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HX24C64DRG

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HANSCHIP semiconductor EEPROM, SOP-8. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.

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Contents

README

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HX24C64DRG

HANSCHIP semiconductor · EEPROM · SOP-8

HX24C64DRG from HANSCHIP semiconductor, in a SOP-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A0 input Device address input bit 0. Hard-wired by the user to set one of up to eight unique device addresses on a shared two-wire bus. Compared against A0 bit in the device address word.
2 A1 input Device address input bit 1. Hard-wired to set part of the 3-bit device address that identifies this EEPROM on a multi-drop two-wire bus.
3 A2 input Device address input bit 2. Hard-wired to set part of the 3-bit device address. Up to eight HX24C64 devices may share one two-wire bus.
4 GND power_in Ground reference for the device.
5 SDA bidirectional Serial Data. Bi-directional open-drain data line for the two-wire (I2C-compatible) interface; requires an external pull-up resistor to VCC. May be wire-ORed with other open-drain/open-collector devices on the bus. Input capacitance 8 pF typ.
6 SCL input Serial Clock Input. Positive edge clocks data into the EEPROM and negative edge clocks data out. Schmitt-trigger, filtered for noise suppression. Up to 1 MHz at 5V, 400 kHz at 1.8/2.5/2.7V.
7 WP input Write Protect. When tied to GND, normal read/write operations are allowed. When tied to VCC, the entire 64K array is write-protected in hardware.
8 VCC power_in Positive supply. Operating range 1.8V to 5.5V. Read Icc typ 0.4 mA, write Icc typ 2.0 mA at 5V/100 kHz; standby current 2 µA max.

Key specifications

Parameter Value
Manufacturer HANSCHIP semiconductor
Package SOP-8
Category Memory
Pins 8

Ordering variants

Same part, different packaging or reel option.

  • HX24C64DRG
  • HX24C64DRG4
  • HX24C64DRGPG
  • HX24C64DRGDGKRG

CAD (KiCad official)

  • Symbol: HX24C64DRG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOP-8 (KiCad packages3D, STEP)
  • 3D model files: hx24c64drg-etched.step / hx24c64drg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); hx24c64drg.step / hx24c64drg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HANSCHIP semiconductor datasheet (13 pp, sha256 94bde4c4e9bcef51, retrieved 2026-08-17, tier: lcsc)
  • Extractor: ds2sf (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF