Thermal resistance junction-to-ambient | RthJA |  | 100 |  | ℃/W |  | 2 |

## CAD (KiCad official)

- Symbol: `HX3400B`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `hx3400b-etched.step` / `hx3400b-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `hx3400b.step` / `hx3400b.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [HX hengjiaxing datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590237217152004096) (5 pp, sha256 `155ff14813319a0c`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/hx3400b-datasheet.pdf)