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HX24LC256BDRG

Public Made by Adom

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HANSCHIP semiconductor EEPROM, SOIC-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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3D Model

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Symbol & Footprint

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Datasheet

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Contents

README

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HX24LC256BDRG

HANSCHIP semiconductor · EEPROM · SOIC-8

HX24LC256BDRG from HANSCHIP semiconductor, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device/page address input A0. Hardwired to VCC or GND to allow up to eight devices on one bus. Internally pulled to GND if left floating with <3 pF board coupling; otherwise tie to GND.
2 A1 input Device/page address input A1. Hardwired to VCC or GND to allow up to eight devices on one bus. Internally pulled to GND if left floating with <3 pF board coupling; otherwise tie to GND.
3 NC unconnected No connect. Leave floating.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Serial data. Bi-directional open-drain data line for the two-wire interface; requires an external pull-up resistor. May be wire-ORed with other open-drain/open-collector devices.
6 SCL input Serial clock input. Positive edge clocks data into the EEPROM; negative edge clocks data out. Up to 1 MHz at VCC = 5 V, 400 kHz at 1.8/2.7/3.3 V.
7 WP input Write protect input. Tie to GND for normal read/write operation; tie to VCC to inhibit all write operations (full-array hardware write protection). Internally pulled to GND when floating if board coupling is <3 pF.
8 VCC power_in Supply voltage, 1.8 V to 5.5 V. Standby current ISB = 3 uA typ. @ 5.5 V.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOIC-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HX24LC256BDRG
  • HX24LC256BDRG4
  • HX24LC256BDRGBPG
  • HX24LC256BDRGBDGKRG

CAD (KiCad official)

  • Symbol: HX24LC256BDRG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: hx24lc256bdrg-etched.step / hx24lc256bdrg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx24lc256bdrg.step / hx24lc256bdrg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (15 pp, sha256 55acea65f891792d, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF